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研究生:黃耀霖
研究生(外文):Yao-Lin Huang
論文名稱:射出成型模面感應加熱線圈之設計
論文名稱(外文):The Induction Coil Design Applied for Rapid Surface Heating of Injection Molding
指導教授:黃明賢黃明賢引用關係
指導教授(外文):Ming-Shyan Huang
學位類別:碩士
校院名稱:國立高雄第一科技大學
系所名稱:機械與自動化工程所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:121
中文關鍵詞:感應加熱耦合分析線圈設計快速模具表面加熱。
外文關鍵詞:Coil designCoupling analysisInduction heatingRapid mold surface heating
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本文針對高週波感應加熱使用之加熱線圈進行優化設計,使之應用於射出成型模具表面加熱時,實現快速昇溫、均勻高溫、與擴大均溫範圍的目的,如此,用以解決傳統盤型單層纏繞因鄰近效應(Approximate Effect)與集膚效應(Skin Effect)在被加熱物導體截面橫向和縱向熱分佈不均勻現象。本研究使用射出成型模板為驗證的載具,首先運用ANSYS多重耦合模擬分析技術預測感應加熱的溫度變化歷程,然後應用田口方法結合主成份分析法尋找優化線圈設計之折繞條件與加熱的製程條件。進而在堆疊層數的擴展探討其對熱製程的影響,最後比較優化設計線圈與傳統盤型線圈在100℃表面快速升溫至均溫所需週期時間,及模面溫差5℃時可均溫的範圍之表現。實驗結果顯示:(1) 優化設計線圈在均溫時間僅須3秒,且均溫時溫度由168.3℃提升至190.1℃、,而傳統線圈歷時11秒時溫差仍有38.3℃、(2)優化線圈在50次溫差重現性測試,其溫差低於5℃,說明以190℃為高溫模面加熱控制的可行性、(4)優化設計線圈功率消耗由18.11Kw降低為15.43Kw,在能源消耗節省上較傳統盤型單層纏繞線圈14.8%。
The study aims to investigate the optimized designation of high-frequency electromagnetic induction coils, which are utilized in the rapid mold surface heating of injection mold, in order to realize rapid heating, uniform temperature distribution, and maximized heated area at even temperature. The study is mainly concerned with solving the unbalanced heat distribution of heated target at its cross and deep sections due to the approximate and skin effects most commonly occurring at the use of conventional single layer coil for induction heating. By adopting an injection mold plate the carrier of simulation and experiment, this work first employs the multiple physics coupling analysis technique simulated in the ANSYS software to predict the induction heating temperature profile. Integration of Taguchi method and principal component analysis (PCA) are then developed to search for the optimal design of induction coil and process parameters. The coil layer after optimization is further explored its effect on heating history. Lastly, the optimized induction coil and conventional single layer coil are compared with heating time required to reach 100℃ surface temperature and the maximal heated area at even temperature, defined as 5℃ variation. The experimental results that: (1) the optimized coil requires only 3 seconds to reach uniform temperature distribution and the working temperature raise to 190.1℃, as the conventional single layer coil is 168.3℃ and unable to reach balanced temperature after 11 seconds. (2) For repeatability testing of induction heating to 190℃ with optimized coil, the temperature variation is less then 5℃. (4) The power consumption of the optimized coil is 14.8% less than the conventional one.
摘 要 I
Abstract II
目錄 IV
圖目錄 VIII
表目錄 XII
符號說明 XIV
第 1 章 緒論 1
1.1 前言 1
1.2 快速升溫技術應用於射出成型模具概述 1
1.2.1 模溫機切換控制方式 2
1.2.2 電熱管加熱搭配模溫機方式 2
1.2.3 薄膜電阻加熱方式 2
1.2.4 複合模壁絕熱搭配高壓熱空氣加熱方式 4
1.2.5 高頻率電流加熱方式 5
1.2.6 火焰加熱方式 6
1.2.7 紅外線加熱方式 7
1.2.8 紅外線加熱搭配模面披覆滯熱材加熱方式 7
1.2.9 高週波電磁感應加熱方式 8
1.3 快速升溫技術應用於射出成型模具比較 9
1.4 研究動機與目的 13
1.5 論文架構 14
第 2 章 文獻探討 15
2.1 高頻感應加熱系統應用於射出成型模具探討 15
2.1.1 外置式高週波電磁感應加熱方式 15
2.1.2 外置式高週波電磁感應加熱搭配模面塑膠薄膜貼附滯熱方式 16
2.1.3 置入型腔背後之高週波電磁感應加熱方式 17
2.1.4 置入型腔式高週波電磁感應加熱搭配模面披覆複合材加熱 18
2.2 高頻感應加熱系統對射出成型製品影響探討 18
2.3 高頻感應加熱系統對被加熱物影響探討 20
2.3.1 利用金屬熱傳物理現象做為解決對策 21
2.3.2 利用感應線圈折繞間距控制作為對策 21
2.3.3 利用感應線圈纏繞圈數作為對策 22
2.3.4 利用感應線圈之截面形狀控制作為對策 23
2.3.5 多個線圈中個別通以不同頻率、電流、電壓作為對策 23
2.4 高頻感應加熱求解磁場及熱傳探討 25
2.4.1 高頻感應加熱求解磁場探討 25
2.4.2 高頻感應加熱求解磁熱偶合探討 25
第 3 章 模具表面感應加熱技術之實驗方法與實驗設備 29
3.1 實驗方法流程介紹 29
3.2 線圈折繞控制之治具設計 31
3.2.1 線圈折繞真直度檢測 33
3.2.2 線圈折繞角度檢測 33
3.2.3 線圈折繞之尺寸係數修正檢測 35
3.3 實驗設備 36
3.3.1 實驗用模板設計 37
3.3.2 高週波感應快速加熱系統 39
3.3.3 模溫控制機 41
3.3.4 示波器、差動測試棒、鈎式電流計、功率計 42
3.3.5 紅外線熱影像儀與接觸式溫度計 46
3.3.6 光學投影機 49
第 4 章 模具表面感應加熱技術之實驗規劃與建置 51
4.1 感應線圈幾何模型建置 51
4.2 感應線圈於電腦輔助工程磁熱耦合分析 55
4.2.1 感應線圈設計分析模擬過程條件限定 57
4.2.2 邊界條件設定 58
4.2.3 無窮遠邊界測試 59
4.2.4 網格節點測試 61
4.3 田口方法模擬實驗 63
4.3.1 選定品質特性 63
4.3.2 選定影響品質特性控制因子及水準 64
4.3.3 內直交表選擇 65
4.3.4 外直交表選擇 66
4.3.5 判斷品質特性理想機能 67
4.4 主成份分析方法 68
4.4.1 標準化品質特性 68
4.4.2 主成份分析計算流程 69
4.5 變異數分析 70
第 5 章 感應渦線圈優化設計實驗結果與討論 72
5.1 田口方法模擬分析結果 72
5.1.1 模具表面溫度溫昇至均溫週期時間模擬結果 72
5.1.2 模具表面溫度均溫時熱分佈範圍模擬結果 75
5.2 主成份分析法最佳參數搜尋 77
5.3 優化線圈最佳參數模擬結果與驗證結果 81
5.4 優化線圈之二階段優化參數模擬結果與驗證結果 83
5.5 優化線圈於不同應用面測試結果分析 88
5.5.1 優化線圈設計應用於不同模溫與不同加熱時間分析 88
5.5.2 變模溫系統於均溫時溫度之重現性測試 90
5.5.3 不同折繞圈數相對其耗電量檢測 92
5.5.4 感應加熱系統於不同模仁深淺測試 94
第 6 章 結論與未來展望 101
6.1 結論 101
6.2 未來展望 104
參考文獻 105
附錄A 112
附錄B 114
附錄C 116
附錄D 119
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