臺灣博碩士論文加值系統

本研究提出創新高精度印刷之微鋼版結構製程，利用超薄多層金屬鋼版於不同基板進行印刷測試。印刷技術是目前最主要生產電路板的製程技術之一，由於其便宜且快速，於電子產業中相當重要。然而，傳統的印刷技術受到線徑與鋼版厚度的限制，使傳統印刷技術很難印刷出低於50 μm尺度之圖案。隨著科技的發展與需求，輕、薄且短小的電子產品需求越來越高，代表必須要印刷更精細圖案或是印刷薄膜。本研究除了開發製程之外，同時也進行印刷測試，藉由三種不同表面能之印刷基板，比較印墨的厚度與線寬的改變。
透過結合黃光微影與精密電鑄系統成型印刷鋼版，電鑄基板選擇便宜的市售載玻片，為了進行電鑄製程，必須要先於玻璃基板上濺鍍電鑄種子層，厚度各50 nm的鈦與金沉積於平整的玻璃基板上，使玻璃基板帶有導電特性。黃光微影部份分別使用正光阻AZ4620與負光阻SU-8，其精細且薄的入墨孔結構由AZ4620定義，而需要長時間電鑄與厚的儲墨槽結構，則利用側壁垂直性相當好SU-8光阻定義。SU-8光阻會完全覆蓋於入墨孔結構上，使第一層結構不會因二次電鑄而受到損壞，具高光穿透性的SU-8光阻使光罩的對位工作更容易進行。進行二次電鑄前，同樣利用表面電漿系統改質鍍物表面，除了提升鍍層品質外，更重要的是可以增加金屬層之間的附著力，使多層結構可以結合。最後將所有光阻去除，利用氫氟酸將鈦金屬層蝕刻，使鋼版結構脫模。
本研究之印刷鋼版，其主要結構可分為儲墨槽與入墨孔，由於入墨孔相當薄，利於印刷精細圖案，而儲墨槽的設計，提供充足與均勻的入墨情況，並且降低入墨孔所承受的印刷應力，增加印刷鋼版的使用壽命。此外，由於過於密集的入墨孔，會使鋼版結構強度下降，為了有效提升結構強度，另外添加了橋樑支架於入墨孔結構上，避免細長結構之間產生吸附效應，同時也增強了印刷鋼版的強度。
印刷結果顯示，本研究之多層結構鋼版，成功地將印刷尺度縮小至15 μm，印刷厚度僅有1 μm，印刷圖案的間距也可降至20 μm，相較於傳統印刷技術，其改善效果超過50%。從垂直線條圖案可以知道，儲墨槽確實提供均勻且穩定的入墨量，精細圖案不會因為遮蔽效應而產生斷線，改善傳統印刷技術所遇到問題。透過便宜且快速的製程，高精度的印刷鋼版有效降低印刷尺度，表現其高印刷解析度與低成本製作，相當適合應用於高科技電子產業當中。

This work developed a novel micro-structured stencil for high precision printings. Printing technology are the major techniques for producing printing circuit board in electronic industry. Because, printing process are usually in low-cost and mass production for producing products. However, it is difficult to produce small patterns using conventional printing technique due to the limitation of the woven mesh or stencil’s thickness. Therefore, the critical dimension for typical printing process is limited between 50 µm to 100 µm. The electronic products are tending to smaller, thinner and light for the consumer market. In other words, the printing methods are tending to smaller line width, thinner printing layer and higher printing resolution. This study developed a double layer structure stencil for printing ultra-fine line and thin film on three kind substrate. Each substrate has different surface energies. The printing test result compare the printed paste width and thickness from different printing condition. To understand the influence of surface energy for printed paste.
This work successfully developed a novel process for fabricating ultra-thin stencil with a buffer reservoir utilizing the combination of AZ4620 positive photoresist (PR) and SU-8 negative PR as the electroplating molds. The fabrication process include multi- photolithography and electroplating process. A low-cost microscope glass slide was used as the substrate for producing the stencil. In order to meet the requirement for metal electroplating and structure releasing, the Ti/Au layers of 50 nm in thickness were coated on the substrate by sputtering. The injection hole is defined by the AZ4620 PR since AZ4620 can well sustain the nickel plating bath in a short electroplating time. On the contrary, the SU-8 PR can sustain long electroplating time of the nickel plating bath then prevented the first metal layer damage in second electroplating process. The high transparency of SU-8 PR also makes it easy to align the two PR plating molds. Prior to the nickel plating process, the patterned substrate was activated with CCP to enhance the surface wettability. The plasma treatment in order to further enhance the adhesion and the roughness for nickel layer. The metal structure was then released from the glass substrate using a diluted HF solution.
The buffer reservoir was used to provide the necessary strength and uniform paste extrusion. Moreover, the buffer reservoir also reduced printing pressure from the injection hole. And the bridge structure to avoid the microstructure in stiction. Improved the stencil printing lifetime.
Results showed that the developed stencil successfully printed silver paste with the pattern of around 15 μm in width and 1 μm in thickness. And the printing pitch also down to 20 μm. The complete right angle patterns confirmed that the developed stencil was capable for printing patterns with desired orientations. The blocking issued was excluded for the stencil and the printed pattern. The method develop in the present study will give substantial impact on the modern printing technology.

審定書 i
致謝 ii
中文摘要 iii
Abstract v
目錄 vii
圖目錄 x
表目錄 xiii
符號表 xiv
簡寫表 xv
第一章 緒論 1
1.1 前言 1
1.2 印刷技術的重要性 1
1.3 印刷技術種類 2
1.3.1 網版印刷技術 2
1.3.2 鋼版印刷技術 6
1.3.3 噴墨印刷技術 10
1.3.4 滾輪印刷技術 12
1.4 印刷漿料 13
1.5 印刷基板表面能 15
1.6 論文架構 17
第二章 動機目的及原理 19
2.1 超細線寬印刷術之挑戰 19
2.1.1 網版印刷技術限制 19
2.1.2 鋼版印刷技術限制 22
2.2 研究動機與目的 23
2.3 光學微影 24
2.3.1 光阻 24
2.4 電鑄基本原理 26
2.4.1 氨基磺酸鎳 28
2.5 鋼版製作方法 29
2.6 設計原理 30
2.7 製程挑戰 31
第三章 實驗與方法 32
3.1 雙層印刷鋼版製作 32
3.1.1 LIGA-like製程 33
3.2 創新橋式輔助入墨印刷鋼版製作 36
3.3 表面電漿改質系統 39
3.4 精密電鑄系統 40
3.4.1 電鑄系統設備與鍍液配製 41
3.5 接觸角量測系統 42
3.6 表面粗糙量測儀 43
3.7 印刷器具與材料 45
3.7.1 印刷平台 45
3.7.2 刮刀與銀膠 46
3.7.3 印刷基板 47
3.8 實驗架構流程 48
第四章 實驗結果與討論 50
4.1 印刷鋼版實驗結構分析 50
4.1.1 入墨孔與儲墨槽結構 50
4.1.2 橋樑結構分析 52
4.2 接觸角量測實驗分析 54
4.2.1 基板改質電鑄結果分析 55
4.2.2 基板接觸角分析 58
4.2.3 表面電漿改質分析 61
4.3 印刷結果實驗分析 63
4.3.1 超精細圖案印刷分析 64
4.3.2 印刷銀膠線寬分析 68
4.3.3 印刷銀膠厚度分析 72
4.3.4 超小間距印刷分析 76
第五章 結論與未來展望 79
5.1 結論 79
5.2 未來展望 80
參考文獻 82
自述 86
附錄 87

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