臺灣博碩士論文加值系統

膽管支架(Biliary Stent)為一種中空管狀結構的醫療器材，在近幾年則被廣泛應用在因惡性腫瘤造成之阻塞性黃疸姑息治療，其中自我擴張式金屬支架(Self-expandable Biliary Stent)材料中最常見材料為鎳鈦合金。
在此篇論文研究中以超短脈衝雷射(350 fs)及反射式掃描振鏡進行鎳鈦管材上的膽管支架結構加工，其外部直徑為5.116 mm、厚度0.234 mm以及管長100 mm。鎳鈦曲面加工從量測焦距位置、雷射切割參數優化測試，進行膽管支架切割，達到高切邊品質且無熱效應區產生之膽管支架。再精確的利用雷射光束的高斯分布進行膽管支架邊緣圓角化的以及同時進行傳統支架電解拋光兩種不同方式進行圓角化加工，避免支架邊緣直角處對於醫療上的非預期性的傷害。自實驗結果中顯示藉由雷射切割路徑修正可以大幅提升雷射切割效率，使材料切割深度移除率從12 μm/J提升到27 μm/J，大幅減低熱能量累積於材料之中造成熱影響區。並且成功以飛秒雷射進行鎳鈦膽管支架邊緣之圓角化加工，去除其原始尖銳邊緣達到與電解拋光之相同效果。

Biliary stents has been extensively used an efficient medical device of palliation of jaundice for patients with biliary obstruction for many years. In addition, the most common material used for biliary stents was nickel-titanium (NiTi, Nitinol) alloy, also known as nitinol biliary stent, since NiTi alloy possessed some attracting materials properties.
In this study, an ultrashort pulse laser (350fs) and a galvano-mirror scanner were used to all experiments. Experiments are including nitinol biliary stent fabrication process, focal position measurement, and laser parameters optimization. The diameter of biliary stent was 5.116 mm, its thickness was 0.234 mm, and its length was 100 mm. In addition, the results indicated that the laser removal efficiency was significantly enhanced from 12 μm/J to 27 μm/J with high cutting quality without heat-affected zone producing if the laser movement path was precisely programmed. Moreover, compared laser machining rounded-shaped nitinol biliary stent with electropolished nitinol biliary stent, the edges of nitinol biliary stent can be successfully rounded-shaped without any side-effect by clever utilizing the unique characteristic of Gaussian beam of laser on the edges of biliary stent.

摘要 I
Abstract II
致謝 III
目錄 IV
圖目錄 VII
表目錄 XII
第一章、緒論 1
1.1 前言 1
1.2 研究動機與目的 2
第二章、文獻回顧 5
2.1 超短脈衝飛秒雷射與長脈衝雷射分析 5
2.2 超短脈衝飛秒雷射之激發原理 8
2.2.1 超短脈衝鎖模雷射振盪器 8
2.2.2啾頻脈衝放大術 11
2.3超短脈衝飛秒雷射加工原理 14
2.4 電化學拋光原理 15
2.5技術文獻回顧 17
2.5.1 飛秒雷射加工支架技術文獻回顧 17
2.5.2 電解拋光技術文獻回顧 22
第三章、研究方法 25
3.1實驗設計及參數規劃 25
3.1.1 飛秒雷射源參數 26
3.1.2 飛秒雷射機台加工參數 30
3.1.3 電解拋光操作參數[32,33] 33
3.1.4 田口法實驗設計[34] 34
3.2實驗前置工作 37
3.2.1 雷射源系統光路準備 37
3.2.2 飛秒雷射加工實驗試片準備 38
3.3飛秒雷射儀器 39
3.4鎳鈦支架酸洗及電解拋光儀器 42
3.5實驗材料選用 43
3.6實驗檢測分析儀器介紹 45
3.6.1 超音波洗淨機 45
3.6.2 雷射掃描共軛焦3D量測顯微鏡 46
3.6.3 光學顯微鏡 47
3.6.4 掃描式電子顯微鏡(Scanning Electron Microscope, SEM) 48
第四章、實驗結果與討論 50
4.1飛秒雷射實驗 50
4.1.1 飛秒雷射聚焦位置測試實驗 50
4.1.2 飛秒雷射開關時間補償實驗 52
4.1.3 田口法實驗參數分析 54
4.1.4 鎳鈦圓管切穿測試 56
4.1.5鎳鈦膽管支架加工實驗 66
4. 1. 6支架邊緣去直角化加工 68
4.2支架拋光實驗 71
4.2.1支架酸洗處理 71
4.2.2支架電化學拋光處理 73
第五章、結論與未來展望 76
5.1 結論 76
5.1.1 膽管支架飛秒雷射加工結論 76
5.1.2 雷射邊緣圓角化加工&;電解拋光結論 77
5.2 未來展望 78
參考文獻 79

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