臺灣博碩士論文加值系統

本論文主要經由材料與結構設計將散熱銅光杯結構應用於一般陣列多顆晶粒（LED）的製程，並與一般無光杯結構的陣列LEDs模組比較；經由實驗結果得知，在散熱銅光杯結構中，設計製作出適合的銅基座厚度與面積，同時利用高散熱的複合焊料封裝，可以成功解決散熱問題。此外，本論文也針對散熱銅光杯對於LEDs模組光功率的影響作一探討。
由模擬結果得知銅光杯結構對於LEDs的取光與散熱可以得到改善，且經由實際表面溫度量測，3×3陣列LEDs模組在注入電流為1050 mA時，一般無光杯結構晶粒表面最高溫度約為52.6°C，而具散熱銅光杯結構晶粒表面最高溫度約為42.67°C。4×4陣列LEDs模組在注入電流為1400 mA時，一般無光杯結構晶粒表面最高溫度約為58.55°C，而具散熱銅光杯結構晶粒表面最高溫度約為48.85°C。5×5陣列LEDs模組在注入電流為1750 mA時，一般無光杯結構晶粒表面最高溫度約為68.51°C，而具散熱銅光杯結構晶粒表面最高溫度約為56.73°C。此外，藉由量測LEDs封裝後的整體熱阻，發現封裝後的熱阻至少已降低至原始封裝結構的70%以下，確實達到低熱阻的要求。比較在未有樹脂封裝的3×3、4×4、5×5陣列LEDs模組，在注入電流為1050 mA、1400 mA、1750 mA時，一般無光杯結構光功率為3621.7 mW、6346.3 mW、9760.4 mW，而具散熱銅光杯結構光功率為4098.5 mW、7150.3 mW、10919.6 mW。
研究結果顯示，具光杯結構應用於陣列模組製作，不論光及熱效應皆有明顯改善。最後藉由模擬與實驗結果將不同樹脂封裝形式運用在散熱銅光杯陣列模組上，在光功率的表現上，半圓形封裝形式比平坦型封裝形式高出55％，因此對於提高整體取光效率來說，將以此封裝形式作為散熱銅光杯陣列模組的最佳封裝形式。由於散熱銅光杯結構可以將LEDs所產生的熱直接由晶粒端傳導至銅基座，並快速傳遞至鋁散熱基板，因此對於整體LEDs模組，除了可以達到快速散熱的效果，並且提升其取光效率。

In this study, the cup-shaped copper structure was developed to improve heat dissipation of high-power LEDs array module using electroplating technique. From our design and measurement, the copper surface area and thickness were optimized for cup-shaped copper structure. Meanwhile, the compound solder was also used to enhance the thermal dissipation of LEDs. Moreover, the effect of cup-shaped copper on the output power of LEDs was investigated.
For LEDs with original structure and copper heat spreader, the highest surface temperatures of 3×3 array LEDs modules were 52.6 and 42.67 °C (with 1050 mA injection current), while the highest surface temperatures of 4×4 array LEDs modules were 58.55 and 48.85 °C (with 1400 mA injection current), respectively. As the 5×5 array LEDs modules with original structure and copper heat spreader were fabricated, the highest surface temperatures at 1750 mA injection current were 68.51 and 56.73 °C, respectively. The thermal resistance of optimal LEDs array module with copper heat spreader on heat sink using compound solder is reduced obviously. On the other hand, the output powers of 3×3, 4×4 and 5×5 array LEDs modules with original structure were 3621.7, 6346.3 and 9760.4 mW at injection currents of 1050, 1400 and 1750 mA, respectively. Meanwhile, the output powers of these samples with copper heat spreader can be improved to 4098.5, 7150.3 and 10919.6 mW, respectively.
The optical and thermal characteristics of array LEDs module have been improved significantly using the cup-shaped copper structure. Furthermore, various types of epoxy-packaged LEDs with cup-shaped structure were also fabricated. It is found that the light extraction efficiency of LED with semicircle package has 55% improvement as compared to that of LED with flat package. The cup-shaped copper structure was contacted directly with sapphire to enhance heat dissipation. In addition to efficient heat dissipation, the light extraction of the lateral emitting in high-power LEDs can be improved.

封面內頁
簽名頁
授權書
誌謝 I
中文摘要 II
Abstract III
目錄 ………………………………………………………………….IV
表目錄 …………………………………………………………………VIII
圖目錄 ………………………………………………………………….IX
第一章 緒論 1
1-1前言 1
1-2發光二極體的歷史 2
1-3 研究動機 4
1-4 論文架構 6
第二章 理論基礎與文獻回顧 7
2-1 發光二極體之發光機制 7
2-2光效應計量與單位 9
2-3熱學模擬與熱學量測基礎理論 11
2-3-1 熱效應對發光二極體之影響 11
2-3-2 熱力學定律 12
2-3-3 熱學模式 12
2-3-4 熱傳導 13
2-3-5 熱對流 13
2-3-6 熱輻射 13
2-4熱分析材料基本屬性 14
2-5熱阻之定義與計算 15
2-5-1 熱傳性質 16
2-6發光二極體之散熱技術 17
2-7 電鍍基礎理論 18
第三章 最佳化設計與模擬分析 20
3-1 前言 20
3-2 模擬軟體介紹 20
3-2-1 TracePro 簡介 20
3-2-1 Ansys 簡介 21
3-3 模擬條件與模組設計 21
3-4 模擬結果 23
3-4-1 有無銅光杯結構之陣列LED模組的模擬結果 23
3-4-2 不同間距陣列光杯LED模組的模擬結果 23
3-4-3 不同封裝形式的陣列光杯LED模組的模擬結果 23
第四章 實驗流程與儀器設備 25
4-1 前言 25
4-2 實驗流程 25
4-2-1 最佳化實驗製程步驟 26
4-2-2複合銲料製作 30
4-3 元件之固晶打線與封裝 31
4-4 量測儀器與設備 32
4-4-1 LED光電特性量測系統 32
4-4-2紅外熱像分析儀 32
4-4-3積分球 33
4-4-4光場分析系統 33
4-4-5暫態熱阻量測系統 34
4-4-6 n&k薄膜特性分析儀 35
第五章 結果與討論 36
5-1 前言 36
5-2 不同形貌之陣列發光二極體量測結果與討論 37
5-2-1 不同形貌陣列發光二極體之表面溫度量測 37
5-2-2 不同形貌陣列發光二極體之暫態熱阻量測 39
5-2-3 不同形貌陣列發光二極體之光功率比較 40
5-3 不同晶片間距之陣列發光二極體量測結果與討論 41
5-3-1 不同晶片間距陣列LED之暫態熱阻量測 41
5-3-2 不同晶片間距陣列LED之光功率與發光效率比較 41
5-4 不同固晶膠材之陣列發光二極體量測結果與討論 42
5-5 不同陣列形式之發光二極體量測結果與討論 42
5-5-1 不同陣列形式LED之表面溫度量測 43
5-5-2 不同陣列形式LED之暫態熱阻量測 44
5-5-3 不同陣列形式LED之光功率及發光效率比較 45
5-5-4 不同陣列形式LED之光場量測分析 46
5-6 不同封裝形式之陣列發光二極體量測結果與討論 47
5-7 銅光杯結構於陣列發光二極體之可靠度測試 50
第六章 結論與未來展望 51
6-1 結論 51
6-2 未來展望 52

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