臺灣博碩士論文加值系統

金屬基複合材料若採用傳統之熔融接合法，易產生高溫、強光及煙燻等危害因子，導致勞工灼傷、白內障、塵肺症等職業傷害。熔銲金屬基複合材料過程中，熔融金屬基材與強化材之密度差異而造成強化材分佈不均，且金屬基材之接合處可能產生介金屬間化合物(Intermetallic compound, IMC)，降低接合界面之強度及品質。故採用固相擴散接合(Solid state diffusion bonding)法，其製程溫度均低於母材與強化材之熔點溫度，可降低熱曝露所產生之危害，亦可避免金屬基複合材料中碳化矽分佈不均與降低介金屬化合物之生成量，進而提高金屬基複合材料之接合品質。本研究採用固相擴散接合法，接合鋁基碳化矽與銅基碳化矽複合材料，選用厚度為50μm之鋁箔為接合層材料，接合實驗之控制參數包括接合溫度(450℃-650℃)、接合時間(30-120min)與接合負荷(220MPa)，並改變金屬基複合材料中強化材之重量百分比，驗證強化材含量對金屬基複合材料接合品質之影響。金屬基複合材料接合後，以光學顯微鏡與電子顯微鏡觀察接合界面之微觀組織，以剪切實驗測試接合試片之強度，並輔以破斷面觀察，說明接合試片之破斷模式，成份分析以能量散射光譜儀，分析接合界面之組成與可能出現之介金屬化合物。
由實驗結果得知以鋁作為鋁基碳化矽與銅基碳化矽複合材料之接合層材料，可成功接合鋁基碳化矽與銅基碳化矽複合材料，且接合強度隨製程溫度與接合時間提升而增大，顯示較高製程溫度與較長接合時間可有效促進接合界面之原子進行交互擴散，進而提高其接合強度。但製程溫度上升至650℃，接合界面之顯微結構發現部份碳化矽強化材聚集於鋁接合層與鋁基碳化矽複合材料接合側，推論其主要形成原因為650℃之製程溫度過高，致使部份鋁基材產生軟化而流動且經接合負荷作用下，部份鋁基材被擠出模具外，造成碳化矽強化材聚集，顯示製程溫度不宜過於接近金屬基材之熔點溫度，因此採用600℃之製程溫度，避免鋁基材過於接近熔點溫度所產生之缺陷。製程溫度為600℃之接合試片經剪切試驗後，剪切強度達26.7MPa；隨持溫時間增加，接合試片間之原子交互擴散率及接合層厚度亦隨之增加，有效提高接合試片之剪切強度，但持溫時間過長易使接合層厚度寬大，造成接合試片之剪切強度下降，故持溫時間90分鐘可達最高剪切強度值為43.7MPa；碳化矽重量百分比之增加有助於提升接合試片之剪切強度，當碳化矽強化材含量15wt.%時，最高剪切強度值達80.6MPa，當碳化矽重量百分比持續增加，接合試片之剪切強度逐漸下降，其原因為包覆碳化矽強化材周圍之金屬基材含量減少，造成鋁基碳化矽與銅基碳化矽複合材料中碳化矽強化材未能與金屬基材產生良好的鍵結。本實驗結果顯示藉由熱壓法可提高鋁基碳化矽複合材料與銅基碳化矽複合材料之接合強度，降低傳統之熔融接合法所產生之危害，提供良好之作業環境，確保作業人員之安全。

The traditional fusion welding process was widely used to join the metal matrix composites (MMC). An elevated temperature is required to melt the metal matrix and then to achieve welding. Some hazards formed easily in the welding process such as high temperature, fumes and toxic gases, which harms the welder’s safety. In general, the density of reinforcement is lighter than that of metal matrix, thus, a segregation defect would form when the fusion welding process was applied to join the MMCs. The solid state diffusion bonding process is expected to reduce the bonding temperature and to improve bonding quality of MMCs.
In this study, the solid state diffusion bonding process was used to join Al/(SiC)P and Cu/(SiC)P with an interlayer. The aluminum foil with the thickness of 50um was selected as the interlayer. The major bonding parameters of solid state diffusion bonding, bonding time, bonding temperature and the fraction of reinforcements were investigated. After Al/(SiC)P and Cu/(SiC)P bonded together, the optical microscopy and scanning electron microscopy were conducted to observe the microstructure of bonding interface and to evaluate the fracture mode. The bonding strength of Al/(SiC)P and Cu/(SiC)P was determined using a shear test.
According to the experimental results, the Al/(SiC)P and Cu/(SiC)P can be bonded successfully with an interlayer of aluminum foil by solid diffusion bonding process. The bonding strength increases with the increasing bonding temperature and bonding time. This experimental result implies that higher bonding temperature and extending bonding time promoted the atomic interdiffusion, and the bonding strength is thus enhanced. When the bonding temperature increased to 650°C, the interlayer soften and the flowability increased, larger reinforcements pile up at bonding interface between the Al/(SiC)P and the interlayer. The bonding strength is thus degrading, indicating the bonding temperature should not be closed to the melting point of metal matrix and the interlayer. As increasing reinforcement fraction in the range of 5wt% to 15wt%, the bonding strength increases with the reinforcement fraction, and the highest bonding strength is 80.6 MPa approximately. Adding appropriate fraction of reinforcements is an effective way to improve the bonding strength. However, the bonding strength gradually degrades when an exceeding reinforcement was added. The metal matrix is insufficient to form a sound bond between the reinforcements and the metal matrix. A porosity defect or cracks would be formed between reinforcements and metal matrix resulting in a lower bonding strength.

摘要Ⅰ
AbstractⅢ
誌謝Ⅳ
目錄Ⅴ
圖目錄Ⅷ
表目錄XI
第一章 前言1
第二章 文獻回顧 3
2-1 金屬基複合材料簡介3
2-2 金屬基複合材料之製程3
2-2-1固相製程3
2-2-2液相製程4
2-2-3雙相製程4
2-3 金屬基複合材料之接合技術5
2-3-1 傳統融熔銲接製程5
2-3-2 固相擴散接合7
2-3-2-1 擴散接合7
2-3-2-2 固相擴散接合之原理7
2-3-2-3 影響固相擴散接合之參數8
2-3-2-4 接合層之應用13
第三章 實驗步驟與方法16
3-1 金屬基複合材料之製作16
3-1-1 碳化矽粉末清洗16
3-1-2 混粉16
3-1-3 燒結16
3-2 金屬基複合材料之接合17
3-2-1 接合試片前處理17
3-2-2 接合參數17
3-3 接合試片之微觀結構與機械性質分析19
3-3-1 接合介面觀察19
3-3-2 機械性質分析19
3-3-3 成份分析20
3-4 實驗流程圖21
第四章 結果與討論22
4-1 製程溫度對接合品質之影響22
4-1-1 接合試片之巨觀觀察22
4-1-2 接合試片之微觀結構24
4-1-3 接合試片剪切強度試驗24
4-1-4 斷裂試片之巨觀分析26
4-1-5 斷裂試片之橫截面與斷裂處分析27
4-1-6 斷裂試片之破斷面分析29
4-1-7 EDS分析鋁基碳化矽與銅基碳化矽複合材料31
4-2 持溫時間對接合品質之影響35
4-2-1接合試片之巨觀36
4-2-2 接合試片之微觀結構36
4-2-3 接合試片之剪切強度試驗39
4-2-4 斷裂試片之橫截面與斷裂處分析40
4-2-5 斷裂試片之破斷面分析43
4-2-6 EDS分析之鋁基碳化矽與銅基碳化矽複合材料45
4-3 碳化矽重量百分比對接合品質之影響49
4-3-1 接合試片之巨觀49
4-3-2 接合試片之微觀結構51
4-3-3 碳化矽強化材堆積之原因52
4-3-4 接合試片之剪切強度試驗53
4-3-5 斷裂試片之橫截面與斷裂處分析54
4-3-6 斷裂試片之破斷面分析57
4-3-7 EDS分析隨機挑選之擠出物58
第五章 結論65
參考文獻66

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