|
REFERENCES
Ashiwake, N., Nakayama, W., Daikoku, T., and Kobaiashi, F., 1983, “Forced Convection Heat Transfer from LSI Packages in an air-cooled wiring card array,” ASME Heat Transfer in Electronic Equipment, HTD-Vol. 28, p.35. Box, G. E. P. and D. W. Behnken, 1960, “Some New Three Level Designs for the Study of Quantitative Variables,” Technometrics, 2, pp.455-475. Catharina R. Biber, Christian L.Belady, “Pressure Drop Prediction for Heat Sinks: What Is The Best Method?,” ASME Advances in Electronic Packaging, Vol.2, 1997, pp.1829-1835. Chen, H. T., Horng, J. T., Chen, P. L., and Hung, Y. H., 2004, “Optimal Design for PPF Heat Sinks in Electronics Cooling Applications,” ASME Journal of Electronic Packaging , May. (In Press) Ellison, G. N., 1984, Thermal Computations for Electronic Equipment, Van Nostrand Reinhold Company, New York. Gooding, J. S., Jaeger, R. C., Mackowski, D. W., Fahrner, C. J., and Hingorani, S., 1994, "Optimal Sizing of Planar Thermal Spreaders," ASME Journal of Heat Transfer, Vol.116, pp.296-301 Ishizuka, M., Yokono, Y., and Hisano, K., 1999, "Experimental Study on the Performance of Compact Heat Sink for LSI Packages," Advances in Electronic Packaging, EEP-Vol. 26-1, pp. 713-718. Jeng, T. M, 2002, “Fluid Flow and Heat Transfer Behavior in Porous Channels,” Ph.D. Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C.. Jonsson, H., and Moshfegh, B., 2001, “Modeling of the Thermal and Hydraulic Performance of Plate Fin, Strip Fin, and Pin Fin Heat Sinks—Influence of Flow Bypass, ” IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, June. Kuo, S. T., 2002, “Fluid Flow And Heat Transfer for Confined Heat Sinks,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C.. Kim, S. J., and Kim, D., 1999, “Forced Convection in Microstructures for Electronic Equipment Cooling, “ ASME J. Heat Transfer, Vol. 121, pp. 635-645. Kraus, A. D., and Bar-Cohen, A., 1995, Design and Analysis of Heat Sinks, John Wiley and Sons, Inc., New York. Khuri, Andre I., Cornell, John A., 1996, Response surfaces: designs and analyses, second edition, Marcel Dekker. Linton, R. L., and Agonafer, D., 1995, “Coarse and detailed CFD modeling of a finned heat sink,”IEEE Trans., Comp., Packag., Manufact., Technol. A, Vol. 18,pp517-520, Sep. Liu, L. K, 2004, “Fluid Flow and Heat Transfer from Heated Extended Surfaces with Confined Slot Jet Impingement,” Ph.D. Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C.. Matsushima, H., Yanagida, T., and Kondo, Y., 1992, “Algorithm for Predicting the Thermal Resistance of Finned LSI Packages Mounted on a Circuit Board,” Heat Transfer Japanese Research, Vol. 21, No. 5, pp. 504-517. Madhusudan, L., and Bar-Cohen, A., 1998, “Optimization of Vertical Pin-Fin Heat Sinks in Natural Convective Heat Transfer,” Heat Transfer, Proceeding of 11 th IHTC, Vol. 3 August 23-26, Kyongju, Korea, pp.501-506. Mills, A. F., 1999, Basic Heat and Mass Transfer, Prentice-Hall, Inc., New Jersey. Monthomery, D. C., 2001, Design and Analysis of Experiments, 5rd ed., New York. Narasimhan, S., Bar-Cohen, A. and Nair, R., 2003, “Flow and Pressure Field Characteristics in the Porous Block Compact Modeling of Parallel Plate Heat Sinks,” IEEE Transactions on Components and Packaging Technologies, vol. 26, No. 1, March. Raymond H. Myers, Douglas C., 2002, Response surface methodology: process and product optimization using designed experiments, second edition, J. Wiley. Starner, K. E., and McManus, H. N., Jr., 1963, “An Experimental Investigation of Free Convection Heat Transfer from Rectangular Fin Array,” ASME J. Heat Transfer, Vol. 85, pp. 273-278. Sparrow, E. M., Baliga, B. R., Patankar, S. V., 1978, "Forced Convection Heat Transfer from a Shrouded Fin Array with and without Tip Clearance," ASME Journal of Heat Transfer, Vol. 100, pp. 572-579. Sparrow, E. M., and Grannis, V. B., 1990, “Pressure Drop Characteristics of Heat Exchangers Consisting of Arrays of Diamond-Shaped Pin Fins,” Int. J. Heat Transfer. Vol. 34. No. 3, pp.589-600. Seri, L., 1995, "Optimum Design and Selection of Heat Sinks," IEEE SEMI-THERM Symposium, Eleventh, pp.48-54 You, H. I., and Chang, C. H., 1997, “Numerical Prediction of Heat Transfer Coefficent for a Pin –Fin Channel Flow,” ASME J. Heat Transfer, Vol. 119, pp840-843. Vanderplaats, G. N., 1993, Numerical Optimization Techniques for Engineering Design, McGraw-Hill, Inc., Singapore Wirtz, R. A., Chen, W. M., and Zhou, R. H., 1994, "Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks," ASME Journal of Electronic Packaging, Vol. 116, pp. 206-211. Wu, C. F., and Hamada, M., 2000, Experiments – Planning, Analysis, and Parameter Design Optimization, John Wiley & Sons, Inc., New York.
|