臺灣博碩士論文加值系統

本研究著重於開發具有可調變空間解析度的可撓性觸覺感測器陣列。相較於一般利用高分子材料來實現可撓性觸覺感測器，此篇透過拉伸式彈簧結構設計，來連接做為觸覺感測器的節點，進而改善高分子材料本身製程整合不易，以及材料附著性差等問題，並增加調變空間解析度之能力。在正向力感測方面，運用全對稱的壓阻材料，接成惠斯同電橋來消除雜訊並放大輸出訊號，再利用同時當作結構聯結與電性聯結的彈簧導線，將電性遷到外部以方便讀取。
統整本研究四大特點：(1)製程流程與材料選用皆相容於傳統半導體製程，並透過製程整合，將感測器直接製作於拉伸式陣列中，免除後組裝的困難。(2)拉伸式彈簧結構在製作過程中處於緊密排列的狀態，令元件能夠高密度地被製作出來，以節省空間。並在後續元件完成時，透過拉伸的方式來調變感測器的空間解析度。(3)運用剛性相對強之薄膜結構，藉此增加正向力的感測範圍，並透過惠斯同電橋來消除雜訊。(4)可撓性特性讓元件能夠貼附於曲面，使元件能夠被運用於更廣泛的使用情境。

This study presents a three by three flexible tactile sensor array using stretchable silicon spring with doping silicon. Each tactile sensor device is located at the silicon-unit of a 2D chip-network distributed, which are mechanically and electrically connected to surrounding devices by stretchable silicon spring. The doping silicon acts as a piezo-resistive sensing element embedded into the membrane located at the center of unit, which can detect normal force without heat interference by Wheatstone bridge. The springs can stretch and expand the tactile sensor by several times of magnitude area forming a variable-density network of interconnected devices. There are four merits of this approach. (1) Using existing process technologies and materials for semiconductor could simultaneously complete the tactile sensor and spring structure without assembling problem. (2) Spring structure lets the tactile sensor array have the tunable spatial resolution by changing the distance between each unit. (3) Wheatstone bridge on silicon membrane has a large sensing range in normal force without interference of temperature by fully differential design. (4) The tactile-network with flexibility can be applied to curved surfaces and stretchable application.

摘要 II
ABSTRACT III
誌謝 IV
目錄 VI
圖目錄 IX
表目錄 XVII
第1章 緒論 1
1-1. 前言 1
1-2. 文獻回顧 4
1-2-1. 感測機制 5
1-2-2. 可撓性特性 11
1-3. 研究動機 15
1-4. 全文架構 17
第2章 元件之設計與模擬 32
2-1. 元件設計分析 32
2-1-1. 壓阻效應 33
2-1-2. 離子佈植 37
2-1-3. 力學傳感器 40
2-1-4. 惠斯同電橋 42
2-1-5. 電性配置與跨線 44
2-1-6. 拉伸結構 46
2-2. 模擬分析 50
2-2-1. 力學分析 50
2-2-2. 拉伸分析 52
第3章 製程流程與結果 74
3-1. 光罩設計 74
3-2. 製程流程步驟 76
3-3. 製程結果 81
第4章 元件量測結果 100
4-1. 觸覺感測器量測 100
4-1-1. 正向力量測 101
4-1-2. 陣列結構量測 103
4-1-3. 熱干擾測試 105
4-2. 拉伸能力測試 107
4-2-1. 彈簧拉伸量測 107
4-2-2. 可撓性測試 109
第5章 結論與未來工作 129
5-1. 結論 129
5-2. 未來工作 131
參考文獻 140

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