臺灣博碩士論文加值系統

　　目前，電腦所使用之散熱元件皆脫離不了散熱模組，但更嚴格來講，更應包括熱源表面與散熱模組間之ㄧ種導熱性質良好的熱介面材料（Thermal Interface Material, T.I.M.），效能好的T.I.M.可以大幅降低熱源表面與散熱模組間的介面熱阻，為了得到最佳化的選擇，我們必須精確的量測出T.I.M.的熱性質。截至目前為止，沒有任何理論模式可以預測T.I.M.的熱性質，所以精準的測量平台和方法是相當重要的。本論文主要目的，在建立一套熱介面材料熱性質量測系統，以一維熱傳導理論為基礎，加上精密加工技術，針對電腦所使用之熱介面材料，發展出一套製作低成本、高準確率之熱性質量測系統。
　　本論文實驗分為四大部分。第一部分在探討不同厚度spacer對實驗靈敏度（sensitivity）的影響；第二及第三部分則是就實驗的重複性（repeatability）及再現性（reproducibility）進行分析討論；最後，則是以國立清華大學工程與系統科學系電子構裝散熱實驗室所設立之Dummy Heater熱阻測試機驗證T.I.M.量測系統。經由實驗結果，我們可以發現，本論文實驗所設計之ABS spacer有較佳之靈敏度表現，熱傳導係數重複性相對誤差在5％以內；接觸熱阻值重複性相對誤差也在10％左右；不同操作者所造成的再現性相對誤差更在2％以內，經由Dummy Heater熱阻測試機進行驗證，其準確率與可靠度更是無庸置疑。

　　At present, all the heat dissipation elements used in computer would be include heat sink, fan or heat pipe etc. Strictly speaking, the Thermal Interface Material (T.I.M.) should be account into too. A good T.I.M. could reduce largely the thermal resistance between heat source and the heat sink. In order to obtain the optimal selection, we need to measure the thermo properties of the T.I.M. very accuracy. The purpose of this paper is to build up a very high sensitivity T.I.M. measuring system which was based on one-dimension heat transfer theory and the precise processing technology.
　　This article includes four parts, the first one is to discuss the effect of the different thickness of the spacer to the sensitivity of the instrument, the second part and the third part was discussing the repeatability and the reproducibility respectively. The fourth part was used dummy heater developed by ECS laboratory to evaluate the thermo resistance value of the grease and double check was that consistence evaluate from T.I.M. instrument. The experiment results showed that the ABS spacer developed by ECS laboratory a very good sensitivity performance. The relative error of the conductivity coefficient from the repeatability experiment was within 5%, while the relative error for the contact resistance was within 10%. The relative error of the reproducibility made by different operator was control within 2%.

摘要……………………………………………………………………I
誌謝……………………………………………………………………III
目錄……………………………………………………………………IV
圖目錄…………………………………………………………………VI
表目錄…………………………………………………………………IX

第一章　緒論………………………………………………………….1
1-1　前言………………………………………………………………1
1-2　研究動機與目的…………………………………………………4
1-3　文獻回顧…………………………………………………………5
1-4　章節概述…………………………………………………………8
第二章　原理分析與理論模式……………………………………….9
2-1　基本熱傳原理……………………………………………………9
2-1.1　傳導……………………………………………………………9
2-1.2　對流……………………………………………………………10
2-1.3　輻射……………………………………………………………11
2-2　材料的熱力性質…………………………………………………13
2-3　金屬材料熱傳導係數理論分析…………………………………15
2-4　Thermal Grease熱傳導係數理論分析…………………………17
第三章　實驗設備與方法…………………………………………….19
3-1　實驗設備…………………………………………………………19
3-1.1　T.I.M.量測平台之治具設計製作……………………………19
3-1.2　電源供應器與訊號接受………………………………………23
3-1.3　可程式邏輯控制器應用與電腦控制…………………………26
3-1.4　spacer之設計製作……………………………………………28
3-1.5　冷卻系統………………………………………………………30
3-1.6　T.I.M.量測平台整合主體架構………………………………31
3-1.7　T.I.M.量測系統………………………………………………33
3-2　實驗步驟…………………………………………………………34
3-2.1　T型熱電偶與溫度錶頭之校正……………………………….34
3-2.2　熱介面材料之熱傳導係數量測操作流程……………………35
3-2.3　T.I.M.量測系統操作注意事項………………………………39
3-3　實驗裝置圖………………………………………………………40
第四章　結果與討論………………………………………………….46
4-1　靈敏度分析實驗結果與討論……………………………………47
4-1.1　Teflon spacer……………………………………………….47
4-1.2　Thickness Gauge…………………………………………….56
4-1.3　ABS spacer……………………………………………………59
4-2　重複性分析實驗結果與討論……………………………………65
4-3　再現性分析實驗結果與討論……………………………………81
4-4　以Dummy Heater熱阻測試機驗證T.I.M.量測系統……………100
第五章　結論………………………………………………………….106
參考文獻……………………………………………………………….107

[1] 王美珍，「DT散熱器產業」，“www.tisc.com.tw/new/newreport/industry/upload/industry20070126-2.pdf”,2007.
[2] 賴美錵，「擴散熱阻於電子構裝之分析與應用」，碩士論文，元智大學機械工程研究所，2000。
[3] 黃振東、張志忠，「熱界面材料的發展現況與專利分析」，熱管理產業通訊，第2期。
[4] M. Grujicic, C. L. Zhao, E. C. Dusel, “The Effect of Thermal Contact Resistance on Heat Management in the Electronic Packaging”, Applied Surface Science, 2005.
[5] Dr. Ron Hunadi, “Thermal Greases with Exceptionally High Thermal Conductivity and Low Thermal Resistance”, International Symposium on Advanced Packaging Materials, 1998.
[6] Wui-wai Cheng, Chakravarti Madhusudana, “Effect of Electroplating on the Thermal Conductance of Fin-Tube Interface”, Applied Thermal Engineering, 2006.
[7] Thermagon Company, “Test Specifications of Thermal Resistance”, September 2001.
[8] J.P. Gwinn, R.L. Webb, “Performance and Testing of Thermal Interface Materials”, Microelectronics Journal, 2003.
[9] Vishal Singhal, Thomas Siegmund, Suresh V. Garimella, “Optimization of Thermal Interface Materials for Electronics Cooling Applications”, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No.2, June 2004.
[10] ASTM C177-97, Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded-Hot-Plate Apparatus, West Conshohocken, PA.
[11] ASTM D374, Standard Test Methods for Thickness of Solid Electrical Insulation Materials, American Society for Testing and Materials, West Conshohocken, PA.
[12] ASTM D5470-01, Standard Test Methods for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials, American Society for Testing and Materials, West Conshohocken, PA.
[13] ASTM E1225-99, Standard Test Method for Thermal Conductivity of Solid by Means of Guarded-Comparative-Longitudinal Heat Flow Technique, West Conshohocken, PA.
[14] 國祥貿易，「工業溫度量測技巧」，“http://www.lin.com.tw/products/Measuring/meainfo/meainfo1.htm”.