[1] Nguyen, T., Mochizuki, M., K., Saito, Y.,Sauciuc, I,.and boggs, R.,“Advance Cooling System Using Miniature Heat Pipe in Movie PC,” The sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp.507-511,1998.
[2] Xie, H, Ali, A., and Bhatia, R., “The use of Heat Pipe in PersonalComputers,” The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM ’98., pp.422-448. 1998.
[3] Dunn, P. D., and Reay, D. A., Heat Pipes, Pergamon, Oxford, 1994.
[4] Gaugler, R.S., US Patent Application. Dec.12,1942. Published US Patent NO.2350348, June 1944.
[5] Grover, G. M., and Cotter T. P., and G.F. Erickson, “Structure of very high thermal conductance.” J. App. Phys. Vol.35, p1990,1964.
[6] Grover, G. M., US Patent NO.3229759. Filed 1963.
[7] Cotter, T. P., Theory of Heat Pipes, Los Alamos Science Lab. Report NO. LA-3246-MS,1965.
[8] Levy, E. K., ”Theoretical Investigation of Heat Pipes Operating at Low Vapor Pressure,” J. Engineering for Industry, Vol. 90, pp.547-552. 1968.
[9] Tien, C.L., and Sun, K.H., “Minimun meniscus radius of heat pipe with a wicking materials.” ,Int. J. Heat Mass Transfer 14, pp.1853-1855,1970.
[10] Asselman, G. A. A., and Green, D. B.,”Heat Pipes,” Phillips Technical Review,1973, vol. 16, pp.169-186.
[11] Busse, C.A., “Pressure Drop in the Vapor Phase of Long Heat Pipe,” Proceedings of International Thermionic Conversion specialist conference, IEEE, New York. 1967.
[12] Kimura, H., Itagaki, H., and Sakura, Y., Transient performance of gas-loaded variable conductance heat pipes with a hot reservoir, Pergamon Press , pp.589-600,1982.
[13] 依日光譯,熱管技術理論實務,日本熱管技術協會編,復漢出版社,1986.
[14] Zhou, J., Yao, Z., and Zhu, J., “Experimental Investigation of application Characters of Micro Heat Pipes,” Heat pipe conf, Beijing, China. 1992.
[15] Cao, Y., Gao, M.., and Pinilla, E., “Fabrication and Test of a Fillinf station for Micro/Miniature Devices”, Proceedings of the 32nd Intersociety Energy Conversion Engineering Conference,1997. IECEC-97., vol.2, pp.1509-1513.1997.
[16] 陳明生,小型熱管製造、性能測試與熱輸送現象之研究,國立台北科技大學機電整合技術研究所碩士學位論文,1999.[17] Xie, H, Mostafa, A., Wendy, L., and Kevin, H., “Thermal Solutions to Pentium Processors in TCP in Notebooks and Sub-Notebooks,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, part A, Vol.19, No.1, pp. 54-65. March 1996.
[18] 李青洲,熱管之最大熱傳量與有效長度之關係,國立台灣科技大學機械工程研究所碩士學位論文,2000.[19] 賴錦川,燒結式微熱管毛細結構參數之影響研究。國立台灣大學機械工程研究所碩士學位論文,2000.[21] Marten, T., and Johan, G., Heat Pipes: Construction and Application, Elsevier, Science Publishing Co., Inc.
[22]Peterson, G. P., An introduction to Heat Pipe, Wiley, New York.1994.
[23] Dunn, P., and Reay, D. A., Heat Pipes, Second Edition, A. Wheaton & co., LTd.
[24] Chi, S. W., Heat Pipe Theory and Practice, McGraw-Hill,New York. 1976.