臺灣博碩士論文加值系統

微流體生醫分析晶片已廣泛地應用在生醫研究等相關領域，一般傳統的微流體生醫分析晶片必須藉助雷射誘導螢光分析技術與複雜之光學設備方可進行分析，並不符合實用化與普及化之要求，本研究使用電性量測晶片進行分析檢測，可以大大的減低其儀器設備成本，此系統可以快速的分析出離子，改善了以往傳統量測所需大型複雜儀器之缺點。

本研究以玻璃為基材，運用無電鍍(electroless)及電鍍(electroplating)技術結合微機電製程，設計製作出ㄧ生醫分析晶片。將偵測電極與微管道整合於單一晶片上，運用無電鍍技術沉積金屬薄膜於晶片上，使用電鍍法將其金屬層增厚而成為3D，作為量測晶片之電極。此製作方式之電力線所涵蓋之面積較一般平面電極大許多，因此會增加其偵測效能及敏感度，與以往微流體生醫分析晶片運用物理氣相蒸鍍法沉積金屬所製作出的電極相比，改善了薄膜電極量測面積及製作上高成本等問題。

實驗中之偵測為非接觸式偵測，由於不必接觸樣品，不會產生副反應，可改善以往電極直接接觸檢測物而產生高熱變化影響檢測效果，增加了量測的準確度。利用離子通過偵測電極區時觀察電容值之變化，可依離子速度不同將離子快速分析。運用無電鍍製程製作生物晶片不但可可適用於任何基材與形狀，且有著低成本，快速等優點。不但可以使晶片的效能提升，具有成本低廉與製程簡易等優點，也可達晶片量產化之理想。

Traditional microchip are performed using optical detection, utilizing either absorbance or laser–induced-fluorescence. However, these optical detection methods have some drawbacks. During the past few years, contactless conductivity detection has been presented as a valuable extension to optical detection technology. The current study reports a simple and reliable method of micro fabrication technology, electroplating, and electroless technology to fabricate an integrated capacitive detection microfluidic bio-chip. This bio-chip have become a firmly accepted separation analysis technique suitable for complex mixtures owing to its ability to provide extremely high separation efficiencies in relatively short time with small sample volume in low concentration.
A simple and low-cost electrical detection method using contactless electrode pair is developed. Electroless plating and electroplating copper film electrode used as the three dimension(3D) detection electrodes, that placed on the end of micro channel . This detection scheme measures the electrical properties of the sample plugs as they pass-by the detection area. The contactless electrode can avoid the reaction between electrode and samples. Improve the result of detection. The 3D electrode which fabricate by electroless and electroplating technology to increase the detection area .and Improve of the sensitive of detection

目錄
摘要------------------------------------------------------- I

Abstract---------------------------------------------------- II

誌謝------------------------------------------------------- III

目錄------------------------------------------------------- IV

表目錄----------------------------------------------------- VII

圖目錄----------------------------------------------------- VIII

第一章 緒論------------------------------------------------ 1
1.1前言--------------------------------------------------- 1
1.2微機電系統--------------------------------------------- 2
1.3研究動機與目的----------------------------------------- 2
1.4 論文架構---------------------------------------------- 3
第二章 文獻回顧與理論基礎---------------------------------- 4
2.1無電鍍製程發展----------------------------------------- 4
2.1.1 無電鍍特性----------------------------------------- 4
2.1.2 無電鍍銅鍍液之組成--------------------------------- 5
2.1.3 反應機制------------------------------------------- 6
2.2電鍍--------------------------------------------------- 8
2.2.1 電流密度------------------------------------------- 8
2.2.2電流效率-------------------------------------------- 8
2.3微電泳生物晶片----------------------------------------- 9
2.3.1 電泳及其發展史------------------------------------- 10
2.3.2 毛細管電泳技術概論--------------------------------- 11
2.3.3 毛細管電泳原理------------------------------------- 12
2.3.4 毛細管電泳檢測技術--------------------------------- 17
2.3.4.1紫外光/可見光吸收偵測法-------------------------- 18
2.3.4.2 螢光偵測法-------------------------------------- 19
2.3.4.3 質譜偵測法------------------------------------- 20
2.3.5 電化學檢測方法-------------------------------------- 20
2.3.5.1 電導度偵測法------------------------------------- 20
2.3.5.2 電位偵測法--------------------------------------- 21
2.3.5.3 安培偵測法--------------------------------------- 22
2.4 濺鍍原理---------------------------------------------- 22
2.4.1 射頻磁控濺鍍--------------------------------------- 23
2.4.2 反應磁控濺鍍--------------------------------------- 23
第三章 晶片製作及封裝-------------------------------------- 27
3.1 晶片設計---------------------------------------------- 27
3.2光罩製作----------------------------------------------- 27
3.3 晶片製作---------------------------------------------- 28
3.3.1 微流道之製程--------------------------------------- 28
3.3.1.1晶片清洗----------------------------------------- 29
3.3.1.2微影--------------------------------------------- 29
3.3.2 偵測電極之製作------------------------------------- 34
3.3.2.1 晶片清洗---------------------------------------- 34
3.3.2.2 金屬薄膜沉積------------------------------------ 34
3.3.2.2.1金屬濺度-------------------------------------- 34
3.3.2.2.2 無電鍍--------------------------------------- 35
3.3.2.2.3 電鍍金屬------------------------------------- 37
3.3.2.2.4 濺鍍防氧化層--------------------------------- 39
3.3.3 微影及金屬蝕刻------------------------------------- 39
3.3.4 鑽孔對位接合--------------------------------------- 39
3.3.5 晶片封裝------------------------------------------- 44
第四章 製程結果與討論-------------------------------------- 46
4.1晶片量測----------------------------------------------- 46
4.2 樣品分離模式------------------------------------------ 47
4.2.1 傳統十字型分離法----------------------------------- 47
4.2.2 雙L分離法------------------------------------------ 51
4.2.3 改良雙L分離法-------------------------------------- 55
4.3樣品量測----------------------------------------------- 58
第五章 結論與未來展望-------------------------------------- 63
5.1結論--------------------------------------------------- 63
5.2未來展望----------------------------------------------- 63
參考文獻--------------------------------------------------- 64
作者簡介--------------------------------------------------- 70

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