臺灣博碩士論文加值系統

本研究除了對Sn-0.7Cu、Sn-2.6Ag-0.6Cu和Sn-4.0Ag-0.5Cu三種無鉛錫球與傳統Sn-Pb錫球進行基本性質、顯微結構及受熱時效處理影響之探討外，並以實際Ultra CSP 98L為測試元件，搭配SnPb、Sn-3.0Ag-0.5Cu、Sn-7Zn-Al（30-40ppm）三種錫膏及前述四種錫球於OSP及NiAu處理之基板上，於迴銲後經TCT及HTS信賴性測試，再利用DSC、SEM/EDX、EPMA/WDX來探討不同銲接條件。銲接點界面介金屬化合物形成之機構，以及顯微組織與銲接強度、可靠度之間的關係。
實驗結果顯示Sn-Pb錫球主要由富Sn-β相、富Pb-α相固溶體組成，隨時效時間晶粒成長；而無鉛錫球則主要由Sn-β相與共晶IMC組成，隨時效時間富Sn-β相晶粒與IMC顆粒大小均成長，而顆粒數減少。迴銲後錫球外觀則受錫球熔點之影響，隨錫球熔點上升，錫球真圓度變差。在TCT試驗中，錫球禁不起重複熱漲冷縮的應力變化以及尖端應力，而於500次循環發生裂痕，1000次循環後失效。HTS試驗中OSP基板因界面IMC厚度成長而使銲接點強度降低，NiAu基板則因Ni擴散阻障層可減緩界面
IMC的成長，但會因金脆效應而使銲接點強度降低。

In this research, the basic properties、microstructures and the aging effects of Sn-0.7Cu、Sn-2.6Ag-0.6Cu、Sn-4.0Ag-0.5Cu lead-free solder balls and conventional Sn-Pb solder ball are investigated. In addition, commercial Ultra CSP 98L device with above mentimed solder balls and Sn-Pb、Sn-3.0Ag-0.5Cu、Sn-7Zn-Al（30-40ppm）paste are placed on OSP and NiAu PCB. After reflow, samples are gone through TCT and HTS reliability tests. DSC、SEM/EDX、EPMA/WDX are then utilized to study the mechanism of the IMC formation on the interface of the solder joints and the relations
among the microstructures solder joint strength and the reliability.
The results show that Sn-Pb solder ball consists of Sn-rich β phase and Pb-rich α phase solid solutions and both grains grown after long time aging. On the other hand, lead-free solder balls consist of Sn-rich β phase and eutectic IMC phases. Both sizes of β grains and IMC particles increase with aging time. The roundness of the solder balls after reflow decreases with increasing melting point of the solder materials. Due to the cyclying expansion and contraction of the TCT test, cracks are initiated on the interface of the solder ball and chip after 500 cycles and failed after 1000 cycles. Due to the thickness growth of the IMC on the OSP surface finished substrate, the joint strength decreases with increasing aging time of the HTS reliability test. For NiAu substrate, Ni layer acts as a barrier layer which in turn reduces the growth of the interfacial IMC. However, the gold embrittlement may occur which reduces the mechanical strength of
the solder joint.

中文摘要………………………………………………………………………..I
英文摘要………………………………………………………………………Π
致謝……………………………………………………………………......….III
總目錄………………………………………………………………………...IV
圖目錄………………………………………………………………………...VI
表目錄……………………………………………………………………....XIV
第一章 序論………...…………………………………………………………1
第二章 原理與文獻回顧……………………………………………………...3
2-1前言…………………………………………………………………....3
2-2封裝概述 4
2-3晶圓級構裝技術元件簡介 6
2-4無鉛錫球的發展 9
2-5無鉛銲錫與基板界面反應 13
2-6信賴性測試（Reliability Test） 15
2-6-1簡介…………………………………………………………...……..15
2-6-2測試項目…………………………………………………………….17
2-6-3失效分析（Failure Analysis）……………………………..................18
第三章 實驗設計 28
3-1儀器設備 28
3-2實驗流程 29
3-3試片製作 29
3-4信賴性測試 31
3-5試片測試分析………………………………………………………..31
3-5-1錫球、錫膏 31
3-5-2機械強度測試 31
3-5-3顯微觀察 32
3-5-4 EPMA（Electron Probe Micro-Analysis） 33
3-5-5實驗結果分析 33
第四章 結果與討論 46
4-1錫球、錫膏分析 46
4-1-1熱差分析 46
4-1-2錫球表面觀察 46
4-1-3錫球顯微結構 47
4-1-4無鉛錫球深度腐蝕 48
4-2 UCSP元件迴銲後銲接點顯微組織與機械性質測試 48
4-3 TCT信賴性測試 51
4-4 HTS信賴性測試 54
第五章 結論 130
第六章 參考文獻 131

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