臺灣博碩士論文加值系統

微流體晶片發展至今，已有許多如矽、玻璃、高分子、陶瓷等不同基材被應用於晶片製作。由於，高分子塑膠晶片具有熱可塑性、快速成型且容易接合等特性，因此以製程時間與設備成本考量而言，塑膠晶片最具有商品化的潛力。但除了鐵氟龍系、聚亞醯胺或聚烯類等的高分子聚合物外，常用之塑膠晶片並不耐有機溶液，接觸有機溶劑後容易有澎潤或是溶解的現象，因此會造成管道阻塞或改變表面特性等問題。因此，有研究以鐵氟龍作為基材製作微流體晶片，利用其優良之耐酸鹼與有機溶液之特性，以及鐵氟龍具有優良之生物相容性，作為可長時間操作之微流體晶片。然而，鐵氟龍具有高化學惰性之表面，其製程及封裝需要較高之接合操作溫度(>260oC)，並不利於低溫封裝製程，而有所限制。
本研究開發一鐵氟龍基材之低溫封裝技術，利用自行開發之氨水氣體電漿，進行鐵氟龍基材之表面改質，以達到增加鐵氟龍基材之表面親水性與黏著性。研究結果顯示，鐵氟龍表面經氨水電漿以150 watt處理5分鐘後之水滴角由95o下降至45o，ESCA表面成分分析檢測顯示，以氨水電漿之去氟效果較佳，氟/碳原子比例由處理前之1.96降至約1.10，而在強度測試，施予15 kg/cm2壓力接合之試片強度顯示，電漿處理後接合強度約為未處理的2倍，且隨著接合溫度越高其接合強度越高，於260oC及15 kg/cm2之壓合條件下，鐵氟龍晶片之接合強度可接近0.3 MPa。此外，電漿處理並不會明顯改變鐵氟龍基材之表面粗糙度，量測結果顯示電漿處理僅增加15±5 nm之平均表面粗糙度(Ra)，其對於一般之微流體應用影響不大。本研究所發展之製程技術與現今商業化上，使用化學藥劑的處理方式中，所會造成表面粗糙度大幅上升及產生惡臭有所不同，為一非常環保之技術。最後結合螢光光學架構與十字晶片，成功偵測與分離出ΦX-174之DNA樣品片段，証實鐵氟龍基材可作為微流體塑膠晶片之應用。

Microfluidics emerged during the early 1990s with channel networks in silicon or glass. Microprocessing of these materials is labor-intensive and time-consuming, it requires sophisticated equipment in a clean room, and often involves hazardous chemicals. The subsequent use of polymer greatly simplified the fabrication of microchips and led to the rapid development of the field. Polymer such as poly(dimethylsiloxane) (PDMS), has other attractive properties, such as being elastic (easy to make efficient microvalves), permeable to gases, and compatible with culturing biological cells. Despite these advantages, applications of PDMS chips are severely limited by a few drawbacks that are inherent to this material: (i) strong adsorption of molecules, particularly large biomolecules, onto its surface; (ii) absorption of nonpolar and weakly polar molecules into PDMS bulk; (iii) leaching of
small molecules from PDMS bulk into solutions; and (iv) incompatibility with organic solvents. To overcome all these problems, Teflon plastics seem to be the perfect solution. They are well-known for their superior inertness to almost all chemicals and all solvents; they also show excellent resistance to molecular adsorption and molecule leaching from the polymer bulk to solutions. However, Teflon has a high chemical inertness of the surface, which is restricted the bonding temperature (>260°C).It is not conducive to the low-temperature packaging process.
This study presents a simple and rapid process for sealing Teflon-based microfluidic chip at a temperature of 140oC which is lower than typical bonding temperature of 260oC. A simple ammonium plasma treatment is used to enhance the surface energy of Teflon substrates such that the bonding temperature can be greatly reduced. Results indicate that the ammonium plasma treated Teflon substrates can be sealed using hot press bonding at a temperature of 140oC for 20 min. The measured
iv
bonding strength for the Teflon-based microfluidic devices is higher than those bonded at a reported temperature of 260oC for 60 min. It shows the measured contact angle for the Teflon substrates treated with different plasmas. Results indicated that the ammonium hydroxide plasma exhibited the best wettability property and the contact angle reached the minimum value of 45o after 5 min of treatment. The ESCA analysis showed the best Defluorination by ammonium plasma. The fluorine/carbon atomic ratio degraded from 1.96 to 1.10 by 5 minutes. The measured bonding strength for the Teflon substrates bonded with different surface activation protocols. Results showed that the bonding strength was enhanced upto 93% after the plasma treatment. The plasma treatment not only enhanced the bonding strength but also reduced the bonding temperature and time. The measured surface roughness only increased 15±5 nm (Ra) after the plasma treatment, which is acceptable for most applications in microfluidic systems. Finally, the fluorescence optical architecture and cross-chip successfully detected and isolated ΦX-174 fragment of DNA samples confirmed the Teflon substrate for the emerging microfluidic plastic chip. The developed method provides a simple and rapid way to fabricate Teflon-based microfluidic devices.

中文摘要........ ................................................................................................................. i
Abstract ..........................……………………………………………………………...iii
目錄….. .......................................................................................................................... v
圖目錄.. ........................................................................................................................vii
表目錄.. .......................................................................................................................... x
符號表.. ......................................................................................................................... xi
簡寫表.. ........................................................................................................................xii
第一章 緒論 .................................................................................................................. 1
1.1 前言 ................................................................................................................. 1
1.2 微流體晶片 ..................................................................................................... 2
1.3 研究動機與目的 ............................................................................................. 3
1.4 文獻回顧 ......................................................................................................... 6
1.5 論文架構 ....................................................................................................... 15
第二章 材料特性及原理介紹 .................................................................................... 17
2.1 鐵氟龍材料介紹 ........................................................................................... 17
2.2 電漿 ............................................................................................................... 20
2.2.1 電漿簡介 .................................................................................................... 20
2.2.2 輝光放電 (Glow Discharge) ..................................................................... 21
2.2.3 電漿的應用 ................................................................................................ 22
2.3 毛細管電泳 ................................................................................................... 23
2.3.1 毛細管電泳原理 ........................................................................................ 23
2.3.2 電泳現象 (Electrophoresis Phenomenon) ................................................ 24
2.3.3 電滲現象 (Electroosmosis Phenomenon) ................................................. 25
2.4 螢光的理論與應用 ....................................................................................... 29
第三章 實驗架構與方法 ............................................................................................ 32
3.1 玻璃母模製作 ............................................................................................... 32
3.2 熱壓鐵氟龍晶片與非典型溫度接合 ........................................................... 35
3.2.1 熱壓成型 .................................................................................................... 35
3.2.2 鐵氟龍表面電漿改質接合 ........................................................................ 36
3.3 光學系統架設與電泳測試 ........................................................................... 38
3.4 實驗儀器與藥品 ........................................................................................... 40
第四章 結果與討論 .................................................................................................... 42
4.1 接合鐵氟龍晶片與抗化學溶液測試 ........................................................... 42
4.2 接觸角量測 ................................................................................................... 45
4.3 表面粗糙度量測 ........................................................................................... 47
4.4 ESCA 表面成分分析 .................................................................................... 49
4.5 接合強度測試 ............................................................................................... 53
4.6 CE電泳晶片測試 ......................................................................................... 54
第五章 結論與未來展望 ............................................................................................ 63
5.1 結論 ............................................................................................................... 63
5.2 未來展望 ....................................................................................................... 64
自述….. ........................................................................................................................ 65
參考文獻 ...................................................................................................................... 66

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