臺灣博碩士論文加值系統

本文利用感應加熱技術對模具快速加熱作研究探討，透過提高模穴表面溫度的方式以改善微結構射出成型時填充過程中因流道淺流動阻力大而造成成型上的困難，利用此技術不但可以解決成型問題、維持產品品質和助於表面微結構的轉寫性，更可以大幅縮短成型週期，因此開發快速加熱、冷卻系統是本研究主要目的。研究中主要利用ANSYS分析軟體來模擬感應線圈對於模板加熱的溫度情形，並配合實驗做驗證。經過模擬和實驗知道高導磁材料具有較佳的感應加熱，可使模具表面溫度迅速上升。而對於施予的電流值、感應線圈的配置和頻率等參數也會影響最後模穴表面溫度。本研究結果顯示實驗與分析都能得到相同的溫度趨勢，利用此模擬方法將可設計更多元多種變化的線圈形式運用於模具身上，以得到各線圈設計在感應加熱中對模具表面控制溫度的效能及可行性。

This thesis researches the mold rapid heating with embedded coil by induction heating technique. Due to the poor flow capability of melting plastics into micro channel, it is difficult to inject the melted plastics into the cavities of the mold. In order to let the injection technique be used in the fabrication of microfluidic chip, raising cavity surface temperature will be one of the solutions. High mold temperature could improve the replication capacity of micro-structures, the problems of injection, the quality of products, and effectively reduces the cycle-time. Therefore, developing systems for rapidly heating and cooling for injection of microfluidic chip is the main objective of this study. We used CAE software-ANSYS to simulation the coil that heating the mold plate as compared with experiment. It is known the high permeability materials could make mold surface rapid heating by simulation and experiment. Coil current, coil to plate distance and frequency etc. could affect the mold surface temperature, too. The capability and accuracy of simulations on the induction heating are verified from experiments, the simulated temperature distributions show reasonable agreement with measured results. We can do complex coil design and use ANSYS software to analysis. To evaluate the feasibility and efficiency of induction heating on the mold surface temperature control.

中文摘要 i
ABSTRACT ii
誌謝 iv
表目錄 vii
圖目錄 viii
第一章 緒論 1
1.1 前言 1
1.2 研究動機 2
1.3 文獻探討 3
1.4 論文架構 8
第二章 感應加熱原理 9
2.1 感應加熱之簡介 9
2.2 電磁效應 11
2.2.1 集膚效應（Skin Effect） 11
2.2.2 鄰近效應 12
2.2.3 邊界效應 13
2.2.4 磁場集中效應 14
2.3 焦耳效應 14
2.3.1 磁滯損失（Hysteresis Loss） 14
2.3.2 渦流損（Eddy Current Loss） 15
2.4 加工物件之特性 17
2.4.1 電阻係數 17
2.4.2 相對導磁係數 18
2.4.3 溫度分佈 20
2.4.4 加熱時間 20
2.5 感應加熱之優點 21
第三章 電腦輔助工程之磁熱耦合分析 23
3.1 統御方程式 23
3.1.1 電磁場統御方程式 23
3.1.2 溫度場統御方程式 26
3.2 ANSYS基本分析流程 26
3.3 ANSYS耦合分析 28
3.4 感應加熱模板之模擬 30
3.4.1 模板材料為鋼材 30
3.4.2 模板材料為鋁材 40
3.5 傳導型模具之加熱模擬 44
3.5.1 電磁場分析 44
3.5.2 溫度場分析 47
第四章 實驗設備與方法 49
4.1 使用設備 49
4.2 實驗方法 58
第五章 結果與討論 61
5.1 實驗量測結果 61
5.1.1 以電熱管加熱模板 61
5.1.2 以高週波感應加熱鋼板 62
5.1.3 以高週波感應加熱鋁板 64
5.1.4 以高週波感應加熱傳導型模具 66
5.2 實驗結果與模擬分析驗證 67
5.2.1 加熱鋼板之實驗與模擬驗證 67
5.2.2 加熱鋁板之實驗與模擬驗證 68
5.2.3 傳導型模具之實驗與模擬驗證 69
第六章 結論與未來研究 71
6.1 結論 71
6.2 未來研究方向 72
參考文獻 73
作者簡介 77

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