臺灣博碩士論文加值系統

本研究主要利用動態機械分析儀（DMA）之測試，探討商業用AZ80合金和LAZ1110鎂鋰合金在各溫度下之制振能，並藉由硬度量測、顯微組織觀察與XRD分析等，協助瞭解冷軋延或時效處理對鎂合金制振能的影響，以及各個制振峰及200-300℃區間高溫制振背景值（HTDB）之機制。經測試結果顯示，AZ80合金在HTDB的溫度區間內，不論有無後續的100℃時效處理，經過20%冷軋延後其HTDB制振能皆可獲得明顯的提升。然而，形成HTDB的活化能卻在冷軋延後由1.69eV降至1.37eV，表示冷軋過程會加速合金內部之擴散作用，並同時促進潛變的發生。因此，當AZ80合金的應用拓展到HTDB之溫度區間時，冷軋延對其制振能以及抗潛變能力的正反兩面影響，是需要被審慎考量的。對LAZ1110合金而言，無論是剛取得之擠製板材或者不同程度之冷軋薄板，其制振能於升溫過程依序均有P1、P2與P3三個制振峰出現。而冷軋程度愈大者，不僅於室溫下tanδ值愈高，其P3峰頂的溫度也會愈往低溫平移，且均在鎂金屬的再結晶溫度200℃附近。經研究結果推斷，鎂鋰合金有P3峰的出現與基材上β(200)優選晶位極為相關，且在大量冷軋延後還涉及再結晶作用。另外，以0.1Hz之低頻率對80%冷軋延之LAZ1110合金薄板進行DMA測試，可於室溫下有效達到高制振能材料之標準（即tanδ≧0.03）。

Damping capacities (DCs) of AZ80 and LAZ1110 magnesium alloys are investigated by Dynamic Mechanical Analyzer (DMA) at the temperature range of 0-300℃. DC of the high-temperature damping background (HTDB) at 200-300℃ for AZ80 alloy increases significantly after 20% cold-rolling with or without aging. However, the activation energy of HTDB decreases from 1.69eV to 1.37eV, which indicates cold-rolling can accelerate alloy’s diffusion process and promote its creep development simultaneously. Consequently, the contrary cold-rolling effect on DC and creep resistance of AZ80 alloy should be taken into account carefully for its high-temperature applications. Three damping peaks P1, P2 and P3 are observed for LAZ1110 Mg-Li alloy. Severe cold-rolling can effectively improve the DC of LAZ1110 alloy at room temperature. The P3 peak located at about 200℃ shifts to lower temperature if the extent of cold-rolling increases. Experimental results show that, after severe cold-rolling, the formation of P3 peak is well-related to β(200) preferred orientation and caused by recrystallization process. Besides, high damping criterion (tanδ≧0.03) can be met at room temperature for 80% cold-rolled LAZ1110 sheet tested at 0.1Hz low frequency or at 30-35μm operating amplitude.

誌謝……………………………………………………………………………...…...…..i
中文摘要..........................................................................................................................iii
英文摘要...........................................................................................................................v
目錄………………………………………………………………………………….…vii
第一章 前言….................................................................................................................1
第二章 文獻回顧.............................................................................................................3
2-1 簡介………………...……..…..........................................................................3
2-2 鎂與鎂合金之應用………………………………………….….………….…3
2-3 鎂合金之成分及命名方法…...........................................................................4
2-4 鎂合金添加元素之影響…...………………………………………………....5
2-4-1 常見之合金元素……………………………………………………….5
2-4-1-1 鋁（Al）…………………………………………………….……5
2-4-1-2 鋅（Zn）……………………………………………………….....5
2-4-1-3 錳（Mn）………………………………………………….……...6
2-4-1-4 鋯（Zr）………………………………………………………….6
2-4-1-5 鋰（Li）…………………………………………………………..6
2-4-1-6 矽（Si）……………………………………………………...…...7
2-4-1-7 鈣（Ca）………………………………………………………….7
2-4-1-8 稀土元素（RE）………………………………………..………..7
2-4-2 微量添加元素……………………………………………………...…..8
2-4-2-1 雜質：鐵（Fe）、鎳（Ni）、銅（Cu）…………………………...8
2-4-2-2 鈹（Be）…………………………...………………………..……8
2-4-2-3 鈧（Sc）………………………………………………………...8
2-5 AZ系列鎂合金…………………………………..............................................8
2-6 鎂鋰合金……………………..……………………………………………...10
2-6-1 BCC/HCP結構間之晶位關係…………………………………….….10
2-6-1-1 軸向比之相依性……………………………………………...10
2-6-1-2 結晶方位關係……………………………………………..….12
2-6-2 顯微結構之演變……………………………………………….……..12
2-7材料之阻尼特性…………………………………………………………..…13
2-7-1 材料內部的能量散失…………………………………………...…....13
2-7-2 阻尼特性之流變模型…………………………………………….…..13
2-7-3 高制振能材料………………………………………………………...16
2-8 金屬材料之阻尼機制…...…...………………………………………….…..18
2-8-1點缺陷制振峰………………………………………………..………..18
2-8-1-1 Snoek效應……………………………………………...……...18
2-8-1-2 Zener效應……………………………………………..………19
2-8-2 差排制振峰……………………………………………….…….…….19
2-8-3 晶界制振峰…...……………………………………………………....19
2-8-4 高溫制振背景值（HTDB）………………………………………...….20
第三章 實驗方法與儀器...............................................................................................39
3-1 實驗流程…………………………......……………………………………...39
3-2 材料來源.........................................................................................................39
3-2-1 AZ80合金…...……………………………………………………...…39
3-2-2 LAZ1110合金…...……………………………………………….....…40
3-3 密度量測.........................................................................................................40
3-4 冷軋延（Cold Rolling，CR）.........................................................................41
3-5 熱處理….........................................................................................................41
3-6 DMA分析.........................................................................................................42
3-6-1 DMA2980之本體組成與附加組件……………………………..……42
3-6-2 DMA2980之儀器規範……………………………………..…………43
3-6-3 單╱雙懸臂之間的考量………...…………………………………....44
3-6-4 試片的製備要點…………………………………………….……..…44
3-7 顯微組織觀察……………...……………………………………………...…45
3-7-1 一般金相觀察………………………………………………......…….45
3-7-2 穿透式電子顯微鏡（Transmission Electron Microscope，TEM）……45
3-8 XRD分析……………………………………………………...…………...…45
3-9 維氏硬度測試（Microvickers Hardness Test）………………….……….…...46
第四章 AZ80合金之制振能探討.................................................................................55
4-1剛取得之AZ80板材制振能............................................................................55
4-1-1 基本制振特性………………………………………………………...55
4-1-2 與純鎂或其他AZ系列鎂合金之制振能比較…………………...….56
4-1-3 頻率對制振能之影響……………………………………………...…57
4-1-4 振幅對制振能之影響………………………………………………...58
4-2 不同熱機處理條件下之硬度量測…………………………………...…...…60
4-3 冷軋延後AZ80薄板之制振能......……………..……………………………60
4-3-1 冷軋延對制振能之影響…………………………………………...…61
4-3-2 金相觀察……………………………………………………………...62
4-3-3 頻率對制振能之影響………………………………………………...62
4-4 冷軋延且時效過後AZ80薄板之制振能……................................................62
4-4-1時效溫度對制振能之影響……………………………………............63
4-4-2時效時間對制振能之影響…………...…………………………….…64
4-5 高溫制振背景值（HTDB）之分析與探討…………………………………65
4-5-1 HTDB活化能之數據分析……………………………………………65
4-5-2 冷軋延對HTDB之影響…………………………………………..….67
4-5-3 不同合金之HTDB比較………………………………………….…..68
4-5-4 100℃時效對HTDB之影響……………………………………….….69
第五章 LAZ1110合金之制振能探討……………………...…………………………87
5-1 密度量測………………………………………………………………...…..87
5-2 剛取得之LAZ1110板材制振能……………………………………………87
5-2-1 基本制振特性……………………………………………………...…87
5-2-2 熱循環之影響……………………………………………………..….88
5-3 冷軋延後LAZ1110薄板之制振能…………………………………………89
5-3-1 冷軋程度對制振能之影響…………………………………………...89
5-3-2 不同於軋延方向對制振能之影響…………………………………...91
5-3-3 振幅對制振能之影響………………………………………………...92
5-3-4 室溫╱100℃時效對制振能之影響………………………………….93
5-4 DMA測試過程之顯微組織變化………………………………………...….94
5-4-1 硬度量測…………………………………………………………...…95
5-4-2 顯微組織觀察………………………………………………………...96
5-4-3 XRD之分析結果………………………………………………….…..98
5-5 頻率對LAZ1110合金制振能之影響………………………………..……..99
5-6 制振峰P1、P2與P3之機制探討…………………………………...………..101
第六章 結論.................................................................................................................121
參考文獻.......................................................................................................................125

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