臺灣博碩士論文加值系統

聚對苯二甲酸乙二酯(Polyethylene Terephthalate，PET)相較於其他軟性塑膠基板具有價格優勢，且抗蝕性強，但由於塑膠基板親水性差及耐熱性低，所以常需經過適當的表面處理，方能進行後續濕式金屬化製程。本研究利用浸泡鹼液及表面研磨的方式大幅增加了PET材料的潤濕性，並成功地於45℃下將銀與鎳接續沉積於PET表面，其中所使用的還原劑分別為葡萄糖與次磷酸鈉，未加入高毒性化學物質。此外，利用電化學技術分析了鍍液各成分、溫度與質傳效果對銀沉積或鎳沉積的影響。鍍層性質分析結果顯示，在適當的操作條件下，PET上所沉積銀層的片電阻為14.09 mΩ/sq；鎳層/銀層/PET為92.53 mΩ/sq。另外，在化學鍍鎳過程中，本論文創新以金屬鋅誘發鎳離子還原，使化學鍍鎳活化能降低，有效的讓鎳沉積於試片；經由簡化的動力學推算可知，該反應的總階數為一級反應。論文中各項操作變因的研究成果，有助於應用於軟性塑膠板濕式金屬化的條件控制。

Polyethylene terephthalate (PET) has price advantage and strong corrosion resistance compared to other flexible plastic substrates. However, the plastic substrates are poor in hydrophilicity and heat resistance. In order to carry out the wet metallization process on plastic substrates, the appropriate surface treatment is important. In this study, the wettability of PET was increased by soaking in alkaline solutions and surface grinding. Furthermore, the silver and nickel were deposited on PET by chemical plating at 45°C with glucose and sodium hypophosphite as reducing agents, respectively, instead of toxic chemicals. In addition, the effects of various bath components, temperature and mass transfer on silver or nickel deposition were analyzed using electrochemical techniques. The results of plating film analysis showed that the sheet resistance of the deposited silver on PET was 14.09 mΩ/sq and the nickel/silver/PET was 92.53 mΩ/sq under optimum operating conditions. Moreover, this study used zinc to reduce nickel ion on PET and discussed the kinetic mechanism. Due to zinc with high activity, the activation energy of electroless nickel plating decreased. The order of the overall reaction is first-order known by simplified kinetic calculation. The research results of the various operation factors in this study are helpful for the applications on wet metallization of flexible plastic plates.

摘要 i
ABSTRACT ii
誌謝 iv
目錄 v
表目錄 vii
圖目錄 viii
第一章 緒論 1
1.1 化學鍍簡介 1
1.2 塑膠基材簡介 2
1.3 化學鍍於塑膠上之應用 5
1.4 研究動機 7
第二章 文獻回顧 9
2.1 高分子基板前處理 9
2.2 化學鍍銀技術及應用 17
2.3 化學鍍鎳技術及應用 20
第三章 基本原理 25
3.1 化學鍍原理 25
3.2 接觸角量測儀 30
3.3 片電阻測量原理 32
3.4 掃描式電子顯微鏡 34
3.5 電化學線性掃描伏安法 36
第四章 實驗設備與方法 39
4.1 實驗藥品與材料 39
4.2 實驗儀器與設備 40
4.3 實驗步驟 41
4.3.1 PET試片前處理 43
4.3.2 電化學技術分析鍍液 44
4.3.3 PET金屬化程序 46
4.3.4 鍍後分析 52
第五章 結果與討論 54
5.1 蝕刻與拋磨對PET表面之影響 54
5.2 PET上化學鍍銀 64
5.2.1 電化學技術分析鍍液 64
5.2.2 銀鍍層特性分析 68
5.2.3 鍍液各成分的影響 69
5.3 Ag/PET上化學鍍鎳 75
5.3.1 電化學技術分析鍍液 75
5.3.2 鎳鍍層特性分析 84
5.3.3 鍍液各成分的影響 91
5.4化鍍反應動力學分析 100
第六章 結論 105
參考文獻 106
符號彙編 111

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