臺灣博碩士論文加值系統

拜科技所賜，如今紅外線熱影像(Infrared Thermal Imaging)相關傳感器已相當多樣；相較過去，熱像儀等相關產品已相對容易取得。過去，熱影像產品不僅高價、低解析且侷限於軍事用途；至今，大眾已可以相對較低價錢購得一定水準之熱像儀。結合紅外線因溫度不同而有不同反射強度之特性，研究並設計此「基於熱像儀系統之溫度校正及校正工具設計」，使低成本熱像儀更多樣化。
因此，本論文透過具有USB高速傳輸機制及低成本之既有熱像儀設計作為基礎，採用其低成本及高速傳輸機制之優點，並將其熱影像由灰階轉換為彩色影像，結合溫度校正及量測功能，使系統不僅可讀取熱影像資料更可量測溫度。
誠如前述，因本系統設計包含溫度校正功能；為使溫度校正得以更加準確，本論文除具溫度校正功能之熱像儀系統設計外，更以閉迴路(Closed loop)方式設計以PID(Proportional Integral Derivative)控制器為核心之溫度控制系統，使溫度控制更加準確，提升本熱像儀之準確性，以達到溫度量測結合熱影像之系統設計目的。

With the development of this technology, there are an increasing number of infrared array sensors. In the past, thermal imagers were expensive, and the resolution was poor quality. Besides, most of the thermal imagers were not permitted for use outside of the military. Nowadays, everyone can get a thermal imager much more easily. The resolution is higher, and the price is cheaper, or cost effective.
Combined with characteristics of infrared, this thesis uses infrared sensors to design the thermal imaging, and it includes calibration technology. Thus, the thermal imagers from this thesis display not only the thermal images but also the temperature.
This paper is based on the Master’s Thesis: Low-cost of Thermal Imaging System Design with USB High-speed Transmission Mechanism. Building upon the advantages of low-cost and high-speed, and transforming the thermal image from gray-scale images to true color images, the goal of this thesis is to increase the usefulness of thermal imaging systems.
This thermal imager is used to measure temperature, so calibration plays an important role in the design. To increase the accuracy of the calibration, the thesis also designs an environment for calibration. The PID controller and temperature sensor (both with K-type thermocouples) were used to offer a stable temperature measurement for calibration.

摘要 i
ABSTRACT ii
誌謝 iv
目錄 v
表目錄 viii
圖目錄 x
第一章 緒論 1
1.1前言 1
1.2研究動機與目的 3
1.3文獻探討 4
1.4研究方法 5
1.4.1應用 5
1.4.2校正 6
1.5論文架構 7
第二章 相關知識介紹 8
2.1 PID控制器 8
2.2 內插法 11
2.3 二值化 12
2.4 閾值 12
2.5 假色 13
2.6通訊介紹 14
2.6.1 SPI 14
2.6.2 UART 15
第三章 系統架構與設計原理 16
3.1 系統架構 16
3.2 MCU介紹 18
3.3 溫度感測器介紹 19
3.3.1 熱電耦 20
3.4 通訊命令制定 21
3.4.1 主系統通訊命令 22
3.4.2 校正系統通訊命令 25
3.5熱影像主系統設計 27
3.5.1熱影像主系統 28
3.5.2應用程式 29
3.6校正系統設計 30
3.6.1 校正作業 31
3.6.2 校正環境 32
第四章 實驗結果與分析 34
4.1實驗及開發環境 34
4.2實驗輔具 35
4.3系統功耗量測 38
4.4操作說明 40
4.4.1主系統操作說明 41
4.4.2校正系統操作說明 42
4.5實驗結果 44
4.5.1 主系統實驗結果 45
4.5.2 校正系統實驗結果 51
4.5.3 聯合測試結果 57
第五章 結論與未來展望 66
5.1 結論 66
5.2 未來展望 66
參考文獻 67
附錄A 中英文對照表 72
附錄B 符號及代號彙編 75
附錄C 公式彙編 76
附錄D 作者簡介 77

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