臺灣博碩士論文加值系統

本論文提出封包追蹤放大器(Envelope tracking Amplifier ; EA)與可應用於多通訊系統之多頻功率放大器(multi-band power amplifier)，如寬頻分碼多工(Wide band Code Division Multiple Access ; WCDMA)、 長期演 進技術 (Long Term Evolution ; LTE)、802.11g 與 802.11n。封包追蹤放大器是由線性級(Linear-Mode Stage ; LMS)與開關級(Switch-Mode Stage ; SMS)所組成，並且追蹤封包波形與射頻訊號波形來使得功率消耗得以減少。因此，比起一般固定供應電源之功率放大器，封包追蹤功率放大器的功率附加效率(Power Added Efficiency ; PAE)能夠有所提升。在功率放大器中藉由使用切換電容的方式，可以使多頻功率放大器得以在不同切換操作頻率 1.9GHz、2.2GHz 與 2.5GHz 之間切換，並且可以使用於WCDMA、LTE、802.11g 與 802.11n。主動式的溫度補償電路可以有效的減少溫度變異所帶來的特性退化，並且使用功率結合式的輸出匹配網路來提升輸出功率。在 1.9GHz 時量測之功率增益與 1dB 壓縮點的輸出功率分別為 38.16dB 與
27.23dBm，2.2GHz 時為 37.5dB 與 28.06dBm，2.5GHz 時為 40.64dB 與 27.06dBm。最後經由實驗結果證明，所提出之整體封包追蹤功率放大器(Envelope Tracking Power Amplifier ; ETPA)架構與固定供應電源之功率放大器相比較後，在相同的輸出功率點下，其功率消耗減少了 0.6969 瓦。

This thesis proposed an envelope tracking amplifier and a multi-band power amplifier for the multi-standard communication system such as WCDMA, LTE, 802.11g, and 802.11n. The envelope tracking amplifier is consisted of the linear-mode stage and the switch-mode stage, and that is tracking the envelope waveform and RF carrier waveform to reduce the power consumption. Hence, the power added efficiency of the power amplifier can be improved compared to the power amplifier with the fixed supply voltage. By using the capacitor switching network in the power mplifier, the multi-band power amplifier can be achieved, such as 1.9 GHz, 2.2 GHz, and 2.5 GHz for WCDMA, LTE, 802.11g, and 802.11n. The active temperature compensation circuit is adopted to reduce the temperature variation, and the power combining network is used to increase the output power. The measured power gain and 1-dB compensated output power are 38.16 dB and 27.23 dBm for 1.9 GHz, and 37.5 dB and 28.06 dBm for 2.2 GHz, and 40.64 dB and 27.06 dBm for 2.5 GHz. Finally, the measured results demonstrated that the proposed envelope tracking power amplifier reduced about 0.6969 watt compared to the stand-alone power amplifier.

中文摘要………………………………………….………………………………….i
英文摘要………………………………………….…………...…………………….ii
目錄………………………………………….……………………..……………….iii
圖目錄………………………………………….…………………..………………..v
表目錄………………………………………….……………………..…………...viii
第一章 緒論………………………………………….…………………………….1
1.1、概論………………………………………………….……….……………1
第二章 封包追蹤放大器……………………………………….…………………4
2.1、運作原理……………………………………….…………………….……4
2.2、線性級……………………………………….…………………………….8
2.3、開關級……………………………………….…………………………...11
2.3.1、比較器……………………………………….……………………12
2.3.2、防貫穿電流電路……………………………………….….………19
2.3.3、降壓式直流轉換器………………………………………..………23
2.4、封包追蹤放大器模擬結果……………………………………….………26
2.5、封包追蹤放大器量測結果與設計流程…………………………..………31
2.5.1、電路設計流程……………………………………….…….………31
2.5.2、測試載板與電路佈局…………………………………………..…32
2.5.3、量測環境架設…………………………………………………..…35
2.5.4、封包追蹤放大器量測結果……………………….……………..…37
第三章 可調式多頻段功率放大器……………………………………………...39
3.1、可調式功率放大器研究動機…………………………………………….39
3.2、應用於切換頻段之開關…………………………………………………41
3.3、具溫度補償偏壓電路…………………………………….………………42
3.4、功率結合變壓器……………………………………….…………………43
3.5、功率放大器重要參數………………………………………….…………44
3.5.1、汲極效率(Drain/Collector Efficiency) ……………………………44
3.5.2、功率附加效率(Power Added Efficiency ; PAE) ……….…………45
3.5.3、功率增益(Power Gain) …………………………………...………45
3.5.4、穩定度分析…………………………………………………..……45
3.6、可調式功率放大器模擬結果………………………………………….…48
3.6.1、小訊號散射參數模擬……………………………………………..50
3.6.2、大訊號參數模擬結果……………………………………..………52
3.6.3、穩定度分析與模擬………………………………………..………54
3.7、可調式功率放大器量測結果……………………………………….……55
3.7.1、電路設計流程……………………………………………………..55
3.7.2、小訊號流程……………………………………………………..…56
3.7.3、大訊號流程………………………………………………………..57
3.7.5、電路佈局…………………………………………………………..58
3.7.6、小訊號散射參數量測結果………………………………………...59
3.7.7、大訊號參數量測結果……………………………………………..61
第四章 具封包追蹤之多頻段功率放大器……………………………………...63
4.1、具封包追蹤之多頻段功率放大器……………………………………...63
4.2、具封包追蹤放大器模擬結果…………………………………………….65
4.3、具封包追蹤放大器量測流程…………………….………………………67
4.4、具封包追蹤放大器量測結果……………………………………………68
第五章 結論與未來展望……………………………. …………………………..70

[1] Lawrence E. Larson, “A combined series-parallel hybrid envelope amplifier for
envelope tracking mobile terminal RF power amplifier applications” IEEE
Journal of Solid-State Circuits, vol. 47, no. 5, May 2012
[2] Haitao Zhang, Huai Gao, and Guann-Pyng Li, “Broad-band power amplifier with
a novel tunable output matching network” IEEE Transactions on Microwave
Theory and Techniques. vol. 53, no. 11, pp.3606-3614, Nov. 2005.
[3] Hua Wang, Constantine Sideris, and Ali Hajimiri “A CMOS broadband power
amplifier with a transformer-based high-order output matching network” IEEE
Journal of Solid-State Circuits, vol. 45, no. 12, Dec. 2010
[4] Huei Wang et al., “A high-efficiency, broadband CMOS power amplifier for
cognitive radio applications,” IEEE Transactions on Microwave Theory and
Techniques. vol. 58, no. 12, pp.3556-3565, Dec. 2010.
[5] Bumman Kim et al., “A 30.8-dbm wideband CMOS power amplifier with
minimized supply fluctuation,” IEEE Transactions on Microwave Theory and
Techniques. vol. 60, no. 6, pp.1658-1666, June 2012.
[6] A. F. Aref and R. Negra, “A fully integrated adaptive multiband multimode
switching-mode CMOS power amplifier,” IEEE Transactions on Microwave
Theory and Techniques, vol. 60, no.8, Aug. 2012.
[7] Donald Y. C. Lie, et al., “A fully monolithic BiCMOS envelope-tracking power
amplifier with on-chip transformer for broadband wireless applications” IEEE
Microwave and Wireless Components Letters, vol. 22, no. 6, JUNE 2012
[8] Peter M. Asbeck, et al., “A wideband CMOS/GaAs HBT envelope tracking
power amplifier for 4g LTE mobile terminal applications” IEEE Transactions on
Microwave Theory and Techniques, vol. 60, no. 5, May 2012
[9] Lawrence E. Larson, et al., “Design of a wideband high-voltage high-efficiency
BiCMOS envelope amplifier for micro-base-station RF power amplifiers” IEEE
Transactions on Microwave Theory and Techniques, vol. 60, no. 6, June 2012
[10] Mohammad K. Alghamdi , and d Anas A. Hamoui ,“A spurious-free switching
buck converter achieving enhanced light-load efficiency by using a ∆∑-modulator
controller with a scalable sampling frequency”

IEEE Journal of Solid-State
Circuits, vol. 47, no. 4, April 2012
[11] Lis K. Nanver, et al., “Adaptive multi-band multi-mode power amplifier using
integrated varactor-based tunable matching networks” IEEE Journal of Solid-
State Circuits, vol. 41, NO. 9, Sep. 2006
[12] Youngoo Yang, Kevin Choi, and Kenneth P. Weller, “Dc boosting effect of active
bias circuits and its optimization for class-AB InGap–GaAs hbt power amplifiers”
IEEE Transactions on Microwave Theory and Techniques, vol. 52, no. 5, May
2004
[13] Ji H. Kim, Joon H. Kim, Youn S. Noh, and Chul S. Park “A low quiescent current
3.3v operation linear MMIC power amplifier for 5 GHz WLAN applications” in
IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, Jun.2003, pp.867-870.
[14] Kevin T. Kornegay et al., “A fully-integrated high-power linear CMOS power
amplifier with a parallel-series combining transformer,” IEEE Journal of Solid-
State Circuits, vol. 47, no. 3, pp.599-614, Mar. 2012.
[15] Kevin T. Kornegay et al., “A linear multi-mode CMOS power amplifier with
discrete resizing and concurrent power combining structure,” IEEE Journal of
Solid-State Circuits, vol. 46, no. 5, pp.1034-1048, May 2011.
[16] Tsu-Jae King Liu et al., “Fully integrated CMOS power amplifier with efficiency
enhancement at power back-off,” IEEE Journal of Solid-State Circuits, vol. 43,
no. 3, pp.600-609, Mar. 2008.
[17] Joy Laskar et al., “Power-combining transformer techniques for fully-integrated
CMOS power amplifiers,” IEEE Journal of Solid-State Circuits, vol. 43, no. 5,
pp.1064-1075, May. 2008.
[18] 美商高通公司。RF360。[online]http://www.qualcomm.com/chipsets/gobi/rf-
solutions/qualcomm-rf360-front-end
[19] Bumman Kim, et al., “A dual power-mode multi-band power amplifier with
envelope tracking for handset applications” IEEE Journal of Solid-State Circuits,
vol. 61, NO. 4, April 2013
[20] Donald Y. C. Lie, et al., “A SiGe envelope-tracking power amplifier with an
integrated CMOS envelope modulator for mobile WiMAX/3GPP LTE
transmitters” IEEE Transactions on Microwave Theory and Techniques, vol. 59,
no. 10, Oct. 2011