臺灣博碩士論文加值系統

　　伴隨著微機電技術的發展，微平台已經被使用多年。近年來大部分的微平台設計都著重於新致動機制、新材料與新製程的應用。在利用結合機構設計概念的系統化方法來設計新式微平台的這個方面， 還需要更多的研究。
　　本研究主要目的是建構出適合的方法，來設計出結合機構設計概念的新式微平台。首先根據機構的基本需求來進行微平台的分析，接著提出微接頭的概念並應用於微平台的合成上。除此之外，文中提出整個設計的流程圖，並經過挑選得到七種的微平台設計。最後經由FEM 的模擬， 確認合成出的微平台具有符合預期作動模式的良好結果。因此本研究是可以有效地應用在微機電元件的設計上。

　　Accompanying with the development of MEMS technology, microstages have been used for many years. Most of the studies on microstages have been aimed at the application of new actuators, materials and fabrication process in recent years. However, the systematic way for designing new microstages with the mechanism conceptual design approach still needs some more input.
　　The objective of this study is to establish a methodology to design new microstages employing the concept of mechanism design. First of all, new microstages for microassembly have been analyzed according to the basic requirements from the mechanism. Afterwards, the concept of microjoint has been presented and used in the synthesis of microstages. Besides, a flow chart of design procedure has been presented and seven kinds of microstages are achieved accordingly. Finally, the FEM simulation of the synthesized microstage illustrates the desirable results that reveal the good agreement with the expected motion. It is shown that this study can be efficiency applied to the design of micro scale devices.

摘要I
AbstractII
目錄III
圖目錄V
表目錄VII
第一章 緒論1
1.1 研究背景1
1.2 文獻回顧2
1.2.1 靜電式致動的微平台2
1.2.2 電熱式致動的微平台9
1.3 研究動機與解決方案11
1.4 研究目標與論文大綱12
第二章 微平台製程技術簡介14
2.1 微平台製程14
2.2 矽基製程技術14
2.2.1 薄膜技術14
2.2.2 微影技術15
2.2.3 蝕刻技術17
2.2.4 摻雜技術19
2.2.5 表面微加工技術20
2.2.6 體型微加工技術23
2.3 能量束加工技術24
2.4 陽極接合24
第三章 微平台之設計與分析26
3.1 微平台的設計概念與設計程序26
3.1.1 微平台之特性與需求26
3.1.2 系統化設計程序29
3.2 微平台機構之分析與設計31
3.2.1 平台機構的構造合成31
3.2.2 二驅動源機構合成32
3.2.3 三驅動源機構合成35
3.2.4 四驅動源機構合成37
3.2.5 四驅動源機構軸對稱合成40
3.2.6 由需求來進行合成43
3.2.7 合成機構之挑選44
3.3 撓性微接頭之設計與分析47
3.3.1 撓性微接頭簡介47
3.3.2 撓性微接頭之設計48
3.3.3 接頭模擬與分析50
3.3.4 撓性微接頭設計之建議60
3.4 微平台實體設計60
3.4.1 梳式致動器之設計60
3.4.2 機構之實體化64
3.4.3 微平台作動模擬與分析67
第四章 微平台製程設計79
4.1 具高深寬比之製程79
4.2 微平台製程79
4.2.1 晶圓的前處理80
4.2.2 輔助蝕刻溝槽之加工80
4.2.3 陽極接合80
4.2.4 矽晶圓濕蝕刻81
4.2.5 微平台結構之加工81
4.2.6 犧牲層之移除81
第五章 結論86
參考文獻88

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