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研究生:陳進揚
研究生(外文):Chin-Yang Chen
論文名稱:以Fenton法及UV/H2O2結合FerriteProcess處理印刷電路板廢水之研究
論文名稱(外文):Study on the treatment of PCB Wastewater by Ferrite Process combined with Fenton’s Method and UV/H2O2
指導教授:樓基中樓基中引用關係
學位類別:碩士
校院名稱:國立中山大學
系所名稱:環境工程研究所
學門:工程學門
學類:環境工程學類
論文種類:學術論文
論文出版年:2006
畢業學年度:94
語文別:中文
論文頁數:106
中文關鍵詞:重金屬有機物
外文關鍵詞:FentonFerrite ProcessPCBHeavy metalUV/H2O2Organic compounds
相關次數:
  • 被引用被引用:11
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印刷電路板有機廢液多以物化及生物處理法去除COD,但當污染物成份過於複雜或較難分解時,其去除效果則不顯著。電路板化學銅廢液以化學混凝沉澱法處理為主,其缺點為產生大量的重金屬污泥。
本研究目的為藉由Fenton-Ferrite Process及UV/H2O2-Ferrite Process二種組合程序去除PCB廢水中之有機物及重金屬,使上澄液能符合法規標準,且產生之重金屬污泥可視為一般事業廢棄物。
Fenton及UV/H2O2程序主要探討因子為:亞鐵及H2O2加藥量、pH值、反應時間與加藥方式等,並尋求較好的操作條件以結合後續Ferrite Process。結果顯示Fenton適合在酸性條件(pH=2),UV/H2O2系統適合在中性條件(pH=8)操作,H2O2加藥量過多或太少皆會使去除效率下降。
Fenton及UV/H2O2程序完成測試後,接續Ferrite Process測試重金屬廢水,其中Ferrite Process主要以三段式進行反應,操作條件為控制溫度、pH值及Fe/M莫耳比。Ferrite Process在處理銅金屬廢水,Fe/M莫耳比率為10倍,結合Fenton、UV/H2O2及Ferrite Process成為Fenton-Ferrite Process及UV/H2O2-Ferrite Process二種來處理PCB實場廢水,其上澄液所含有機物和重金屬皆可符合法規標準,汙泥初步證明為一般事業廢棄物,此污泥粒晶格粒徑皆小於100 nm並擁有磁性,可朝後續回收再利用發展。
Biological and physical chemistry treatment methods always are used to remove COD of organic wastewater contains PCB. The effect is not obvious when the compositions of pollutant are too refractory or complicated. The primary treatment method of wastewater containing copper is chemical coagulation/sedimentation and its disadvantage is producing a large of sludge.
The objective of this study, using two combinative method of UV/H2O2-Ferrite Process and Fenton-Ferrite Process, is to remove organic compounds and heavy metal in real wastewater. Not only supernatant liquid could meet the standard of discharge wastewater but also produce general(non-hazardous) industrial wastes of heavy metal.
The primary operation condition of Fenton and UV/H2O2 process, was ferrous ion and hydrogen peroxide concentration, pH, reaction time, and chemical dosing, searching best operation condition to combine with Ferrite Process. Operation of Fenton and UV/H2O2 process under acid condition (pH=2) and neutral condition (pH=8) showed the best operation condition of Fenton and UV/H2O2. The removal decreased when the dose of hydrogen peroxide was added too more or too less.
As Fenton and UV/H2O2 process test finished, Ferrite Process is next used for treatment of heavy metal wastewater; Ferrite Process conducted as three stages and the operation conditions were controlled with temperature, pH and the ratio of Fe/M mole. The results showed that the best removal of treatment of copper containing wastewater by Ferrite Process achieved when the ratio of Fe/M mole was at 10. Treatment of PCB industrial real wastewater by Fenton-Ferrite Process and UV/H2O2-Ferrite Process which combined with Fenton, UV/H2O2 and Ferrite Process. The supernatant liquid containing organic compounds and heavy metal both could meet the standards of discharge wastewater and the sludge was judged with general(non-hazardous) wastes. The characteristic of the sludge were the diameter lattice less 100 nm and with magnetism and to develop recovery and utilization in a further work.
內頁目錄
謝誌 Ⅰ
中文摘要 Ⅱ
英文摘要 Ⅳ
目錄 Ⅵ
表目錄 Ⅹ
圖目錄 XI
第一章 緒論 1-1
1-1 研究源起 1-1
1-2 研究目的 1-3
第二章 文獻回顧 2-1
2-1 印刷電路板製造業簡介 2-1
2-1-1 印刷電路板簡介 2-1
2-1-2 印刷電路板製造方法及流程 2-2
2-1-3 印刷電路板廢水特性 2-5
2-1-4 重金屬廢水處理方法 2-5
2-1-5 有機廢水處理方法 2-7
2-2 Fenton程序原理與影響因素 2-8
2-2-1 Fenton之氧化原理 2-8
2-2-2 Fenton程序去除有機物之影響因素 2-10
2-2-3 Fenton程序之相關研究 2-13
2-3 UV/H2O2反應原理與影響因素 2-16
2-3-1 光化學反應原理 2-16
2-3-2 UV/H2O2反應原理 2-17
2-3-3 UV/H2O2反應之影響因素 2-19
2-3-4 UV/H2O2之相關研究 2-21
2-4 鐵氧磁體化法原理與相關研究 2-23
2-4-1 鐵氧磁體化法之原理 2-23
2-4-2 鐵氧磁體化法之影響因子 2-28
2-4-3 鐵氧磁體化法之相關研究 2-31
第三章 研究方法與實驗設備 3-1
3-1 研究架構與實驗流程 3-1
3-2 實驗設備與材料 3-4
3-2-1 Fenton-Ferrite Process設備 3-4
3-2-2 UV/H2O2設備 3-6
3-2-3 實驗藥品與試劑 3-8
3-3 實驗分析項目及方法 3-9
3-4 實驗步驟及操作條件 3-11
3-4-1 原水水質 3-11
3-4-2 Fenton操作條件 3-12
3-4-3 UV/H2O2操作條件 3-12
3-4-4 Ferrite Process操作條件 3-14
3-4-5 Fenton-Ferrite Process與UV/H2O2-Ferrite Process
效果評估 3-14
第四章 結果與討論 4-1
4-1 Fenton法處理PCB有機廢水之操作條件探求 4-1
4-1-1 pH值之影響 4-1
4-1-2 亞鐵離子加藥量之影響 4-3
4-1-3 過氧化氫(H2O2)加藥量之影響 4-5
4-1-4 反應時間及加藥方式之影響 4-6
4-1-5 Fenton法之操作條件 4-11
4-2 UV/H2O2處理PCB有機廢水之操作條件探求 4-12
4-2-1過氧化氫(H2O2)加藥量之影響 4-12
4-2-2 pH值之影響 4-13
4-2-3反應時間及加藥方式之影響 4-15
4-2-4 UV/H2O2系統之操作條件 4-18
4-3 Ferrite Process處理PCB重金屬廢水之操作條件探求 4-19
4-3-1 建立Ferrite Process操作模式 4-19
4-3-2 Fe/M莫耳比之影響 4-20
4-3-3 Ferrite Process之操作條件 4-22
4-4 Fenton-Ferrite Process及UV/H2O2-Ferrite Process處理
PCB廢水 4-23
4-4-1 處理PCB廢水結果 4-24
4-4-2 SEM及EDS分析結果 4-24
4-5 成本效益 4-28
第五章 結論與建議 5-1
5-1 結論 5-1
5-2 建議 5-3
參考文獻 參-1
附錄一 口試委員意見及回覆 附-1

表目錄
表2-1 不同重金屬分離技術之比較表 2-6
表2-2 有機污染廢水處理方法之比較表 2-7
表2-3
英文文獻
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