臺灣博碩士論文加值系統

將高熱膨脹係數之SnO-MgO-P2O5 (SMP) 接合玻璃與低熱膨脹係數之玻璃基板 (例如：Corning 1737○R) 接合時，因為兩者熱膨脹係數差異很大，導致接合時產生明顯的熱應力而無法接合。本實驗室曾在SMP玻璃粉中添加高分子─聚四氟乙烯 (PTFE)，藉以吸收降溫過程中所產生的熱應力，而與低熱膨脹性之玻璃基板接合。
當PTFE添加量為25%時，雖然能使SMP玻璃與低熱膨脹性玻璃基板接合，但是PTFE卻會在接合處與SMP燒結體周圍聚集成一薄層。本實驗藉由降低SMP玻璃粉末之粒徑，期望減少與PTFE粒徑之差距，而能使PTFE均勻分散於SMP燒結體中。並且討論不同氣氛下(Air、Ar)，對SMP-PTFE燒結體的影響。

There is a significant difference in coefficient of thermal expansion (CTE) between high-CTE SnO-MgO-P2O5 sealing glass (SMP) and low-CTE substrates. As a result, they cannot be sealed to each other and it will even cracks on SMP glasses during cooling after the sealing process. In our early study, we had added polytetrafluoroethylene (PTFE) into the SMP glass powder to absorb the above-mentioned thermal stress.
It was found that, during the sintering process, PTFE will flow to the interfaces between the sintered body and the substrates. When the sintered bodies with 25 vol. % PTFE were sintered, they can be sealed with the upper and lower substrates. However the interface reveals a continuous PTFE layer.
In this study, we expect that the PTFE powder can disperse uniformly in SMP glass by diminishing the particle size of SMP glass powder to make it close to the PTFE powder particle size. And in this study, we discuss how the different atmosphere (Air、Ar) affects the SMP-PTFE sintered bodies.

英文摘要i
中文摘要ii
誌謝iii
目錄iv
圖目錄vi
表目錄viii
第一章　前言1
第二章　文獻回顧4
　　2-1 低溫接合玻璃4
2-2 磷酸鹽玻璃5
2-3 複合接合玻璃7
2-4 研究目的7
2-5 聚四氟乙烯8
第三章　實驗步驟11
3-1 製備玻璃粉末11
3-2 SMP-PTFE混合物之製備與燒結12
3-3 熱分析13
第四章 結果與討論17
4-1 純材料之分析17
4-2 燒結體之分析19
第五章 結論37
第六章 參考文獻39

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