臺灣博碩士論文加值系統

對於多晶片構裝模組之封裝膠材及基板材料，以TGA、DSC及TMA等熱分析儀進行性質量測，如熱膨脹係數、玻璃轉化溫度、吸濕率、彈性模數、熱裂解溫度及固含量等，並利用拉伸試驗機測量其封裝膠材與晶片之界面強度，計算出剪應變能密度。以有限元素分析軟體ANSYS，將材料性質量測結果做為其材料參數，模擬構裝模組在製程與溫度循環試驗後之熱應力分佈與變化，另外並模擬構裝模組若改變晶片厚度，其應力值的變化。最後根據JEDEC標準規範，對多晶片模組進行可靠度試驗的測試，試驗包括恆溫恆濕試驗、高溫儲存試驗、溫度循環試驗。

經由ANSYS模擬所計算出來的剪應變能密度值，經過溫度循環試驗1000 cycles之後，其值小於由界面剪切強度測試結果所計算出來的剪應變能密度值，表示封裝膠材與晶片界面間的強度足以承受其界面間所產生之熱應力，此也應證了產品通過了可靠度試驗的結果；另外在改變晶片厚度之模組的應力模擬部份，發現晶片厚度越薄，雖然可達成整個模組薄型化的目的，但其所產生之應力值也隨之增大。

The material properties of the molding compound GE applied on the three-chip module were measured by TGA, DSC and TMA equipments. The interfacial shear strengths were measured for the interfaces of molding compound with the chip passivation layers of PI and Si3N4. The shear strain energy densities were also calculated from the interfacial shear test results.

The three-chip module passed the temperature cycling (TC), temperature and humidity (TH) and high temperature storage (HTS) reliability tests.

Three-dimensional finite element modeling analysis was conducted to study the structural stress of the module after the reflow process and temperature cycling test. We also investigated the effect of the thicknesses of chips on structural stress under the temperature cycling condition.

目錄
摘要.......................................................I
Abstract..................................................II
誌謝.....................................................III
目錄......................................................IV
表目錄...................................................VII
圖目錄....................................................IX
1.1 多晶片模組背景簡介.......................................1
1.2 研究動機................................................2
1.3研究目的.................................................4
第二章 結構應力理論基礎......................................8
2.1有限元素分析法簡介........................................8
2.2線性理論.................................................8
2.3 非線性理論..............................................9
2.4 時間積分（Time integration)............................11
2.5 彈塑行為...............................................12
2.5.1硬化法則..............................................12
2.5.2降伏準則..............................................12
2.6混合破裂模式............................................12
2.7巨觀界面破裂強度.........................................13
第三章 材料性質分析與界面強度測試.............................20
3.1材料分析儀器介紹.........................................20
1.熱示差分析儀（Differential Scanning Calorimetry，DSC）....20
2.熱重差分析儀（Thermogravimetric Analysis，TGA）...........20
3.熱機械分析儀（Thermomechanical Analysis，TMA）............21
4.萬能拉力試驗機...........................................22
5.電動單軸加壓成型機........................................23
3.2材料特性分析結果.........................................23
1.熱示差分析儀分析結果................................ .....23
2.熱重差分析儀分析結果......................................23
3.熱機械分析儀分析結果......................................24
4.界面剪切強度分析..........................................25
A. 測試試片的製作..........................................25
B. 界面剪切強度測試結果.....................................26
C. 經過溫度循環試驗之封裝膠材GE與保護層為Si3N4 / PI薄膜的晶片之界面剪切強度.................................................27
第四章 應力模擬分析結果.....................................52
4.1 ANSYS有限元素分析軟體...................................52
4.2有限元素模擬之基本假設...................................52
4.3模型架構................................................53
4.4 ANSYS模擬分析程序......................................53
4.5收歛分析................................................55
4.6熱應力模擬分析結果.......................................55
A. 整體von Mises stress分析................................55
B.整體翹曲值分析...........................................56
C.膠材硬化製程之Shear stress及Shear strain分析..............56
D.溫度循環試驗之Shear stress及Shear strain分析..............57
4.7 不同晶片尺寸的多晶片構裝模組之熱應力模擬分析結果...........58
4.7.1晶片尺寸為0.1 mm之多晶片構裝模組........................58
A. 整體von Mises stress分析...............................58
B.整體翹曲值分析...........................................59
C.膠材硬化製程之Shear stress及Shear strain分析..............59
D.溫度循環試驗之Shear stress及Shear strain分析..............59
4.7.2晶片尺寸為0.5 mm之多晶片構裝模組........................60
A. 整體von Mises stress分析................................60
B. 整體翹曲值分析..........................................60
C. 膠材硬化製程之Shear stress及Shear strain分析.............60
D.溫度循環試驗之Shear stress及Shear strain分析..............61
第五章 可靠度試驗結果......................................131
5.1 Preconditioning test.................................131
5.2 恆溫恆溼試驗..........................................131
5.3高溫儲存試驗...........................................132
5.4溫度循環試驗...........................................132
第六章 結論...............................................142
6.1 結論.................................................142
參考文獻..................................................143
作者簡介..................................................146

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