跳到主要內容

臺灣博碩士論文加值系統

(216.73.216.213) 您好!臺灣時間:2025/11/08 00:02
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果 :::

詳目顯示

我願授權國圖
: 
twitterline
研究生:黃盈嘉
研究生(外文):Ying-JiaHuang
論文名稱:基於AMDF演算法之折疊架構新型音源定位晶片設計
論文名稱(外文):A New Chip Design of Auditory Source Localization Based on AMDF Algorithm with Folding Architecture
指導教授:王駿發
指導教授(外文):Jhing-Fa Wang
學位類別:碩士
校院名稱:國立成功大學
系所名稱:電機工程學系碩博士班
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2011
畢業學年度:99
語文別:英文
論文頁數:64
中文關鍵詞:音源定位平均差值函式時間差計算摺疊技術
外文關鍵詞:auditory source locationaverage magnitude difference functiontime delay of arrivalfolded architecture
相關次數:
  • 被引用被引用:0
  • 點閱點閱:194
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
Chapter 1 Introduction 1
1.1 Background and Motivation 1
1.2 Related Works 3
1.3 Objectives of the Thesis 4
1.4 Organization of the Thesis 5
Chapter 2 Auditory Source Localization Basics 6
2.1 Principle of Hyperbolic Auditory Localization 7
2.2 Time Difference of Arrival (TDOA) 9
2.3 Average Magnitude Difference Function (AMDF) 11
2.4 Auditory Source Localization System Overview 14
Chapter 3 Chip Design and Implementation 15
3.1 System Flow Chat and System Architecture 15
3.2 ADC and I2S 17
3.3 Voiced Activity Detection (VAD) 19
3.4 SRAM and Circular Buffer Mechanism 21
3.4.1 SRAM 21
3.4.2 Circular Buffer 23
3.5 Subtraction Absolute Accumulation (SAA) and Folding 24
3.6 Circuit Diagram of Control Unit and Data Capture 27
3.7 ASIC Cell-Based Design Flow 28
3.8 Design for Testability 30
3.8.1 Scan Chain 30
3.8.2 Memory BIST 31
Chapter 4 Simulation and Verification Results 34
4.1 FPGA Simulation and Results 34
4.1.1 FPGA Experimental Setup 34
4.1.2 Hardware Development Environment 35
4.2 Chip Simulated Results 37
4.2.1 Pre-Simulated Results 38
4.2.2 Gate Level Post-Simulated Results 39
4.2.3 Transistor Level Post-Simulation Results (PVS) 40
4.3 Chip Layout and Timing Verification 43
4.3.1 Layout 43
4.3.2 Layout Verification 44
4.3.3 I/O Pin and Specification Table 45
Chapter 5 Chip Measurement 47
5.1 CIC Agilent 93K SoC Test System 47
5.1.1 ASCII Interface 48
5.1.2 Design a Device Under Test (DUT) Board 51
5.1.3 Testing Timing Diagram 52
5.2 Test Board and Prototype Chip 53
Chapter 6 Conclusion and Future Work 54
6.1 Performance Compared with Related Work 54
6.2 Conclusion 55
References 56
Appendix 58
A. Tapeout Review Form (for Cell-Based IC) 58
B. Layout and Pin Mapping 62
C. Bonding and Pin Mapping 63
D. Chip and Pin Mapping 64

連結至畢業學校之論文網頁點我開啟連結
註: 此連結為研究生畢業學校所提供,不一定有電子全文可供下載,若連結有誤,請點選上方之〝勘誤回報〞功能,我們會盡快修正,謝謝!
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top