臺灣博碩士論文加值系統

本研究的重點在於利用pH敏感型的單體(Dimethylaminoethyl methacrylate)(DMAEMA)與Styrene苯乙烯共聚，在無添加還原劑的情況下即可還原奈米鈀金屬粒子，形成[poly(St-co-DMAEMA)/Pd] pH敏感型共聚寡分子觸媒墨水。DMAEMA官能基具有環境敏感特性，會因環境酸鹼值的改變而產生相變化，利用這個特性，可保護觸媒墨水中之觸媒，防止其在鹼性環境鍍液中溶出，再利用磺化(Sulfonation)來改善高分子奈米貴金屬粒子間之分散問題，以製做出均勻分散且穩定性高的pH敏感型共聚寡分子觸媒墨水。本研究使用紅外線光譜儀(FT-IR)檢測其官能基、核磁共振光譜儀(1H-NMR)檢測其分子結構、穿透式電子顯微鏡(TEM)觀測其粒子型態大小、穩定性分析儀(LUM)來檢測觸媒墨水之穩定性、3D白光干涉儀檢測銅鍍層披覆在PET上銅鍍層的厚度及表面形貌。
為了增加基材表面與觸媒的附著力，利用大氣電漿先將基材表面改質出一層氫氧基後，再利用矽烷改質劑與共聚寡分子和基材鍵結，得到提升附著力的作用，並用表面接觸角檢測儀及紅外線光譜儀(FT-IR)證實有氫氧基產生及矽烷改質劑的鍵結。
將此觸媒均勻塗布在前處理後的PET可撓性基材上，，經無電電鍍銅後，形成具有良好的附著力的銅鍍層。進而在不導電的PET上可披覆一層銅導線層，達到製成金屬線路的目的，且銅鍍層厚度在化鍍20分鐘後可達1.5µm。
最後利用此pH敏感型觸媒墨水抗鹼特性及良好分散性，應用於噴墨列印上，化鍍出所需不同線寬的銅導線及檢測在可撓性基材上銅導線的抗彎曲能力，經過200次180度的彎折後PET上的銅導線，依然保有相當高的導電性。

In this study, a pH-responsive palladium catalyst for electroless copper deposition was prepared. The noble metal nanoparticles reduced and stabilized by styrene monomer and 2-(N,N-dimethylamino)-ethyl methacrylate(DMAEMA) monomer by free radical polymerization. Poly(St-co-DMAEMA) showed good dispersion and excellent stability in the aqueous solution without surfactant and reductant in the mixture.
The properties of Poly(St-co-DMAEMA) and the nanocomposite catalyst Poly(St-co-DMAEMA)/Pd were characterized by Nuclear Magnetic Resonance Spectrometer(1H-NMR), Fourier transform infrared spectrometry (FTIR), gel permeation chromatography (GPC), Transmission electron microscopy (TEM), LU Misizer(LUM) and contant angle.
It is known that the 2-(N,N-dimethylamino)-ethyl methacrylate(DMAEMA), is both a pH responsive cationic polyelectrolyte containing a tertiary amine group (pKa 7.0) and a thermosensitive polymer with phase transition temperature.It was found from our result that a copper film with dramatically enhanced adhesion is formed on PET surface without special pretreatment step,indicating that St-co-DMAEMA was used not only as the adsorption sites for palladium, but also as an adhesion-promoting layer for the electrolessly deposited copper on the PET surface.
Finally, we used ink-jet printing technology to output the catalyst ink and controlled printing conditions and jet nozzle status of the printer, then we can made 500,300,and 150μm wide copper line of metallization track graphics. After 200 times of bending the copper wire on PET 180 degrees, still maintain a relatively high electrical conductivity.

誌謝... ii
摘要… iii
Abstract iv
目錄… v
表目錄 vii
圖目錄 viii
1. 前言 1
2. 文獻回顧 4
2.1圖形金屬化 4
2.2無電電鍍銅之製程 8
2.3智慧型高分子材料 13
3. 實驗 16
3.1實驗流程 16
3.1.1 pH敏感型共聚寡分子之合成 17
3.1.2 pH敏感型共聚寡分子還原奈米貴金屬粒子之製備 18
3.1.3基材前處理 19
3.1.4化學鍍銅之步驟 20
3.1.5噴印銅導線於可撓性基材表面 21
3.2實驗藥品與設備 23
3.2.1實驗藥品 23
3.2.2實驗設備 24
3.2.3檢測方式 25
4. 結果與討論 27
4.1 pH敏感型共聚寡分子之合成 27
4.1.1 pH敏感型共聚寡分子製備與鑑定 27
4.1.2 DMAEMA含量對pH值敏感性之探討 31
4.1.3 KPS含量對共聚寡分子的分子量大小影響 37
4.2 pH敏感型觸媒墨水之特性研究 44
4.2.1化鍍銅參數之調整 44
4.2.2pH敏感型觸媒墨水抗鹼特性之研究 48
4.2.3不同共聚寡分子觸媒墨水於無電鍍銅之檢測分析 50
4.3可撓性基材上銅導線抗彎曲特性之研究 55
5. 結論 61
文獻回顧 63

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