臺灣博碩士論文加值系統

本研究針對目前LED產業與半導體產業高解析度與高速度檢測需求，以投射疊紋輪廓量測技術搭配線性馬達高速掃描設計，以數位光源投射系統(DLP)投射光柵，結合高畫素彩色線型CCD，開發出一套國內需求甚高應用於藍寶石基板表面輪廓與翹曲變形檢測的光學檢視雛型機，以提供國內相關業者檢測與研發需求。是以傳統的投射條紋法結合線CCD掃描擷取影像的技術，獲得以等高線型態展示的條紋圖，配合相移干涉量測技術，即可得知物體的外型輪廓資料，解析度可達次微米。目前架構設定相機擷取之條紋間距為22.5μm，實驗結果顯示量測藍寶石基板的測量精度與重複度已可達到次微米級。由於所研製之系統適合於以輸送帶方式傳送之元件的線上量測應用。

On-line surface profile measurement is very important and practical in the LED industry and semiconductor industry. It has stricter specification of high-speed and high-solution to those components than other parts. In this study, a prototype of visual system utilizing the projected fringe topography technique via a color linear CCD camera has been developed for sapphire substrates surface profile inspection. In this system, a straight-line grating is projected using a digital light processing (DLP) onto a transnational object and the image of the grating is grabbed and integrated with a single-line CCD. This transfers the projected straight-line grating to a surface contour of the specimen. The contour map can be quantitatively analyzed using phase measuring technique via the RGB lines of the CCD. The current projected pitch of the grating on the CCD is 22.5. Experimental results show that the measurement accuracy can reach micrometer order with repeatability in the sub-micrometer order. Since the measurement is executed on a translating object, it may be the best choice for on-line or in-process automated inspection for products conveyed by a transporting mechanism.

摘要 I
Abstract II
致謝 III
目錄 IV
圖目錄 VI
表目錄 VIII
第一章 緒論 1
1-1研究背景與目的 1
1-2文獻回顧 3
1-3研究方法 4
1-4本文架構 5
第二章 藍寶石基板介紹 6
2-1藍寶石材料介紹 6
2-2藍寶石基板製程 7
2-3 切割製程與量測樣品 10
第三章 量測原理 11
3-1疊紋法量測技術 11
3-1-1 投射疊紋法 11
3-1-2 相移干涉術 13
3-2 投射疊紋掃描量測技術 17
第四章 實驗裝置與實驗步驟 22
4-1量測系統 22
4-1-1影像擷取系統 23
4-1-2移動平台控制系統 24
4-1-3 光柵投射裝置 25
4-2實驗步驟 27
第五章 實驗結果與討論 29
5-1 RGB色彩校正 29
5-2藍寶石基板量測結果 32
第六章 結論 37
參考文獻 38

 
圖目錄
圖2 1藍寶石切面圖 7
圖2 2 藍寶石基板加工流程 9
圖3 1 投射條紋輪廓量測原理 13
圖3 2 2π不連續圖 17
圖3 3 2π連續圖 17
圖 3 4 投射疊紋掃描量測架構的示意圖 20
圖3 5 投射條紋掃描法所獲得之結果 21
圖 3 6 相移量示意圖 21
圖4 1 量測系統架構示意圖 22
圖4 2 PC-30實體圖 23
圖4 3 PC-30之RGB感測器間距 24
圖4 4 Makro-Planar 2/50 24
圖4 5 KK50實體圖 25
圖4 6 KS301-20NHD實體圖 25
圖4 7 DLP實體圖 26
圖4 8 DLP內部之DMD鏡面尺寸與分佈示意圖 26
圖4 9 實驗步驟流程 28
圖5 1 DLP控制介面 30
圖5 2 校正前(a)相機擷取整合之影像 (b)RGB強度值 31
圖5 3 校正後(a)相機擷取整合之影像 (b)RGB強度值 32
圖5 4 藍寶石基板完整外型 33
圖5 5 相機擷取之藍寶石基板 34
圖5 6 藍寶石試片A之正面三維輪廓影像圖 34
圖5 7 藍寶石試片A之背面三維輪廓影像圖 35
圖5 8 藍寶石試片B之正面三維輪廓影像圖 35
圖5 9 藍寶石試片B之背面三維輪廓影像圖 36

 
表目錄
表2 1金剛石線鋸切割形式比較 10
表4 1 PC-30-04K80線規格表 23
表4 2 Makro-Planar T* 2/50 ZF規格表 24
表4 3 KK-50線性滑台規格表 25
表4 5 KS301-20NHD規格表 25
表4 6 DLP規格表 26

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