臺灣博碩士論文加值系統

本論文中使用光機電整合方式，將機器視覺、液壓氣壓管路設計、程式控制及訊號處理，驅動噴墨頭、工作走臺、電腦視覺觀測設備等設備，成功建置一套用來製作軟性電子元件及電路的噴墨系統。
利用噴墨系統製作之電子元件及電路的照片顯示噴墨系統的製程穩定性及噴印精確度；經搭配環境控制、材料摻雜處理、加溫回火和表面處理等材料改質方法以及創新封裝方式，提出一套適合作為製作軟性電子元件及電路的製程平台，並且在大氣環境下製作量測主動層材料為P3HT之有機薄膜電晶體元件，其元件性能足以與國際研究團隊成果批敵（電流開關比為104，電子漂移率為10-1 ）；此外，利用本製程平台同時成功利用常見銀鏡反應原理，製作圖形化的無電電鍍薄膜，作為電子元件之間的接合導線，這些成果皆證明本論文研製之噴墨製程平台具有成為未來軟性電子產業之生產平台的雛形及製作流程。

In this thesis, a processing platform based on inkjet printing technology was developed to facilitate the possibility of producing flexbile electronic devices. in academia and industry of Taiwan. To serve as a prototyupe for the complete in-line manufacturing system and fabricating procedures, this processing platform integrates optomechatronic systems include machine vision, liquid/gas pressure control, flexible programming environment, inkjet printing heads, ink preparation, moving platform, and thermal processing equipments, etc.
The success in fabricating electronic components and circuits such as resistor, capacitors, thin film transistors, and inverters by producing printed pattern of different functional layers with different materials on flexible substrates proved the potential of using this newly developed inkjet printing system to serve as a manufacturing system. The silver mirror process was developed to create the electric connection between components, which led to very high conductivity electric connections in the circuit created. The improvement in on/off ratio and mobility of flexible thin film transistor with all organic materials and polymeric semiconductor P3HT were attribed to better humidity control, well controlled air particles, and a novel packaging process developed. The final data obtained verified the internationally competitive performance including 104 on/off ratio and 10-1 mobility of printed P3HT OTFT measured at the ambient environments.

中文摘要 i
Abstract ii
謝誌 iii
目錄 vi
圖目錄 x
表目錄 xix
第1章 緒論 1
1-1 研究背景 1
1-2 研究動機 8
1-3 論文架構 12
第2章 軟性電子之材料發展與介紹 13
2-1 軟性電子材料 14
2-1-1 基板材料 14
2-1-2 導體材料 17
2-1-3 半導體材料 28
2-1-4 絕緣層材料 34
2-1-5 封裝層材料 36
2-2 本論文中所使用之材料 37
2-2-1 論文中使用之導電材料 37
2-2-2 本論文中使用之絕緣材料 59
2-2-3 本論文中使用之半導體材料 64
2-2-4 本論文中使用之封裝材料 68
2-2-5 本論文中使用之基板材料 70
第3章 噴墨製程平台研製與成果展現 75
3-1 噴墨製程系統 79
3-1-1 噴墨設備 81
3-1-2 定位平台設備 98
3-1-3 觀測設備 105
3-1-4 控制程式與訊號傳輸設備 110
3-1-5 噴墨製程系統之總結 120
3-2 製程環境控制 121
3-2-1 無塵站 122
3-2-2 局部氮氣環境 126
3-3 噴墨製程流程 128
3-3-1 噴墨頭及供墨設備清洗 128
3-3-2 噴墨頭測試 129
3-3-3 圖形噴印 130
3-3-4 圖層定位 131
3-4 噴墨製程參數調整與實際噴印結果討論 135
3-4-1 噴墨行為及液滴佈著 135
3-4-2 所有使用材料的噴墨行為及成膜效果 141
第4章 軟性電子元件及電路之量測與電性討論 150
4-1 量測儀器 150
4-1-1 Agilent 4294A阻抗分析儀 150
4-1-2 Keithley 4200-SCS半導體特性系統 151
4-1-3 Alpha Step500表面輪廓儀 152
4-1-4 Wyko白光干涉儀 153
4-2 其他製程設備 154
4-2-1 EYELA真空烘箱 154
4-2-2 THERMOLYNE加熱盤 155
4-2-3 旋轉塗佈機 156
4-2-4 EMITECH K575濺鍍機 157
4-3 軟性電子元件 158
4-3-1 電阻 158
4-3-2 電容 161
4-3-3 有機薄膜電晶體 165
4-4 軟性電子電路 175
4-4-1 銀導線 175
4-4-2 反向器 178
第5章 結論與未來展望 181
5-1 結論 181
5-2 未來展望 183
參考文獻 185

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