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研究生:闕明珠
研究生(外文):Ming-Chu Chueh
論文名稱:微透鏡陣列製程分析
論文名稱(外文):Fabrication of Microlens Array
指導教授:李雄李雄引用關係
指導教授(外文):Shyong Lee
學位類別:碩士
校院名稱:國立中央大學
系所名稱:機械工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2005
畢業學年度:93
語文別:中文
論文頁數:92
中文關鍵詞:二元鎳鈷合金電鑄超高硬度微透鏡
外文關鍵詞:extra-hardnessmicro-opticsNi-Co alloy electroplating
相關次數:
  • 被引用被引用:10
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  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
微光學透鏡應用在光電產業上越來越廣泛,微光學透鏡發展出許多製造方法,其中大部分昂貴且費時。本計畫將以高深寬比(High aspect ratio)黃光製程技術搭配超高硬度(Extra-hardness)二元鎳鈷(Ni-Co)合金電鑄,製作金屬材質模仁,並配合利用壓印(Hot embossing)製作出高分子微透鏡陣列,以創新電鑄配方製造高硬度模仁提高模具壽命方法不僅省時省錢,亦可大量製作出微透鏡陣列。
因此,本計畫將發展高硬度電鑄技術與壓印製程技術相互搭配製作出高分子微透鏡陣列,鎳鈷模壓印製程,將被壓印材料加熱,如同蓋印章之方式,將印章壓在加熱軟化後之材料上,便可得到其微光學透鏡之轉印。本研究中為了瞭解微透鏡形成的機制特性,所以改變其厚膜光阻(AZ4620)的直徑、熱回流(Reflow)時間與溫度等條件,及電鑄應用,探討條件參數對其微透鏡形成幾何形狀的影響及量測其不同參數條件製作出微透鏡陣列之光學特性。
This project presents a concept to fabricate micro-optical devices using high-aspect-ratio lithography, extra-hardness electroplating, and hot embossing processes. A bath of electroplating electrolyte will be formulated to fabricate micro-optics mold inserts with extra-hardness Ni-Co alloy. It is a novel method to increase the life of the mold insert during fabricating micro-optical devices. With this high hardness, the mold inserts can resist high abrasiveness and wear so as to extend the mold cycle life and reduce the idle time of replacing mold plates during fabrications. Therefore, the process of fabrications of micro-optics can be more cost-effective. In this study, different thicknesses of photoresist AZ4620 will be tried for micro-optical templates with different radiuii. Also, parametric effects of reflow time, and temperature on micro-optical profiles will be characterized and discussed as well. Finally, the optical properties such as focal length of developed micro-optics will be measured and tested.
中文摘要---------------------------------------------------------------------Ⅰ
英文摘要---------------------------------------------------------------------Ⅱ
目錄-------------------------------------------------------------------------Ⅲ
表目錄-----------------------------------------------------------------------Ⅵ
圖目錄-----------------------------------------------------------------------Ⅶ

第一章 緒論-------------------------------------------------------------------1
1.1背景說明-----------------------------------------------------------------1
1.2文獻回顧-----------------------------------------------------------------3
1.3研究目的-----------------------------------------------------------------9
第二章 實驗原理--------------------------------------------------------------10
2.1黃光製程----------------------------------------------------------------10
2.2真空濺鍍製程------------------------------------------------------------15
2.3微型電鑄製程------------------------------------------------------------18
2.4微型熱壓製程------------------------------------------------------------24
2.4.1熱壓成型奈米壓印技術-------------------------------------------24
2.4.2步進光感成形式奈米壓印技術----------------------------------25
2.4.3可撓性奈米壓印技術----------------------------------------------25
2.4.4雷射輔助奈米壓印技術-------------------------------------------26
2.5實驗量測儀器設備------------------------------------------------------27
2.5.1光學顯微鏡及其量測原理----------------------------------------27
2.5.2表面輪廓測量儀----------------------------------------------------27
2.5.3 測算曲率半徑------------------------------------------------------27
第三章 微透鏡製程與實驗參數設定---------------------------------------29
3.1 AZ4620微影製程--------------------------------------------------------29
3.1.1 AZ4620厚膜光阻之材料特性------------------------------------29
3.1.2 AZ4620微影製程步驟---------------------------------------------30
3.2 AZ4620光阻熱回流法------------------------------------------------- 31
3.3真空濺鍍製程------------------------------------------------------------33
3.4 Ni-Co微型電鑄製程----------------------------------------------------33
3.5微型熱壓製程------------------------------------------------------------35
第四章 結果與討論------------------------------------------------------------37
4.1 AZ4620厚膜光阻塗佈--------------------------------------------------37
4.2 AZ4620熱回流製程探討-----------------------------------------------37
4.2.1加熱時間相同,改變恆溫溫度值--------------------------------38
4.2.2加熱溫度相同,改變加熱時間值--------------------------------40
4.2.3熱回流行為歸結-----------------------------------------------------41
4.3真空濺鍍----------------------------------------------------------------43
4.4微型電鑄----------------------------------------------------------------43
4.5熱壓成型----------------------------------------------------------------44
4.6影響良率的因素----------------------------------------------------------44
第五章 初步結論與未來展望------------------------------------------------46
5.1初步結論----------------------------------------------------------------46
5.2未來展望----------------------------------------------------------------47
參考文獻-------------------------------------------------------------------- 48
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