臺灣博碩士論文加值系統

IC產業不斷的發展使得電子元件輕薄短小、多功能，使人們生活更加的便利。電子元件中不同結構都是重要的元件之一，除了電訊導通，保持機械結構強度，因此元件可靠度是研究人員所探討的重點。本文以業界提供封裝做為探討，利用有限元素分析軟體，探討封裝結構在承受265 °C高溫度負載，在降至室溫 25 °C 下之結構的熱機行為。此外對於封裝結構中央切面的熱機行為，本文欲以2D平面結構進行模擬以了解兩者之間的差異，提供有限元素分析人員日後參考依據。
本文封裝結構有三種模型，稱為模型A、模型B和模型C。三個模型之差異為玻璃材料與晶片之間的結構。為了比較2D與3D有限元素模型將建立1/2對稱模型，結構中元件厚度較薄，3D結構採用疊層元素，並選用高階元素以增加收斂性。
高溫時模型A的位移量最大約為4 m，模型B與模型C的位移量約 3.2 m，降回室溫時位移量約 2.1 m至 2.5 m，其中模型C為最大。高溫時等效應力約896 MPa至 1140 MPa，其中模型B的等效應力最大，降回室溫時等效應力約642 MPa至 711MPa，其中模型B的等效應力最大，降幅約37 %。
高溫時2D有限元素模型顯示，除了模型B以外其他模型x方向變形大於3D有限元素模型 20 %，除了模型C以外其他模型y方向變形小於3D有限元素模型 20 %。降回室溫時2D有限元素模型顯示，所有模型x方向變形大於3D有限元素模型17~31 %，y方向變形大於3D有限元素模型但無規律。高溫時2D有限元素模型顯示，所有模型等效應力，皆小於3D有限元素模型約25 %，降回室溫時約40 %。本3D結構並非無限長很合理的可簡化為2D結構，但2D分析結果的位移與應力分布在定性上與3D分析結果可適度的對比。

The continuous development of IC has the electronic components thin, compact and versatile which makes our lives more convenient. Any components in the electronic packaging are important not only for telecommunications but also strength its mechanical structure, therefore, the reliability of any components becomes a study topic of the researchers.
The thermal-mechanical behavior of a packaging was investigated under 265 °C high temperature loading and down to room temperature 25 °C. In order to discuss the thermal behavior of the central section of the package structure, both 2D and 3D finite element models were created and compared. Due to small thickness of the packaging, the layer 3D solid element was selected in 3D finite element model and higher order element was used in both models to improve the convergence problem.
At high temperature, the displacement of model A is about 4 m, the displacement of model B and model C is about 3.2 m, and the displacement is about 2.1 m to 2.5 m at room temperature, and model C is the largest. The equivalent stress is about 896 MPa to 1140 MPa at high temperature, and the model B is the largest. The equivalent stress is about 642 MPa to 711 MPa at room temperature, and model B is the largest. The average equivalent stress was about 37 % lower.
The 2D finite element model at high temperature showed that the deformation of model A and C in x direction is greater than 20 % of the 3D finite element model. In addition to model C, the y-direction deformation of other models was less than 20 % of the 3D finite element model. At room temperature, the 2D finite element model showed that the deformation of all models was greater than that of the 3D finite element model by 17~31 %. The y-direction deformation of all models was greater than that of the 3D finite element model. The 2D finite element model at high temperature showed that the equivalent stress of all models is less than that of 3D finite element model by 25 %, and 40 % was found in back to room temperature. The 3D structure was not very reasonable by infinite long structure and can be simplified to 2D structure, but the displacement and stress distribution of 2D analysis results can be qualitatively compared with 3D analysis results

目錄
中文摘要 I
ABSTRACT II
致謝 III
目錄 IV
圖目錄 VI
表目錄 IX
第一章 緒 論 1
1-1前言 1
1-2文獻回顧 4
1-3研究動機與目的 7
1-4研究方法 7
第二章 有限元素模型分析 10
2-1構裝體幾何尺寸 10
2-2構裝體機械性質 14
2-3狀態應力(state of stress) 15
2-3-1平面應力 18
2-3-2平面應變 20
2-4有限元素模型建立策略 21
2-5負載及邊界條件 25
第三章 有限元素模型分析結果 27
3-1有限元素模型 27
3-2 3D模型分析結果 32
3-3 修正邊界條件3D模型分析 36
3-4 2D與3D模型分析比較 47
第四章 結 論 58
參考文獻 60

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