臺灣博碩士論文加值系統

在研磨加工時所產生的熱，會傳遞至工件以及砂輪顆粒上，造成磨粒的磨耗增加，並且會對工件產生表面及次表面的熱破壞等問題，所以本實驗進行加工區域溫度模組的開發，希望使用者可在實驗前，預測其加工時所產生之溫度，以避免熱對於工件上的破壞。而目前已經有許多研究指出，微量潤滑方式應用於研磨製程中，可以有效地降低加工溫度以及增加磨輪壽命。因此本研究透過微量潤滑方式，將碳酸氫鈉(NaHCO_3)顆粒配合高壓空氣噴出，當作研磨加工時的潤滑劑，其微量潤滑方式只會在工件溫度超過40度時啟動，與乾切削的潤滑方式進行比較，並以其實驗結果進行熱模組的開發，探討碳酸氫鈉以微量潤滑方式噴灑至加工區對於此製程之影響，在實際加工結果顯示，此微量潤滑方式可有效的降低工作溫度以及減少熱影響區，並不會造成表面硬度的改變，在乾切削狀況下，磨粒會被快速地磨耗，造成切削能力下降，使得磨擦力增加，進而使溫度快速的提升，而磨粒大小方面，研究結果顯示越大的磨粒會使溫度上升更為快速。工作溫度模型的參數是由研磨加工參數，例如 : 磨輪速度、微量潤滑壓力等進行建模，並且此模組所模擬出之結果，與實際加工之結果相似，因此驗證此模組是可行的。

Grinding process results in high heat generation at the workpiece-grain interface and most of the heat goes into the workpiece, another fraction is absorbed by the grain and removed by MQL. These high temperatures to the workpiece causes rapid wear of the abrasive grains, surface and sub-surface alteration of the workpiece. A model of the working temperature in both dry and minimum quantity lubrication was developed. In this study, NaHCO_3 particles were spread out with high-pressure air when the threshold of 40°C was exceeded. The results show that the utilization of the surfactant can reduce the working temperature and heat-affected zone efficiently. The hardness of the workpiece is high when the surfactant is applied due to the reduction of the rubbing behavior or efficient dispassion of heat. The simulated results indicate that during dry grinding the temperature rise is rapid as compared to the MQL grinding. The high temperature in dry grinding might be because of immediate wear of the coated abrasive grain, which results in an increase of frictional heat due to large contact area between the abrasive grain and workpiece. The effects of grinding parameters such as mesh size are also analyzed in this study. It is observed that using an abrasive disc of 150 mesh size high temperatures were recorded as compared to 600. The simulation results were verified by the experiments.

摘要 iv
Abstract v
Table of contents vi
List of Figures viii
List of tables ix
Acknowledgement x
Chapter 1. Introduction 1
1.1 Background 1
1.2 Objectives 3
Chapter 2. Literature Review 6
2.1 Grinding process 6
2.2 Related Research 7
2.2.1 Heat generation and partition 9
2.2.2 Dry grinding 11
2.2.3 MQL grinding 13
Chapter 3. Experimental setup 16
3.1 System setup 16
3.2 Material properties 19
3.3 Design of experiment 20
Chapter 4. Modelling of the working temperature 21
4.1 Heat flux formulation 21
4.2 Heat partition 25
4.3 Surface and Subsurface temperature distribution 29
Chapter 5. Results and Discussion 34
5.1 Simulation and Experimental results in dry grinding 34
5.1.1 Temperature distribution 34
5.1.2 Effect of grit size on surface temperature 37
5.1.3 Subsurface workpiece temperature (z > 0) 38
5.2 Simulation and Experimental results in MQL grinding 41
5.2.1 Temperature distribution 41
5.1.3 Subsurface workpiece temperature (z > 0) 45
Chapter 6. Conclusion and Future Works 46
Reference 47
Appendix 52

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