臺灣博碩士論文加值系統

本實驗以電漿輔助化學氣相沉積系統沉積類鑽碳膜，觀察氫氣及氬氣電漿在沉積碳膜後轟擊試片表面對碳膜表面特性以及血液相容性的影響。實驗分別以表面輪廓儀量測膜厚，拉曼光譜儀分析碳膜結構，原子力顯微鏡量測碳膜表面粗糙度，水接觸角分析儀量測碳膜表面親疏水特性來觀察碳膜表面特性。血液相容性測試分別以二喹啉甲酸蛋白質分析法（Bicinchoninic acid protein assay，BCA assay）分析碳膜表面白蛋白/纖維蛋白之吸附比，利用掃描式電子顯微鏡觀察血小板於碳膜表面的貼附情況，並以MTT進行細胞相容性測試。
實驗結果顯示，隨著電漿後處理時間的增加，所沉積出來的類鑽碳膜表面粗糙度以及沉積膜厚都會下降。實驗結果也發現，電漿後處理時間越久，碳膜表面的sp2比例，膜表面疏水性，白蛋白以及纖維蛋白的吸附量也都會增加。使用氬氣電漿後處理的碳膜，在後處理時間達十五分鐘時達到最高的白蛋白/纖維蛋白吸附比；使用氫氣電漿後處理的碳膜，在後處理時間一分鐘達到最好的白蛋白/纖維蛋白吸附比。不論類鑽碳膜是否經過電漿後處理，碳膜的毒性反應都很低。經過電漿後處理的類鑽碳膜在浸漬於血小板中180分鐘後，血小板的貼附程度有明顯增加。

Diamond-like carbon films were prepared on silicon substrates using radio frequency plasma enhanced chemical vapor deposition. The different post-treatment time from hydrogen plasma and argon plasma were investigated. The film thickness, surface roughness, film hydrophobicity and surface microstructure of DLC films were characterized by Alpha-Step, atomic force microscopy (AFM) , water contact angle and Raman spectroscopy. The protein adhesion, biocompatibility and platelet adhesion were characterized by bicinchoninic acid protein assay (BCA assay) , MTT assay and scanning electron microscope (SEM) .
The results showed that the increase of plasma post-treatment time reduced the suface roughness and film thickness. The results also showed that the longer the plasma post-treatment time, the higher the sp2 content, surface hydrophobic, and the absorption of albumin and fibrinogen. For the argon plasma post-treatment, adsorption ratio of albumin to fibrinogen reached the highest value at fifteen minutes. For the hydrogen plasma post-treatment, adsorption ratio of albumin to fibrinogen reached the highest value at one minute. cytotoxicity tests showed low cytotoxicity for DLC films with or without plasma post-treatment. DLC films with plasma post-treatment showed significant increase in platelet attatchment when platelet was incubated for 180 minutes.

總目錄
第一章緒論1
1.1前言1
1.2研究目的1
第二章 文獻回顧3
2.1碳材料與類鑽碳膜3
2.1.1 碳材料3
2.1.2 非晶質碳膜分類4
2.2類鑽碳膜的製備6
2.2.1 類鑽碳膜的成膜機制6
2.2.2類鑽碳膜的成膜方法7
2.3電漿後處理對類鑽碳膜產生的效應11
2.3.1電漿後處理對類鑽碳膜表面蝕刻速率的影響11
2.3.2電漿後處理對類鑽碳膜表面粗糙度的影響12
2.3.3電漿後處理對類鑽碳膜結構的影響13
2.2.4電漿後處理對類鑽碳膜表面親疏水性的影響13
2.4影響血液相容性的因素19
2.4.1血液相容性19
2.4.2血塊生成過程19
2.4.3影響血液相容性的因素21
2.4.4類鑽碳的血液相容性相關研究22
第三章 實驗29
3.1實驗流程29
3.2製程設備以及量測設備30
3.2.1射頻電漿輔助化學氣相沉積系統30
3.2.2表面輪廓儀(Alpha-Step Profilometer ) 32
3.2.3原子力顯微鏡(Atomic Force Microscopy，AFM ) 33
3.2.4 拉曼光譜儀(Raman Spectroscopy) 33
3.2.5 水接觸角分析35
3.2.6 蛋白質活性測試35
3.2.6.1實驗流程35
3.2.6.2 BCA介紹36
3.2.7 血小板形貌觀察36
3.2.7.1實驗流程36
3.2.8細胞測試37
3.2.8.1細胞毒性分析37
3.2.8.1.1實驗步驟37
3.2.8.1.2 細胞培養38
3.2.8.1.2.1 冷凍細胞的活化38
3.2.8.1.2.2 細胞生長時培養基的更換與分盤39
3.2.8.1.2.3細胞冷凍保存40
3.2.8.1.2.4 細胞計數介紹40
3.2.8.2 MTT介紹40
3.2.8.3內皮細胞表面形貌觀察41
3.2.9微孔盤分析儀(ELISA reader) 41
3.2.10 細胞培養箱42
3.2.11 無菌操作台(Laminar Flow) 42
3.2.12 掃描式電子顯微鏡((Scanning Electron Microscopy; SEM) 42
第四章 結果與討論45
4.1電漿後處理製程對類鑽碳膜膜厚的影響45
4.2電漿後處理製程對類鑽碳膜表面粗糙度的影響46
4.3電漿後處理製程對類鑽碳膜表面結構的影響50
4.4電漿後處理製程對類鑽碳膜親疏水性的影響52
4.5電漿後處理製程對類鑽碳膜白蛋白&纖維蛋白吸附程度的影響56
4.6電漿後處理製程對類鑽碳膜的細胞毒性影響63
4.7電漿後處理製程對類鑽碳膜血小板貼附程度的影響65
第五章 結論73
參考文獻77

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