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研究生:毆琪瑜
研究生(外文):Ou C.J.
論文名稱:以健檢資料評估某半導體封裝材料廠員工之健康影響
論文名稱(外文):Evaluate the health of workers in the semiconductor packaging material factory by using serial employsss' health examination data
指導教授:呂志維呂志維引用關係
指導教授(外文):lLu Chih Wei
學位類別:碩士
校院名稱:高雄醫學大學
系所名稱:職業安全衛生研究所
學門:醫藥衛生學門
學類:公共衛生學類
論文種類:學術論文
論文出版年:2000
畢業學年度:88
語文別:中文
論文頁數:117
中文關鍵詞:健檢資料健康評估半導體封裝材料
外文關鍵詞:health examination datahealth evaluatesemiconductor packaging material
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以健檢資料評估某半導體封裝材料廠
員工之健康影響
Evaluate the Health of Workers in the Semiconductor Packaging Material Factory by Using
Serial Employees' Health Examination Data
歐琪瑜 呂志維
Ou C. J. , Lu Chih Wei
高雄醫學大學職業安全衛生研究所
學號:8661001
中華民國八十九年八月十五日
摘要
全球IC產業在1999年脫離連續三年的不景氣,而在國內半導體產業從1993年的34億1,600萬美元,經歷五年已大幅成長三倍,台灣國內的半導體廠商之生產僅佔17%,剩餘的83%均仰賴進口,因此台灣半導體廠商的成長空間仍有相當大的,預計在2000年將有40座的晶圓廠投入生產,將使台灣從1999年佔全球的11.9%產值提高到13.4%,產業產值可達5328億台幣,佔台灣的經濟產值31.7%,其中封裝業佔全球的24%,相形之下也提高封裝材料的需求,包含導線架(1)及BGA(2)基本的需求。
半導體製造業一開始被稱為極乾淨的工業,但很快就被發現其職業安全衛生的問題與傳統業的問題不同,且嚴重性也很大,所以許多研究者紛紛投入研究半導體業其特殊的安全衛生問題所產生的職業病,而成就整個半導體的產業不只是晶圓廠而已,相關的下游電子業的工作環境與上游製造廠相較之下較不嚴謹,但就工作壓力及化學品的使用上卻與上游製造業相似,但卻不完全相同,此類產業的安全衛生較少被重視,本研究擬對半導體下游電子業其中之一的製造產業的安全衛生問題,對員工健康狀況做初的評估研究。
本研究以兩年的員工健康檢查資料及配合作業環境測定的資料,探討某半導體封裝材料廠員工健康的變化,本研究的結果1.員工工作壓力指數超過臨界值的有25%。2.目前作業環境偵測結果與健康指數變化無相依性。3.毒性化學物質作業員工肝功能指數(GOT)異常率大於其他作業員工。4.前後二年員工健康指數以T檢定結果膽固醇指數下降,三酸甘油脂指數上升。5.某特定化學作業場員工精子功能及型態上初步上有較高的不正常率。
(1) 導線架:(Lead Frame)指將半導體線路引至外部,使其可與主機板連接成迴路之金屬物體,半導體使用之導線架可分為IC用導線架,電晶體用導線架及LED用導線架三種,其中IC用導線架之主要功能在於支撐晶片,並將晶片之迴路延續至IC包裝之外面,同時負擔部份晶片迴路產生熱能之散熱。
(2) BGA基板:(Ball Grid Array)是積體電路器(IC)採用有機載板(Substrate)的一種封裝 (Package)法,為全面性格點排列之球腳,可疏散腳距及增加腳數。
Evaluate the Health of Workers in the Semiconductor Packaging Material Factory by Using
Serial Employees' Health Examination Data

ABSTRACT
The semiconductor manufacturing has rapidly become one of most important industries since they are established a decade ago in Taiwan. It's risk management is thus different from that traditional industries because its is a chemical intensive industry. The purpose of this study is to evaluate the health of workers in the semiconductor packaging material factory and also studied possible protection. Materials of the semiconductor packaging are a set of procedures in the semiconductor manufacturing industry. The processes are very different of fab manufacturing factories but more like PC (chip) processes. Each process of device fabrication is detailed with its attendant chemical and physical hazards. Especially in the wet chemical stations, we tried to measure environment airborne contaminants and to sample the blood and urine from workers. The outcome is to deduce the exposure - related effects in the semiconductor packaging materials factory. It will be conducive to improve work environment and control designed to reduce exposures to chemical and physical hazards with personal protective equipment, engineering control, or administration control.

目錄
中文摘要
英文摘要
誌 謝
第一章 前言 …………………………………………………………..1
第二章 研究方法及材料……………………………………………..24
(一) 研究對象選取
(二) 尿液分析
(三) 一般血液分析
(四) 肝功能分析
(五) 微量元素分析
(六) Semen的檢查
(七) 作業環境測定
(八) 問卷
第三章 結果與討論………………………………………………….36
第四章 結論與建議………………………………………………….41
參考文獻……………………………………………………………….43

文獻參考
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