|
1. Technical document from Intel Corporation Inc, http://www.intel. com.tw/ 2. Kobayashi, T., Ogushi, T., Sumi, N., and Fujii, M., “Thermal Design Ultra-Slim Notebook Computer,” Thermal and Thermo mechanical Phenomena in Electronic System, The Sixth Intersociety Conference, pp. 15-21, 1998. 3. Mochizuki, M., Saito, Y., Goto, K., Nguyen, T., Phong, H., Malcolm, M., and Marando, M. P., “Hinged Heat Pipes for Cooling Notebook PCs,” Semiconductor Thermal Measurement and Symposium, SEMI-THERM XIII. Thirteenth Annual IEEE, pp. 64-72, 1997. 4. Nguyen, T., Mochizuki, M., Mashiko, K., Saito, Y., Sauciuc, L., and Boggs, R., “Advanced Cooling System Using Miniature Heat Pipes in Mobile PC,” Thermal and Thermomechanical Phenomena in Electronic System, The Sixth Intersociety Conference, pp. 507-511, 1998 5. Xie, H., Aghazadeh, M., Lui, W., and Haley, K., “Thermal Solution to Pentium Processors in TCP in Notebook and Sub-Notebooks,” IEEE Transaction on Components and Packaging and Manufacturing Technology, Part A, Vol. 19, No. 1, pp. 201-210, 1996. 6. Xie, H., Aghazadeh, M., and Toth, J., “The Use of Heat Pipes In the Cooling of Portables with High Power Packages,” Electronic Components and Technology Conference, 1995. Proceeding, pp. 906-913, 1995. 7. Rujano, J. R., Cadenzas, R., Rahman, M. M., and Moreno, W. A., “Development of A Thermal Management Solution for A Ruggedized Pentium Based Notebook Computer,” Thermal and Thermomechanical Phenomena in Electronic System, The Sixth Intersociety Conference, pp. 8-14, 1998. 8. Namba, K., Kimura, N., Niekawa, Y., Kimura, Y., and Hashimoto, N., “Thermal Analysis of Notebook Personal Computer,” Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International, pp. 456-459, 1996. 9. Lee, S., “Optimum design and selection of heat sinks,” IEEE Transaction on components, Packaging, and Manufacturing technology-Part A, pp. 812-817, 1995. 10. Bar-Cohen, A., and Jelinek, M., “Optimum arrays of longitudinal fins in convective heat transfer,” Heat Transfer Engineering, Vol. 6, pp. 68-78, 1985. 11. Bar-Cohen, A., “Fin thickness for an optimal natural convection array of rectangular fins,” ASME J. Heat Transfer, Vol.101, pp. 564-566, 1976. 12. Leung, C. W., and Probert, S. D., “Heat Exchanger Design: Optimal Thickness(under Natural Convective Conditions)of Vertical Rectangular Fins Protruding Upwards from a Horizontal Rectangular Base,” Applied Energy, No. 29, pp. 299-306, 1988. 13. Leung, C. W., and Probert, S. D., “Heat Exchanger Design:Optimal Length of an Array of Uniformly-Spaced Vertical Rectangular Fins Protruding Upwards from a Horizontal Base,” Applied Energy, No. 30, pp. 29-35, 1988. 14. Leung, C. W., and Probert, S. D., “Heat Exchanger Design: Optimal Uniform Thickness of Vertical Rectangular Fins Protruding Perpendicularly Outwards , at Uniform Separations , From a Vertical Rectangular, Base” Applied Energy, No. 26, pp. 111-118, 1987. 15. Leung, C. W., and Probert, S. D., “Heat transfers from shrouded rectangular-fin arrays,” Applied Energy 24, pp.77-81, 1985. 16. Yeh, R. h., and Chang, M., “Optimum Longitudinal Convective Fin Arrays,” International Communications in Heat and Mass Transfer, Vol. 22, No. 3, pp. 445-460,1995. 17. Biber, C. R., and Fijol, S., Fan-plus Heat sink “Optimization,” Mechanical and Thermal Design with Reality Proceedings of the International Systems Packaging Symposium , pp. 285-289, 1999. 18. Chen, Y. C., Li, C., “How to Make a Correct Assessment of Heat Sinks Performance,” pp. 277-285, 1995 19. Iwasaki, H., Ishizuka, M., “Forced Convection Air Cooling Characteristics of Plate Fins for Notebook Personal Computer,” IEEE International Society Conference on Thermal Phenomena, pp. 21-26, 2000. 20. Ken, T., Ishizuka, M., “Optimization of Parallel plate Heatsinks for Forced Convection,” IEEE International Society Conference on Thermal Phenomena, pp. 266-271, 2000. 21. Craig, K. J., and Kock, D, “Minimization of Heat Sink Mass Using CFD and Mathematical Optimization,” Journal of Electronic Packaging, Vol.21, pp. 143-147, 1999. 22. Madhusudan, I., and Bar-Cohen, A., “Least-Material Optimization of Vertical Pin-Fin, Plate-Fin and Triangular-Fin Heat Sinks in Natural Convective Heat Transfer,” IEEE International Society Conference on Thermal Phenomena, pp. 295-302, 1998. 23. Rujano, J. R., “Development of Thermal Management Solution for a Ruggedized Pentium Based Notebook Computer” IEEE International Society Conference on Thermal Phenomena, pp. 8-14, 1998. 24. Dunn, P. D., and Reay, D. A., Heat Pipes, 4th ed., Pergamon Press, New York, 1993. 25. Plesch, D., Bier, W., Seidel, D., and Schubert, K., “Miniature Heat Pipes for Heat Removal From Microelectronic Circuits,” Proc. ASME Annual Meeting, Atlanta, GA. 1991. 26. Hopkins, R., Faghri, A., and Khrustalev, D., “Flat Miniature Heat Pipes with Micro Capillary Grooves,” ASME J. Heat Transfer, Vol. 121, pp. 102-109,1999. 27. Schlichting, H., Boundary Layer Theory, McGraw-Hill Book Company, New York, NY, 6th ed, 1968. 28. Najafi, M., and Scott, R. R., “Average Heat-Transfer Coefficients for Laminar and Turbulent Flow over Partially Heated flat Plate,” Energy Conversion Engineering Conference, Proceedings. of the 31st.Intersociety, Vol. 3, pp. 1993-1996, 1996. 29. Sparrow, E. M., Baliga, B. R., and Patankar, S. V., “Forced Convection Heat Transfer from a Shrouded Fin Array with without Tip Clearance,” ASME J. Heat Transfer, Vol. 100, No. 4, pp. 572-579, 1978 30. Kraus, A. D. and Bar-Cohen, A., “Design and Analysis of Heat Sinks, John Wiley and Sons”, New York, 1995. 31. Iwasaki, H., Sasaki, T., and Ishizuka, M., “Cooling Performance of Plate Fins for Multi-chip Modules,” IEEE Transaction on Components, Packaging, and Manufacturing Technology-Part A, Vol. 18, No. 3, pp. 592-595, 1995. 32. Teertstra, P., and Yovanovich, M. M., and Culham, J. R., “Analytical Forced Convection Modeling of Plate Fin Heat Sinks ” IEEE SEMI —THERM Symposium, pp. 34-40, 1999. 33. Iwasaki, H., “Natural Convection Air Cooling Characteristics of Plate Fins in A Ventilated Electronic Cabinet” IEEE Inter Society Conference on Thermal Phenomena, pp. 124-129, 1998. 34. Patankar, S. V., and Spalding, D. B., “A calculation procedure heat, for heat, mass and momentum transfer in three-dimensional Heat parabolic flows,” Int. J. Heat Mass Transfer, Vol. 15, pp. 1787-1806, 1972 35. Patankar, S. V., “A calculation procedure for two-dimensional elliptic situations,” Number. Heat Transfer, Vol. 4, pp. 409-425 1981. 36. Doormal, J. P., and Rairhby, G. D., ”Enhancements of the SIMPLE method for predicting incompressible fluid flows,” Number. Heat Transfer, Vol. 7, pp. 147-163, 1984. 37. Spalding, D. B., “A novel finite-difference formulation for differential expressions involving both first and second derivatives,” Int. J. Number. Methods Eng., Vol. 4, pp. 551-559, 1972. 38. Knight. W., Goodling. S., “Optimum Thermal Design of Air Cooled Forced Convection Finned Heat Sinks Experimental” IEEE Transaction on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 5, pp. 754-760, 1992. 39. STAR-CD Version 3.0 Manual 40. Sant, J. H., “Temperature Variations on the Surface Strip Heated Flat Plate,” ASME J. Heat Transfer, Vol. 89, pp. 372-373,1967. 41. Frank, K., and Mark, S. B., Principles of Heat Transfer, West Publishing Company, 5th ed, 1993. 42. Leon M. R., and Herve, A., “Compact Air Cooled Heat Sinks for Power Packages,” IEEE Transaction on Components, Packaging, and Manufacturing Technology-Part A, Vol. 20 No. 4, pp. 442-451, 1997 43. Mercer W.E., Pearce W. M., Hitchcock, J. E., “Laminar Forced Convection in the Entrance Region Between parallel Flat Plates,” ASME J. Heat Transfer, pp. 251-257, 1967 44. Kern, D. Q., and Kraus A. D., Extended Surface Heat Transfer, McGraw-Hill, New York, 1972. 45. Viswanath, R., and Ali, I. A., “Thermal Modeling of High Performance Packages in Portable Computers,” Electronic Components and Technology Conference, 1995. Proceedings. 45th, pp. 1122-1133, 1995.
|