臺灣博碩士論文加值系統

本研究成功合成含矽氧烷與亞醯胺的氰酸酯，利用此新型氰酸酯硬化劑與商用diglycidyl ether of bisphenol A (Epon828)依不同當量比進行交聯。這些不同的配方比例可做出四組交聯產物。以動態DSC和FT-IR研究其交聯行為，熱機械性質則以TGA，TMA和DMA進行分析。動態DSC和FT-IR探討的結果，證明環氧樹脂與氰酸酯的反應機構，並在反應中生成oxazolidinone。由於氰酸酯含有矽氧烷與亞醯胺基，使得材料保有相當高的玻璃轉移溫度(Tg)並且提高熱穩定性。交聯產物中含有矽氧烷，而達到增韌的效果。TMA的分析，氰酸酯當量比例增加，使得熱膨脹係數降低，而有較佳的尺寸安定性。另一方面，導入矽氧烷的氰酸酯硬化劑與環氧樹脂在交聯後的四組試片其介電常數皆在3.7-4.0左右，與傳統的環氧樹脂4.6相比，確實達到改質的效果。

Cyanate ester containing siloxane and imide groups were synthesized. Various equivalent ratios of Epon828/cyanate ester for 1/1, 1/0.8, 1/0.6 and 1/0.4 were mixed and cured to give four cross-linked materials. Curing behavior was studied by dynamic DSC and FT-IR. Thermal mechanical properties were measured with TGA, TMA and DMA. Experimental evidence as investigated by dynamic DSC and FT-IR shows that curing reaction between epoxy and cyanate ester results in the production of oxazolidinone. The cured materials not only showed good Tg and thermal stability but also were toughened by siloxane group. TMA analyses showed that Epon828/cyanate ester = 1/1 had lower CTE and good dimension stability. In addition, the cured materials with dielectric constant of 3.7-4.0 were lower than those of general epoxy resin with 4.6.

中文摘要 i
英文摘要 ii
謝誌 iii
目錄 iv
表目錄 vi
圖目錄 vii
Scheme目錄 viii
第一章 緒論 1
1.1 前言 1
1.2 環氧樹脂 1
1.3 聚亞醯胺 6
1.4 矽氧烷 7
1.5 含矽氧烷之亞醯胺或環氧樹脂之補強材料文獻回顧 8
1.5.1 含亞醯胺基環氧樹脂相關文獻 8
1.5.2 含矽氧烷聚亞醯安相關文獻 10
1.5.3 含矽氧烷環氧樹脂相關文獻 10
1.6 氰酸酯 11
1.6.1 氰酸酯的合成反應原理 13
1.6.2 氰酸酯與環氧樹脂的硬化反應機構 14
1.7 研究動機 16
第二章 實驗 17
2.1 藥品 17
2.2 儀器 17
2.3 實驗流程 19
2.4 合成流程 19
2.5 單體合成 20
2.6 環氧當量滴定 22
2.7 單體鑑定 23
2.8 交聯行為分析 24
2.9 交聯產物性質測試 25
第三章 結果與討論 27
3.1 結構鑑定 27
3.2 交聯行為研究 28
3.3 交聯產物性質研究 35
第四章 結論 46
參考文獻 47
附錄 51
自傳 64

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