臺灣博碩士論文加值系統

近年來由於全球通訊、網路的蓬勃發展，為了滿足在諸如DWDM系統等大功率光纖傳輸系統中多芯及高密度光連接的需求，光纖連接器勢必朝多芯式小型光連接器發展，其中以MT型光纖連接器為目前多芯式連接器發展之主流。在光纖連接器的組裝過程中，光纖經加熱使環氧樹脂固化而使光纖固定於套圈內，成為一光纖套圈模組，待冷卻至室溫後，經過光纖切斷及端面研磨製程之後，發現在光纖端面有裂縫產生，因而造成光耦合不良及訊號衰減之問題。本文即針對目前鮮少被研究之MT型多芯光纖套圈模組於膠固封裝後之力學行為，來探討此問題。
本文利用有限元素分析軟體ANSYS來探討光纖套圈模組於膠固封裝製程中，光纖之力學行為，並透過田口品質方法來探討光纖幾何尺寸及各種製程參數對光纖應力之影響，找出最佳的參數組合，降低光纖連接器之不良率，並利用實驗來驗證分析之結果。
經研究後發現，光纖熱應力和加熱溫度成正比，加熱溫度以不超過120℃為佳，殘留應力則冷卻至一定時間後便不再變化。套圈尺寸越大或光纖芯數越少，其光纖產生之應力更大。另外，田口方法提供了一組最佳的膠固封裝製程參數，能成功的降低光纖產生之應力，並縮短製程時間。而光纖產生之應力主要是受到光纖直徑組合、加熱溫度及冷卻時間影響。

In recent years, the global communication and internet have been more and more popular. In order to support high fiber count and dense optical connection demand for high-power optical fiber delivery system, multi-fiber with SFF (Small Form Factor) will for sure be the optical fiber connectors in the future and the development of MT connectors will especially become the main trend. The end face cracking of multimode optical fiber will likely be created in epoxy-curing, cleaving and polishing during the assembly process of connector and there will be problems of optical coupling and loss. The aim of this research is focused on the optical fiber in epoxy-cured ferrule module of MT connectors, which has been rarely discussed so far.
This study applies FEA to investigate optical fiber stress in epoxy-curing ferrule module. In addition, the Taguchi Method can help in understanding the effects of design factors in the process and finding the optimal factor combinations to reduce the rate of defected connector. The optimal results will be verified by the connector assembly experiment.
It is found that the thermal stress of optical fiber is in direct proportion to the heating temperature. It is better to keep the heating temperature under 120℃. Residual stress of optical fiber stays constant after cooling for a certain time. The larger size of ferrule or the less optical fiber count in the same size of ferrule, the bigger stress optical fiber will produce. In addition, the Taguchi Method provides a optimal epoxy-curing process parameter to successfully reduce the stress of optical fiber and decrease the time of fabrication. The stress of optical fiber is influenced by a collocation of optical fiber diameter, heating temperature, and cooling time.

中文摘要……………………………………………………… I
英文摘要……………………………………………..……… II
誌 謝………………………………………………………… III
目 錄…………………………………………………………… IV
符號索引……………………………………………………… VIII
圖表索引…………………………………………………………… XI
第一章 緒論………………………………………………….. 1
1.1 前言………………………………………………………. 1
1.2光纖與多芯光纖套圈………………………………….…. 3
1.2.1 光纖………………………………………………… 3
1.2.2 多芯光纖套圈……………………………………… 4
1.3文獻回顧………………………………………………....... 5
1.4研究動機與目的…………………………………..………. 8
1.5組織與章節…………………………………………………. 9
第二章 理論基礎……………………………………………….. 15
2.1熱分析………………………………………………......... 15
2.1.1 熱傳導……………………………………………….. 15
2.1.2 熱對流……………………………………………….. 16
2.1.3 熱輻射……………………………………………….. 16
2.2 應力分析…………………………………………......... 17
2.3 黏彈性分析……………………………………………..... 18
2.3.1 Maxwell 模型……………………….................. 19
2.3.2時效等溫原理………………………………………… 20
2.4 破壞準則………………………………………………. 21
第三章 問題假設與分析方法………………………………….. 24
3.1 問題基本假設…………………………………………. 24
3.2 有限元素分析軟體-ANSYS…………………………..… 24
第四章 有限元素分析結果與討論…………………………….. 35
4.1 初始光纖模組設計分析………………………………. 36
4.1.1光纖套圈模組之溫度分佈…………………………… 36
4.1.2光纖之應力行為……………………………………… 36
4.1.3環氧樹脂之應力行為………………………………… 38
4.2 不同加熱溫度之比較………………………….......... 38
4.3 光纖受應力破壞可能原因……………………............ 38
4.4 2D與3D模型之比較………………………………….. 39
4.5 光纖凸出量之比較……………………………………..... 40
4.6 Mini-MT Ferrule光纖之應力行為………...……….. 41
4.7 黏彈性與彈性材料之比較……………………………..... 41
4.8 環氧樹脂不同厚度之比較…………………………...….. 42
4.9 不同光纖直徑組合之比較…………………...………….. 43
第五章 田口式品質工程方法………………………………….. 57
5.1 實驗設計……………………………………...………….. 59
5.2 實驗結果……………………………………...………….. 61
5.3 變異數分析………………………………...…………….. 61
5.3.1 光纖熱應力之變異分析結果……………………….. 63
5.3.2 光纖端面殘留應力之變異分析結果……………….. 63
5.4 確認實驗……………………………………...………….. 64
5.5 田口方法與實驗驗證………………………………………. 66
第六章 結論與未來展望……………………………………..… 78
6.1 結論…………………………………………………………. 78
6.2 未來展望……………………………………………………. 80
參考文獻…………………………………………………………… 82
附錄A 光纖端面SEM圖………………………………………….. 85
附錄B 收斂分析………………………………………………... 87
作者簡介…………………………………………………………… 89

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