臺灣博碩士論文加值系統

中文摘要
近幾年來由於半導體科技蓬勃的發展，傳統光學微影技術也不斷地精進；然而在製作奈米等級線寬又受到物理極限的限制，也造成成本上沉重的負擔。奈米壓印的技術發展至今，其在奈米結構與奈米製程上的重要性，是當今奈米科技中的重要研究課題。當中雷射輔助奈米壓印技術更被譽為下一世代最具潛力的技術之一。在雷射輔助奈米壓印技術當中，本研究使用KrF短波長脈衝式準分子雷射，其雷射波長為248 nm、脈衝時間為30 ns，作為輔助加熱矽晶片達到瞬◎間融化的熱源。並使用高透光率石英當作母膜，在其上定義出奈米等級特定圖案，再與欲壓印矽晶片接觸並施加壓力，而後從高透光率石英正上方施加準分子雷射，造成表層矽晶片材料的瞬間熔融，配合預先加載於材料表面之石英母模，直接在材料表面完成奈米壓印與奈米特徵圖形的轉移。其優點在於可去除半導體製程的光阻塗佈、曝光、顯影、及蝕刻等手續，而直接在矽晶片上製作奈米等級圖案。
本研究在電子束微影方面成功克服電荷累積的問題，在高透光率石英完成200 nm線寬的圖形，同時以舉離法完成200 nm線寬的金屬擋罩，再加以蝕刻做為母膜。並架設雷射加工平台，藉由此準分子雷射工作平台來探討加工參數對於製程上的影響，本文挑選雷射能量密度1.15～1.6 J/cm2而壓印力量為1.0～3.0 kg，藉以探討雷射能量、壓印力量對於壓印深度的相互影響。

Abstract
Due to the rapid development of semiconductor technology, the optical photolithography is advanced constantly. Nevertheless, the feature size smaller than 100 nm has reached its physical limitation and the escalating cost has become a burden for many companies. As an alternative to photolithography, the Nano-imprinting lithography（NIL）is now a promising method for nano-patterning and nano-fabrication. In this study, we focused on silicon materials and utilized a single KrF excimer laser pulse which has a wavelength of 248 nm and a pulse duration of 30 ns as the heating source. The fused quartz mold for laser assisted nano-imprinting has nanometer-scaled features. A single KrF excimer laser passes through the quartz mould and melts a thin surface layer of the silicon substrate within picoseconds. The quartz mold bears some pre-fabricated nano-scald features on its contact side and is made of matericals transparent to the excimer laser. Upon radiating the excimer laser pulse on the sample surface, the near-surface silicon melt. Subsequent cooling and solidification of the molten layer will then complete the transformation of the nano-patterns from the mold to the silicon sample. This rapid technique for patterning nano-scale features in silicon does not require sping coating photo-resist, photolithography , and chemical etching. To fabricate nano-scaled feature quartz molds, this research utilizes condcting polymer ESPACER300 as conducting layer to dissipate charge effect and applied E-beam lithography technology to achieve 200 nm line width. Following by lift-off and inductively coupled plasma (ICP) etching we can get the nano-scale feature mold.
A working platform based on an Excimer Laser Micro-Machining system is constructed for LADI process. The influence of laser fluence and the imprinted pressure on the resulting structures was verifying by varying the laser fluence (1.2～1.6 J/cm2) and the imprinted load (1.0～3.0 kg). The results have shown that the morphology and the imprinted depth were directly related to the laser fluence and the imprinted pressure.

中文摘要....................................................Ⅰ
Abstract.....................................................Ⅱ
Acknowledgements........................................... Ⅳ
Contents................................................... Ⅵ
List of Tables................................................ Ⅷ
List of Figures................................................Ⅸ
Symbols Descriptions........................................ⅩⅣ

Chapter 1 Introduction
1-1 Preface......................................................1
1-2 Research Background..............................................1
1-3 Motivation...................................................3
1-4 Thesis Outline................................................4
Chapter 2 Literature Survey and Technology Development
2-1 Literature Survey..............................................5
2-2-1 Hot Embossing Nano-Imprint Lithography (HE-NIL) .................5
2-2-2 Soft Imprint Lithography (SIL) ..................................8
2-2-3 UV Cured Nanoimprint Lithography (UV-NIL)......................10
2-2-4 Laser Assisted Direct Imprint (LADI)............................ 12
2-2 The Fabrication of Quartz mold Machining Technique................14
2-2-1 The Quartz Crystal and Properties.............................. 14
2-2-2 The Quartz Machining Technique...............................16
Chapter 3 Experimental Technique and Procedure
3-1 Experimental Instruments and Equiments..........................24
3-2 Mold Fabrication.............................................30
3-2-1 Electron Beam Lithograph....................................30
3-2-2 Beforehand Preparation......................................35
3-2-3 Electron Beam Lithography on Quartz............................37
3-3 Laser-Assisted Direct Imprinting (LADI)..........................50
3-3-1 Excimer Laser Micro-Machining System.......................... 50
3-3-2 Designed Working Platform................................... 53
3-3-3 Process for LADI........................................... 56
Chapter 4 Result and Discussion
4-1 Result......................................................58
4-1-1 Surface appearance by Scanning Electron Microscopy (SEM)...........58
4-1-2 Imprinted depth by Atomic Force Microscopy (AFM).................62
4-2 Discussion.................................................. 68
Chapter 5 Conclusion and Future Perspective
5-1 Conclusion..................................................74
5-2 Perspective..................................................77
References....................................................... 78

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