臺灣博碩士論文加值系統

本研究發展出高精度接觸式三維量測探頭，以懸浮片機構結合探針為基礎，搭配光學式位移感測器，測量探針接觸到工件後探球的三維位置變化。經精密儀器校正後，在行程20微米範圍內，各項性能之標準差皆在20奈米內。
有別於現今市面上製造程序複雜的探頭，本研究所提出之探頭可用傳統機械加工的方式完成，搭配三套自製微型化雷射干涉儀，可滿足現今微奈米級三次元量測儀之規格。

In this research, a high precision tactile 3D probe is proposed. Based on suspension mechanism with a stylus, the probe is able to detect the 3D displacement on the ball tip using optical sensors. Calibrations with a nano measuring and positioning machine proved the excellent performances in the whole measuring range.
Rather than complicated fabricating processes, this probe can be made by conventional machining processes. With three miniature interferometers, this probe could fill all requirements for the basic concepts of micro-/nano- CMM.

致謝 ii
中文摘要 iii
Abstract iv
目錄 v
圖目錄 viii
表目錄 xi
第一章 緒論 1
1.1 研究動機 1
1.1.1 微奈米級三次元座標量測儀與探頭系統 2
1.1.2 研究目標 4
1.2 文獻回顧 5
1.2.1 壓敏電阻感測類： 5
1.2.2 電感及電容感測類： 7
1.2.3 光學量測類 9
1.2.4 自激共振類 12
第二章 探頭結構與量測原理 16
2.1 探頭結構設計 16
2.1.1 懸浮機構設計 16
2.1.2 探頭系統組裝 18
2.1.3 影響裝置 19
2.2 感測器原理 20
2.2.1 麥克森干涉儀 20
2.2.2 抗偏擺式干涉儀 24
2.2.3 測力計 25
2.2.4 訊號處理 28
第三章 探頭校正與矩陣運算 31
3.1 轉換矩陣 32
3.2 參數校正 34
3.2.1 X方向校正 35
3.2.2 Y方向校正 36
3.2.3 Z方向校正 37
3.2.4 校正結果 38
3.3 掃描性能 40
3.3.1 應用轉換矩陣於校正方向 40
3.3.2 水平45°方向矩陣驗證 42
3.4 觸發性能 43
3.4.1 觸發點判別 43
第四章 力學分析 46
4.1 力學推導 46
4.1.1 Euler-Bernoulli懸臂梁理論 46
4.1.2 剛性矩陣 48
4.1.3 座標轉換 50
4.1.4 X方向受力 51
4.1.5 Y方向受力 54
4.1.6 Z方向受力 56
4.1.7 均剛性條件 57
4.2 有限元素分析與模擬 58
4.3 剛性實驗 61
4.3.1 測力計校正 61
4.3.2 剛性實驗原理 63
4.3.3 實驗結果 65
4.3.4 變更桿長調整剛性 67
4.4 綜合比較 68
第五章 結論與未來展望 71
5.1 結論 71
5.2 未來展望 71
參考文獻 73

[1]Taniguchi, N., “Current State in, and Future Trends of, Ultraprecision Machining and Ultrafine Materials Process”, Annals of CIRP, 32(2), 573-582(1993)
[2]Bos, E.J.C., F.L.M. Delbressine, and H. Haitjema, “High-accuracy CMM metrology for micro systems”. VDI Berichte, 511-522 (2004).
[3]Takamasu, K., Ozawa, S., Asano, T., Suzuki, A., Furutani, R., Ozono, S., “Basic Concepts of Nano-CMM,” The Japan - China Bilateral Symp. on Advanced Manufacturing Eng., 155-158 (1996).
[4]范光照、張郭益, “精密量測”, 5th ed.高立圖書(2007)
[5]Peggs, G.N., Lewis, A.J. and Oldfield, S.,”Design for a Compact High-Accuracy CMM.” CIRP Annals - Manufacturing Technology, 417-420 (1999)
[6]Bos, E. J. C., “Tactile 3D probing system for measuring MEMS with nanometer uncertainty.” ISBN 978-90-386-1216-4, PhD thesis, Eindhoven University of Technology, Eindhoven, The Netherlands (2007).
[7]Weckenmann, A., Peggs, G., and Hoffmann, J., “Probing systems for dimensional micro- and nano-metrology”, Meas. Sci. Technol., 17 (2006)
[8]Dai, G., Butefisch, S., Pohlenz, F., Danzebrink, H.U., ” A high precision micro/nano CMM using piezoresistive tactile probes,” Measurement Science and Technology, 20, 084001-084009 (2009).
[9]Haitjema, H., Pril, W.O., and Schellekens, P.H.J. “Development of a Silicon-based Nanoprobe System for 3-D Measurements.” CIRP Annals - Manufacturing Technology, 50(1): 365-368 (2001)
[10]Pril, W. O., “Development of high precision mechanical probes for coordinate measuring machines,” ISBN 90-386-2654-1, PhD thesis, Eindhoven University of Technology, Eindhoven, The Netherlands (2002).
[11]Peiner, E. and et al., “Tactile probes for dimensional metrology with microcomponents at nanometre resolution.”, Measurement Science and Technology, 19(6): 064001-064008 (2008)
[12]Claverley, J. D., Leach, R. K., "A vibrating micro-scale CMM probe for measuring high aspect ratio structures," Microsyst. Technol., vol. 16, 1507-1512 (2010).
[13]Kung, A., Meli, F., Thalmann, R., “Ultraprecision micro-CMM using a low force 3D touch probe. Meas. Sci. Technol., 319-327 (2007)
[14]Schwenke, H., Hartig, F., Wendt, K., Waldele, F., “Future challenges in co-ordinate metrology: Address metrological problems for very small and very large parts,” IDW 2001, 1-12 (2001).
[15]Muralikrishnan, B., Stone, J.A., and Stoup, J.R.,” Fiber deflection probe for small hole metrology”. Precision Engineering, 30(2), 154-164 (2006)
[16]Enami, K., Kuo, C.C., Nogami, T., Hiraki, M., Takamasu, K., Ozono, S., “Development of nano-Probe System Using Optical Sensing”. IMEKO-XV World Congress, 189-192 (1999)
[17]Balzer, F.G., Hausotte, T., Dorozhovets, N., Manske, E., Jager, G., “Tactile 3D microprobe system with exchangeable styli” Meas. Sci. Technol., 22, 094018-094024 (2011)
[18]Van Riel, M.C.J.M., Bos, E.J.C., “3D vibrating for measuring microfeatures with nanometer uncertainty”, 56th Int. Sci. Coll. (2011)
[19]Masuzawa T., Hamasaki, Y., Fujino, T., “Vibroscanning method for nondestructive measurement of small holes”, Annals of CIRP, 42, 589-592 (1993)
[20]Kim, B., Masuzawa, T., Bourina, T., “The vibroscanning method for the measurement of micro-hole profiles”, Measurement, 10, 697-705 (1999).
[21]Salah, H.R., “Probing System Characteristics in Coordinate Metrology”, Meas. Sci. REVIEW, Volume 10, No 4, 504-509 3(2010)
[22]Michihata, M., Takaya, Y., Hayashi, T., “Development of the nano-probe system based on the laser-trapping technique”, CIRP Annals - Manufacturing Technology 57, 493-496 (2008)
[23]潘韋廷, ”具影像觀察功能之微奈米級三次元接觸式掃描探頭研製.” 國立台灣大學機械工程研究所碩士論文(2010)
[24]Michelson, A. A., “On the Relative Motion of the Earth and the Luminiferous Ether,” American Journal of Science 22, 120–129 (1881).
[25]鍾一正, “微型可重構式超精密光學干涉儀之研製” 國立台灣大學機械工程研究所碩士論文(2011)
[26]Cheng, F. and Fan, K. C., “Linear diffraction grating interferometer with high alignment tolerance and high accuracy,”Appl. Opt.50(22), 4550–4556 (2011).
[27]Jager, G., Manske, E., Hausotte, T., Buchner, H. J., “Nanomeasuring machines”, MICRO.tec 2000 Hannover, 25-27 (2000).
[28]Yang, P. , et al, “Development of high-precision micro-coordinate measuring machine: Multi-probe measurement system for measuring yaw and straightness motion error of XY linear stage”, Precision Engineering 35, 424-430(2011)
[29]Park, J.J., Kwon, K., Cho, N., “Development of a coordinate measuring machine (CMM) touch probe using a multi-axis force sensor”, Meas. Sci. Technol. 17, 2380-2386 (2006)
[30]Bos, E. J. C., ”Aspect of tactile probing on the micro scale”, Precision Engineering 35, 228-240 (2011)
[31]Wozniak, A., Mayer, J.R.R., Balazinski, M., “Stylus tip envelop method: corrected measured point determination in high definition coordinate metrology”, Manuf Technol 42, 505-514 (2009)
[32]Claverley, J.D., Georgi. A., Leach, R.R., “Modelling the Interaction Forces between an Ideal Measurement Surface and Stylus Tip of a Novel Vibrating Micro-scale CMM Probe”, IFIP AICT 315, 131-138 (2010)
[33]Beer, F.P., Johnston, E.R., Dewolf, J.T., “Mechanics of Materials”, 3rd edition (2004)
[34]Hermann, G., “Design of Tactile Measuring Probes for Coordinate Measuring Machines”, Acta Polytechnica Hungarica, Vol 6, No 1, 63-77 (2009)
[35]Bos, E. J. C., Heldens, R. W. P., Delbressine, F. L. M., Schellekens, P. H. J., Dietzel, A., ”Compensation of the anisotropic behavior of single crystalline silicon in a 3D tactile sensor,” Sens. Actuat. A 134, 374–381 (2006).
[36]Sun, Y., Fowkes, C.R., Gindy, N., Leach, R.K., “Variation risk analysis: MEMS fabrication tolerance for a micro CMM probe”, Int J Adv Manuf Technol, 47, 1113-1120 (2010)
[37]Coates, R.C., Coutie, M.G., Kong F.K., “Structural analysis”, Chapman & Hall (1988)
[38]Przemieniecki, J.S., ”Theory of matrix structural analysis”, McGraw-Hill, (1968)
[39]http://www.roymech.co.uk/Useful_Tables/Torsion/Torsion.html
[40]Chu, C.L., Chiu, C.Y., “Development of a low-cost nanoscale touch trigger probe based on two commercial DVD pick-up heads”, Meas. Sci. Technol., 1831-1842 (2007)
[41]林家佑,”具影像觀察功能之微奈米級三次元接觸式量測探頭分析與研製.”國立台灣大學機械工程研究所碩士論文(2008)
[42]http://www.matweb.com/index.aspx
[43]Brandari, V.B., “Design of MACHINE ELEMENTS”, 2nd edition, McGraw-Hill (2007)