臺灣博碩士論文加值系統

由CMOS電路與MEMS結構製程技術整合，運用在電容式生醫感測器結構，可提供便利的生醫檢測。本文的感測區域製作僅使用CMOS標準製程，以避免製作MEMS結構之後製程，這樣在做生醫檢測時，本晶片只要改變在結構表面的功能化修飾之步驟，就可以感測各種不同的生物分子或病菌病毒。
本晶片為指叉狀電極之電容式感測，是利用晶片製程上指叉電容表面上方的氧化矽層(Silicon dioxide)去做感測，因為氧化矽層可以做表面的生物改質，使得原本晶片的氧化矽表面被修飾成為佈滿抗體之表面。
而本研究最大的不同點為抗原(即目標物抗原、互補抗體)不同於傳統的抗原(互補抗體)，而是利用磁珠(magnetic beads)去當作目標物，所以要外加電感器圍繞在指叉電容外圍，以吸取磁珠到指叉電容上面做表面功能化修飾。
所以我們使用磁珠作為感測目標，再將經過生物實驗修飾過表面之電容器加入磁珠之後，量測電容的變化量，而部份沒吸取到磁珠之電容器的電容變化量則只是在一個穩定的範圍內上下擺動，有吸取到磁珠的電容值則是變得比原本的還小，經由實驗組與控制組之差異性，我們可確定說本晶片實現了CMOS 8x8電容式生醫感測器。

In this work, a standard CMOS process is used to integrate sensing circuits and MEMS structures to form capacitive biosensors. The sensing interface areas are formed without requiring post-CMOS micromachining processes, leading to convenient fabrication. Surface modification and functionalization can be performed for detection of a variety of biological molecules or bacteria viruses.
This chip contains an array of interdigitated microelectrodes for capacitive sensing, in which the coated silicon dioxide on top is used for biomolecule immobilization. Anti-streptavidin antibody is used in this work, which is immobilized on chip surface while magnetic microbeads coated with streptavidin are driven to the sensing sites for specific binding.
This is the major difference from conventional biosensors using target antigen and complementary antibody. On-chip inductors produce electromagnetic forces to attract microbeads to the center of each microcoil, where microelectrodes are located, for capacitive detection. Capacitance change due to magnetic beads remaining on the chip after specific binding is successfully demonstrated with an 8×8microcoil and capacitive sensor array.

第1章 緒論...............................................1
1-1 研究動機.............................................1
1-2 CMOS-MEMS技術介紹....................................4
1-3 文獻回顧.............................................6
第2章 電容感測與線圈驅動電路架構...........................11
2-1 電容感測電路的運作機制...............................11
2-2 線圈驅動電流電路架構.................................19
2-3 感測與驅動結構設計與模擬..............................22
2-4 晶片電路佈局圖......................................35
第3章 生物實驗之方法與檢測................................37
3-1 生醫材料之介紹......................................37
3-2 表面固定化測試......................................40
第4章 晶片量測與感測結果..................................44
4-1 晶片檢視與封裝......................................44
4-2 實驗前準備..........................................48
4-3 晶片量測............................................50
第5章 未來展望與規劃.....................................69
參考文獻...................................................70

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