臺灣博碩士論文加值系統

本研究分兩部份，第一部份主要針對對稱型氰酸酯樹脂(BCYPP)和不對稱型氰酸酯樹脂(DCDPE)各含0.05phr乙醯丙酮鉻硬化促進劑之硬化過程中間產物進行結構鑑定及比較,首先利用管柱層析法和凝膠色差層析儀進行中間產物分離，再以傅立葉紅外線光譜儀進行結構鑑定。結果發現兩者反應都先產生dimer，當triazine（3rd-monomer）產生後結構不穩定，反應加速直到6th-monomer產生後才穩定下來，由此可知在氰酸酯樹脂的交聯硬化反應中triazine structure（3rd-monomer）具有催化反應的效果。
第二部份主要針對對稱型氰酸酯樹脂(BCYPP,B10)和不對稱型氰酸酯樹脂(DCDPE,L10)分別和雙馬來醯亞胺樹脂(BMI)、烯丙胺-接-雙馬來醯亞胺樹脂(A10-BMI、A50-BMI)相互摻合時硬化過程中的初期反應產物結構分析，結果發現氰酸酯樹脂進行triazine的反應，BMI進行homopolymerization的反應，硬化後，物性測試發現BMI會降低氰酸酯樹脂的介電常數，但反應溫度仍太高，再將烯丙胺接在BMI上形成A-BMI後，和氰酸酯樹脂摻合，發現A-BMI大幅降低BMI的熔點，提高摻合系統的加工性，且降低反應溫度，有加速反應的作用，較適合當作電子封裝的基材。

This study was aimed to improve the reactivity and properties of symmetrical and unsymmetrical cyanate esters by blending with various bismaleimdes (BMI). First of all, we investigated the curing kinetics of cyanate esters and found that in the initial curing reaction the yielded triazines can attract the monomers and accelerate the reactions. The presence of BMI in the blends did not interfere with the formation of triazine from cyanate ester and BMI itself also underwent the homopolymerization. Although the addition of BMI can lower the dielectric constant of cyanate ester, the curing temperature of such blended system is still high. When the allylamine was attached to the BMI monomers to form the A-BMI before blending with cyanate ester, A-BMI, having much lower melting temperature than BMI, can significantly lower the curing temperature of cyanate ester and improve its processability. Because the cyanate ester/A-BMI blending systems have lower curing temperature and faster curing reaction, they should be more suitable for electronic packaging applications.
keywords: cyanate esters、Bismaleimides、polyblends、electronic packaging

中文摘要………………………………………………………….…I
英文摘要……………………………………………………………II
圖索引.……………………………………………………………..V
第一章 緒論……………….……………………………………….1
1-1前言………………….……………………………………….1
1-2文獻回顧………………………………………………………2
1-3研究方向…………………………………………………….12
第二章 實驗………………………………………………………..16
2-1實驗藥品…………………………………………………….16
2-2實驗儀器…………………………………………………….17
2-3實驗步驟…………………………………………………….19
2-3-1 BMI的合成…………………………………………….19
2-3-2 A10-BMI和A50-BMI的合成….…………………….20
2-3-3 摻合物製備…………………………………………….20
2-3-3-1 DCDPE(BCYPP)與BMI混合物樣品製備………..20
2-3-3-2 DCDPE(BCYPP)與A10-BMI混合物樣品製備……20
2-3-3-3 DCDPE(BCYPP)與A50-BMI混合物樣品製備…..21
2-3-4 硬化條件………………………………………….….21
2-4 測試方法……………………………………………………..1
第三章 結果與討論………………………………………………..25
3-1 探討氰酸酯樹脂(DCDPE,BCYPP)自身的硬化反應機構…..25
3-2 烯丙胺-接-雙馬來醯亞胺樹脂(A10-BMI、A50-BMI)的合成
特性及分析………………….…………………………….27
3-2-1 烯丙胺-接-雙馬來醯亞胺樹脂(A10-BMI、A50-BMI)的
化學結構分析………….…………………………….28
3-3-2 烯丙胺-接-雙馬來醯亞胺樹脂(A10-BMI、A50-BMI)的
硬化反應及物性探討………….…………………….32
3-3 DCDPE氰酸酯樹脂和各種雙馬來醯亞胺樹脂反應性之分
析…………………………………………………………..34
3-3-1 DCDPE氰酸酯樹脂和雙馬來醯亞胺樹脂BMI初期反應產
物結構之分析………………………………………….36
3-3-2 DCDPE氰酸酯樹脂和烯丙胺-接-雙馬來醯亞胺樹脂A10-
BMI初期反應產物結構之分析….…………………….38
3-3-3 DCDPE氰酸酯樹脂和烯丙胺-接-雙馬來醯亞胺樹脂A50-
BMI初期反應產物結構之分析.……..……………….39
3-4 氰酸酯樹脂(DCDPE、BCYPP)和各種雙馬來醯亞胺樹脂
(BMI、A10-BMI、A50-BMI)摻合物之物性測試…………….41
3-4-1 氰酸酯樹脂(DCDPE)和各種雙馬來醯亞胺樹脂(BMI、
A10-BMI、A50-BMI)摻合物之黏度性質探討………….41
3-4-2 氰酸酯樹脂(DCDPE、 BCYPP)和各種雙馬來醯亞胺樹脂
(BMI、A10-BMI、A50-BMI)摻合物之介電性質分析…..42
3-4-3氰酸酯樹脂(DCDPE、 BCYPP)和各種雙馬來醯亞胺樹脂
(BMI、A10-BMI、A50-BMI)摻合物之Tg點比較……….43
第四章 結論..………………………………………………….….45
第五章 參考文獻…………………………………………………..47

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