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研究生:王振宇
研究生(外文):Jenn-Yeu Wang
論文名稱:青銅基鑽石磨棒磨削BK7光學玻璃之研究
論文名稱(外文):A Study of the Bronze Bonded Diamond Tool for Grinding BK7 Glass
指導教授:羅勝益
指導教授(外文):Shenq-Yih Luo
學位類別:碩士
校院名稱:華梵大學
系所名稱:機電工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2006
畢業學年度:94
語文別:中文
論文頁數:118
中文關鍵詞:鑽石磨棒青銅基石墨樹脂磨削力粗糙度磨耗材料去除機構
外文關鍵詞:diamond toolsbronze bondgraphiteresingrinding forceroughnesswearmaterial removal mechanism
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本文目的在探討以熱壓燒結方式製作四種不同含量之石墨與樹脂於青銅基的鑽石磨棒,乾磨削BK7光學玻璃材料之性能分析,並使用四種不同主軸轉速及進給率磨削工件,分析其磨削力、鑽石磨棒磨耗、材料去除形態及工件表面粗糙度情形。實驗結果顯示:在青銅基結合劑當中,使用愈多量的石墨粉與愈少量的樹脂粉之鑽石磨棒,呈現相對較緊密的組織,反之,愈多的樹脂粉及較少的石墨粉者,則相對呈現較鬆散與較弱的組織。當青銅基鑽石磨棒含愈多石墨粉者,乾磨削BK7光學玻璃工件所得到平均磨削力相對愈大,這可能與含較少樹脂的較強組織有關,反之,當含樹脂粉量較多之鑽石磨棒,則所得磨削力相對較低。另外,磨削所產生的磨削力隨磨削次數增加而愈大,這是鑽石磨棒鈍化之故,及隨著主軸轉速及進給率愈高即每轉進給量越小則磨削力愈小,這是由於切屑愈薄的關係。
鑽石磨棒乾磨削BK7光學玻璃去除行為,主要以脆性破裂為主,工件磨痕周圍處呈現脆性磨削,表面存有一些較深裂痕,因被較突出鑽石磨粒且在較大作用力下切削所導致。反之,在磨痕中心處則呈現玻璃屑塑性變形流動黏著於脆性破裂工件表面上,因磨棒上的較多鑽石磨粒平化在磨削力較小下產生摩擦所造成。此外,當使用較多樹脂及少量石墨填加劑於青銅基的鑽石磨棒,在較高的轉速及進給率條件下,可得較佳的工件表面粗糙度。
The purpose of this paper is to investigate the bronze-bonded diamond tools made of four different amounts of resin and graphite by using the hot press. These tools operated in the dry grinding BK7 glasses were used to evaluate the performance of grinding forces, the diamond wear, the material removal mechanisms and the surface roughness under four different conditions of the high spindle rotation speed and feed.
The experimental results showed that the diamond tools containing the more amounts of graphite and the less amounts of resin displayed a close-packed and strong structure. On the contrary, the diamond tools with the more amounts of resin and the less amounts of graphite showed a loose and weak structure. When a diamond tools with the more amounts of graphite was employed, the average grinding forces produced during the dry grinding BK7 glasses were relatively larger. This is possibly the effect of a strong structure of bond containing a fewer amounts of resin. In addition, the grinding forces with the increase of the grinding step increased. This is because the diamond tools become progressively worn. Furthermore, the grinding forces with the increase of the spindle rotation speed and feed decreased. It was attributed to the thinner chip produced.
The BK7 glasses ground by the diamond tools mainly displayed a brittle fracture mode. The material removal behaviors on the circumference of the trace during the dry grinding BK7 glasses displayed a brittle fracture appearance with some deeper cracks, which are due to a cutting action of the more protrusive diamond grits under a larger grinding force. Conversely, the center on the trace of the BK7 glass ground showed primarily a plastic flow of glass chip covered and adhered on the brittle cracks. It was the result of a rubbing behavior by the more number of flat diamonds under smaller grinding force. Beside, when the bronze-bonded diamond tool contained the more amounts of resin and the less amounts of graphite was used under a higher spindle rotation speed and feed, the surface roughness of workpiece obtained was better.
目 錄
致謝……………………………………………………………………..Ⅰ
摘要……………………………………………………………………..Ⅱ
ABSTRACT…………………………………………………………….Ⅲ目錄………………………………………………………….………….Ⅳ
表錄……………………………………………………….…………….Ⅵ
圖錄…………………………………………………………….……….Ⅶ
第一章 緒論……………………………………………………………1
1.1 前言…………………………………………………………….1
1.1.1光學玻璃特性及應用………………...………………….1
1.2 文獻回顧……………………………………………………….4
1.3 研究目的……………………………………………………….8
1.4 本文內容……………………………….………………………8
第二章 理論基礎………………………………………………………9
2.1 脆性材料磨削特性……………………………………….…....9
2.1 鑽石顆粒……………………………………………………...15
2.2.1 鑽石粒度……………………………………..………..15
2.2.2 鑽石集中度……………………………………………15
2.3 磨削工具磨粒狀態……………….…………………………..16
第三章 鑽石磨棒製作及實驗程序與設備……………..……………18
3.1 鑽石磨棒之製作……………………………………………...18
3.2 實驗架構……………………………...………………………23
3.3 實驗方法及步驟…………………………..………………….24
3.4 分析儀器及設備…………………………..….……..………..25
第四章 實驗結果與討論……………………………….…………….32
4.1 鑽石磨棒的斷面分析………………………..……………….32
4.2 磨削力分析…………………………..……………………….35
4.3 鑽石磨棒磨耗機構…………………………………...………47
4.3.1 鑽石磨棒於主軸轉速1000rpm/進給率15mm/min時..48
4.3.2 鑽石磨棒於主軸轉速2000rpm/進給率25mm/min時..64
4.3.3 鑽石磨棒於主軸轉速3000rpm/進給率35mm/min時..77
4.3.4 鑽石磨棒於主軸轉速4000rpm/進給率45mm/min時..90
4.3.4 結語…………………………………………….……...103
4.4 BK7玻璃去除機構……………………….………..………..105
4.5 BK7玻璃磨削面粗糙度…………………………………….111
第五章 結論………………………………...……………………….114
參考文獻………………………………………………………………116
簡歷……………………………………………………………………119
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