參考文獻
[1] 蔡得時等著,”工程材料”,p.367,矩陣出版股份有限公司,1996。
[2] http://ibme.mc.ntu.edu.tw/MMS/Docs/Optics/glass.htm
[3] L. Chouanine, H. Eda, and K. Ishihara, “Ultra-precision grinding of
magnetic, electron and opticalmaterials under ductilemode con diti-
ons,” ICPE, pp521-524, 1997.
[4] Y. Namba, K. Yoshida, H. Yoshida, S. Nakai, “Ultraprecision grinding
of optical materials for high power lasers,” SPIE, Vol.3244,p.320-330
,1998.
[5] F. Zhang, W. Li, Z. Qiu, “Application ELID grinding technique to pre-
cision machining of optics,” In Advanced Optical Manufacturing and
Testing Technology, Proceedings of SPIE, Vol.4231, 2000.
[6] M. Chen, F. Zhang, S. Dong, “Study on Critical Condition of Brittle-
ductile Transition of Optical Glasses in Ultra-precision Grinding,” In
Advanced Optical Manufacturing and Testing Technology,
Proceedings of SPIE, Vol.4231, 2000.
[7] S. Tong, S.M Gracewski, P.D Funkenbusch, “Mesurement of the Pre-
ton coefficient of resin and bronze bond tools for deterministic micr-
ogrinding of glass,” Precision Engineering, 2005.
[8] N.S. Ong, V.C. Venkatesh, “Semi-ductile grinding and polishing of Prex glass,” Journal of Materials Processing Technology, Vol.83, p261
-266, 1998.
[9] T. Takahashi, P. D. Funkenbusch, “Micromechanics of diamond composite tools during grinding of glass,” Materials Science andEngineering, A285 , pp69-79, 2000.
[10] P. D. Funkenbusch, Y.Y. Zhou, T.Takahashi, D.J. Quesnel, J.
Lambro- poulos, “Characterization of fine abrasive particles for
optical fabrica- tion,” SPIE, Vol.2576.
[11] H. Eda, L. Chouanine, J. Shimizu, L. Zhou, “Development of State- of-Art Devices on the Sub-nanometer Grinding Machine Tool for Opt- ical Glass,” Part of the OSJ/SPIE Conference on Optical Engineering for Sensing and Nanotechnology (ICOSN’99), Yokohama Japan, June 1999.
[12] B. M. Evans III, A.C. Miller Jr., C. M. Egert, “Comparison of mate- rial for use in the precision grinding of optical components,” SPIE, Vol.3134.
[13] T.G. Bifano, T.A Dow, R.O Scattergood, "Ductile-RegimeGrinding: A New Technology for Machining Brittle Materials," ASME Journal of Engineering for Industry, Vol.113, pp.184-189, 1991.
[14] B. Zhang, T.D. Howes, "Subsurface Evaluation of Ground Ceram- ics," Annals of the CIRP, Vol.44/1, pp.263-266, 1995.
[15] Salje, E. and Mohlen, H., ”Advanced techniques in grinding high strength ceramic material,” Intercera, No.5, pp59-64, 1987.
[16] Bingmei Li, Tsuneo Matsubayashi and Kunihiro Yoshino, “The meas- uring method of wear and tear on diamond blades and the relation of cutting force and wear amount” ICPE , pp385-390, 1997.
[17] 賴耿楊譯著,“精密加工新技術全集”,復漢出版社,2001。
[18] K. Subramanian, S. Ramanath and M. Tricad, ”Mechanisms of mate- rial removal in the precision production grinding of ceramics”, Journal of Manufacturing Secience and Engineering, Vol.199, p509-519, 1997.
[19] I., Inasaki, “Grinding of Hard and Brittle Materials,” Annals of the CIRP, Vol.36/2, pp.463-471, 1987.
[20] 蔡宗河譯,“陶瓷的機械加工”,全華科技圖書股份有限公司(1991).
[21] W. Lortz, “A model of the cutting mechanism in grinding”, Wear, vol.53, p115, 1979.
[22] 精密鑽石工具,松祿文化事業股份有限公司,1992。
[23] 陳垂鴻,薄鑽石砂輪片切斷硬脆材料之磨耗分析,華梵大學機電工程學系碩士論文,1999。[24] 王鳳翔,鑽石磨棒磨削氧化鋁加工之研究,華梵大學機電工程學系碩士論文,2004。