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研究生:何子炘
研究生(外文):Tzu-Hsin Ho
論文名稱:邊界熱源之銅棒熱傳導偏微分系統參數辨識
論文名稱(外文):PDE Parameters Identification of a Copper Rod Heat Conduction System with a Boundary Heat Source
指導教授:蘇武昌
指導教授(外文):Wu-Chung Su
學位類別:碩士
校院名稱:國立中興大學
系所名稱:電機工程學系所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2010
畢業學年度:98
語文別:中文
論文頁數:61
中文關鍵詞:熱傳導邊界溫度控制參數辨識
外文關鍵詞:hear conductionboundary temperature controlparameters identification
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本論文主要研究邊界熱源之銅棒熱傳導偏微分系統參數辨識,運用德州儀器(Texas Instruments)生產之 TMS320LF 2407A 數位信號處理器(DSP)及周邊設備,透過撰寫程式以PWM模組控制固定輸入邊界熱源,利用ADC模組內建取樣和保持(sample-and-hold)功能,收集銅棒熱傳之溫度分佈情形,所得之數據運用Matlab軟體繪製時間與溫度曲線圖。另外將第四章推導之銅棒熱傳導方程式的動態模型,利用座標平移及透過取樣資料系統(sampled-data system)零階保持器(zero-order-hold)轉換程序,把連續時間的邊界控制規則轉變成離散固定信號,再應用變數轉換法,將熱傳導方程式轉變為齊次的邊界條件,進而以Matlab pdepe.m功能模擬動態模型來近似實驗曲線,進而對照比較分析獲得邊界熱源之銅棒熱傳導偏微分系統參數。

This thesis is on PDE parameters identification of a heat conductive copper rod with a boundary heat source. A copper rod, 400mm in length and 38mm in diameter, is heated by an electrical heater with a pulse-width-modulated (PWM) solid state relay (SSR) control module from one boundary point. The temperature distribution of the copper rod is sampled and collected into a TMS320LF 2407A digital signal processor (DSP) manufactured by Texas Instruments (TI). The data is then plotted and analyzed by using Matlab software packages. In addition, the copper heat conduction equation and the derived dynamic model in Chapter IV will be applied to the conversion process of the continuous-time boundary control into the discrete-time sampled-data representation by using the Zero-Order-Hold (Z.O.H) process. The boundary conditions of the heat conduction equation are converted into homogeneous boundary conditions before applying the Matlab pdepe.m simulation functions. Finally, the experimental data are compared against the simulation data for confirmation of the PDE system parameters identification for the copper rod heat conduction system.

中文摘要.....................................ⅰ
英文摘要....................................ⅱ
誌謝辭......................................ⅲ
目次.......................................ⅳ
圖目錄......................................ⅵ
表目錄......................................ⅸ
符號說明....................................ⅹ
第一章 緒論...................................1
1.1研究動機與目的..............................1
1.2相關文獻回顧...............................1
1.3論文架構...................................2
第二章 系統硬體架構.............................4
2.1規格及整體架構..............................4
2.2溫度感測器.................................4
2.2.1熱電偶...................................5
2.2.2電阻式...................................8
2.2.3熱敏電阻..................................8
2.3 K Type 溫度試驗.............................9
2.4線性轉換..................................11
第三章 DSP TMS320LF 2407簡介...................12
3.1 DSP TMS320LF 2407A架構介紹..................12
3.2 DSP 系統核心(core)中央處理單元.................13
3.2.1 中央算術邏輯單元(CALU) .....................14
3.2.2 累積器(ACC) ...............................14
3.2.3 乘法器...................................15
3.2.4 輸入倍率部份..............................15
3.3 記憶體架構..................................15
3.4 事件管理模組.................................17
3.5 類比/數位轉換模組.............................18
第四章 熱傳導系統之數學模式建構.....................20
4.1熱傳導方程式................................20
4.2系統之數學式建模..............................22
4.3固定輸入的分析解..............................24
第五章 實驗結果與模擬分析討論......................29
5.1實驗方法介紹................................29
5.2實驗結果....................................33
5.3模擬方法介紹................................37
5.4模擬結果....................................37
5.5實際量測與Matlab模擬之各點溫度分佈比較誤差分析.....40
5.6誤差分析....................................46
5.7 Q值之近似曲線..............................51
5.8實驗與模擬結果討論............................55
5.8.1實驗結果討論..............................55
5.8.2模擬結果討論..............................56
第六章 結論與展望..............................57
6.1結論......................................57
6.2未來展望....................................58
參考文獻.......................................59

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