臺灣博碩士論文加值系統

在本論文中，我們使用最小平方法與最大概似估測法針對半導體IC製造之微影覆蓋誤差做分析。首先利用製程中量測的微影覆蓋誤差資料，以最小平方法作為在不同模型中的參數估測，並與獲得的商業軟體之估測結果比較。然後再分別以最大概似估測法及最小平方法對設計資料及量測資料進行模擬分析，以微影覆蓋誤差估測值對正確值之均方誤差作為效能評比標準。模擬結果顯示出最大概似估測法的效能表現略優於最小平方法。

In this thesis, we used least square method and maximum likelihood estimation for analysis of the lithography overlay error in semiconductor IC fabrication. First, the measurement overlay data was analyzed using least square method for various overlay models. The estimated parameters are compared with the results obtained from the available commercial software. We then apply maximum likelihood estimation and least squares method, respectively, to estimate parameters from the designed data and measurement data. The mean square error of overlay data is used as the criterion for performance comparison. The simulation results indicate that the maximum likelihood estimation is slightly better than least square method.

第一章、簡介
1.1研究動機與目的
1.2研究背景
1.3研究方法
1.4論文架構
第二章、微影製程與步進機之原理說明
2.1微影製程
2.2曝光技術
2.3步進機
第三章、微影覆蓋誤差
3.1微影覆蓋誤差之原因
3.2微影覆蓋誤差數學模型
第四章、最小平方估測法
4.1利用最小平方法估測參數
4.1.1最小平方法之原理與特性
4.1.2實驗模型之說明
4.2實驗及模擬結果
4.2.1實驗資料與實驗流程之說明
4.2.2模擬結果分析
第五章、最大概似估測法
5.1最大概似估測法之原理與特性
5.2實驗及模擬結果
第六章、結論

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