臺灣博碩士論文加值系統

本研究是利用鄰甲酚醛的多環性環氧樹脂(Cresol Novolac Epoxy，CNE)和酚醛樹脂硬化劑(Cresol Novolac Phenolic Resin)混合Triphenyl Phosphine(TPP)製成環氧樹脂粉末、還有利用聚矽氧烷對環氧樹脂進行改質形成互穿網結構製成的粉末，用疊層的方式分別加入不同重量百分比的Aramid不織布(Aramid Paper)製成環氧樹脂平板，並探討含不同重量百分比的Aramid不織布對環氧樹脂平板的電氣性質、動態機械性質、熱膨脹係數和體積電阻率有哪些影響。
動態介電常數實驗結果顯示，介電常數(permittivity)和損失因數(loss factor)會隨著不織布的含量增加而增加，而在低溫(＜80℃)高頻(＞1Hz)時，環氧樹脂/不織布複合材料能使損失因數(loss factor)下降。動態機械性質方面，儲存模數(storage modulus)及損失模數(loss modulus)會隨著不織布的含量增加而明顯增加，然而tanδ則是趨勢相反，隨著不織布的含量增加而下降。而複合材料的熱膨脹係數及體積電阻率亦同時隨著不織布含量的增加而增加。

The cresol novolac epoxy/phenolic novolac hardener system was used here as the matrix material for epoxy/aramid paper printed circuit board applications. A siloxane modifier was incorporated into the epoxy matrix by using an interpenetrating polymer network technique to improve its hygrothermal properties. Dielectric and dynamic properties were measured for these epoxy/aramid composite laminates of various compositions.
The dynamic dielectric constants such as permittivity and loss factor were found to increase with increasing aramid paper loading at high temperatures. At low temperatures(＜80℃) and high frequencies(＞1Hz), the loss factor of epoxy/aramid composites was decreased. As for the dynamic mechanical properties, the storage and loss moduli were found to increase with increasing aramid paper contents, but the tanδ was inverse, the tanδ decreasing with increasing aramid paper loading. The coefficient of thermal expansion and volume resistivity of the composite also increased with increasing aramid paper content.

中文摘要................................................................................................................. Ⅰ
英文摘要................................................................................................................. Ⅱ
誌謝........................................................................................................................ .Ⅲ
目錄........................................................................................................................ .Ⅳ
表索引..................................................................................................................... Ⅶ
圖索引.................................................................................................................... .Ⅷ
一、緒論 ..1
1-1 印刷電路板簡介.......................................................................................... .1
1-2 銅箔基板...................................................................................................... .4
1-3 環氧樹脂簡介............................................................................................. ..7
1-4 環氧樹脂所選用的硬化劑及硬化反應..................................................... ..8
1-5 矽氧烷簡介................................................................................................ .11
1-6 Aramid不織布的簡介.................................................. ...............................13
二、原理和文獻回顧...............................................................................................14
2-1 環氧樹脂相關文獻.......................................... ...........................................14
2-2 矽氧烷改質環氧樹脂相關研究......................................... ........................14
2-3 電氣性質.............................................................................. .......................15
2-3-1 介電常數與介電損失................................................... .......................16
2-3-2 影響介電常數的原因................................................... .......................17
2-4 熱膨脹係數的探討............................................................... ......................18
2-5 玻璃轉移溫度的探討............................................................ .....................19
2-6 機械模數的探討..................................................................... ....................20
2-7 原料保存的探討...................................................................... ...................21
2-8 動態介電儀(Dielectric Analyzer，DEA)………………...….………. .21
2-8-1 原理...................................................................................... .........21
2-8-2 提供數據............................................................................... ........24
2-8-3 重要應用................................................................................ .......24
2-9 動態機械分析儀(Dynamic Mechanical Analyzer，DMA)………..………25
2-9-1 原理................................................................................................ ......25
2-9-2 提供數據......................................................................................... .....26
2-9-3 應用......................................................................................................26
2-10 熱機械分析儀(Thermal Mechanical Analysis ，TMA)………..………26
2-10-1 原理....................................................................................................26
2-10-2 提供數據............................................................................................27
2-10-3 應用....................................................................................................27
2-11 高電阻計的量測.............................................. .........................................27
2-11-1 原理............................................................. .......................................27
三、實驗部分...........................................................................................................30
3-1 實驗藥品..................................................................................... ................30
3-2 實驗儀器....................................................................................... ..............33
3-3 實驗步驟........................................................................................ .............36
3-3-1實驗流程.......................... .............36
3-3-2 粉末製作...................................................................................... ........36
3-3-3 環氧樹脂平板製作...................................................................... ........38
3-3-4 性質測試...................................................................................... ........40
四、結果與討論………………………………………………...…………………44
4-1 介電性質.………………………………………………….……… …...…44
4-1-1 DEA的分析.................................................................................... .......44
4-2 DMA的分析......................................................... .................................74
4-3 TMA的分析.............................................. ............................................106
4-4 體積電阻率的量測…………………………… …………….……….113
五、結論.................................................................................................................114
六、參考文獻.........................................................................................................116

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