[1]. 黃千純, “我國印表機發展機會分析噴墨式與熱列印式”, 工研院光電所, 1999/6。
[2]. 趙詠雪, “微機電技術在噴墨列印頭的應用”, 工業技術研究院ITIS產業評析, 2000/09/13。
[3]. 趙詠雪, “微機電技術在微閥的應用”, 工業技術研究院ITIS產業評析, 2000/09/19。
[4]. 劉欣怡, “壓電噴墨印頭液滴形成過程之研究”, 國立台灣大學機械工程學研究所碩士論文, 1997。[5]. Wolfgang, R. Wehl, “Ink-Jet-Printing :The Present State of the Art,” Compeure '89-3rd Annual European Computer Conference, Hamburg, West Germany, pp. 2/45-2/52,1989.
[6]. 殷孟雲, “噴墨印表機設計原理”, 全華科技圖書, 2001/12。
[7]. Okamoto, T., Suzuki, T., and Yamamoto, N., “Microarray Fabrication with Covalent Attachment of DNA using bubble jet technology”, Nature Biotechnology, Vol. 18, pp. 438-441, 2000.
[8]. 辜韋智, 涂景瑜, 徐康民, 曾驥孟, “結合材料化學、生物醫學、資訊科學的明日之星:生物晶片”, 中國化學學會誌第48卷第3期, 2001。
[9]. 陳啟槙, 生物晶片研發現況與趨勢, 中國化學學會誌第48卷第3期, 2001。
[10]. 內政部警政署統計資料,1991~2001。
[11]. A. Asia, Bubble Dynamics in Boiling under High Heat Flux Pulse Heating, ASME J. Heat Transfer., vol. 113, pp.973-979, 1991.
[12]. A. Asia, Three-Dimensional Calculation of Bubble Growth and Drop Ejection in a Bubble Jet Printer, ASME J. Fluids Eng., vol. 114, pp. 638-641, 1992.
[13]. P.-H. Chen, W.-C. Chen, and S.-H. Chang, Bubble Growth and Ink Ejection Process of a Thermal Ink Jet Printerhead, Int. J. of Mech. Sci., vol.39, pp. 683-695, 1997a.
[14]. P.-H. Chen, W.-C. Chen, and S.-H. Chang, Visualization of Drop Ejection Process of a Thermal Bubble Ink Jet Printerhead, Proc. 1st Pacific Symposium on Flow Visualization and Image, vol.1, pp. 132-137, 1997b.
[15]. 陳文成 , “HP51626A 印表頭的噴墨觀測” ,復興學報, 第二期, 第169~173頁1998。[16]. Christisn Rembe, Stefan aus der wiesche, Eberhard P. Hofer, Thermal Ink Jet Dynamics:Moding, Simulation, and Testing, Microelectronics Reliability, vol.40, pp. 525-532, 2000.
[17]. J. H. Tsai, Liwei Lin, A Thermal Bubble Actuated Micro Nozzle-Diffuser Pump, Proceedings of 2001 IEEE Micro Electro Mechanical Systems Workshop, pp. 409-412, 2001.
[18]. The manual of CFD-RC.
[19]. P.-H. Chen, W.-C. Chen, and S.-H. Chang, Ink Ejection Process of a Thermal Ink Jet Printerhead, conference paper of Chinese society of mechanical engineers 14th, pp. 70-77, 1997.
[20]. H.-P. Cheng, C.-P. Chien, S.-F. Tsai, and Y.-Y. Peng, 2, Numerical Liquid Refilling Investigation of the Thermal Bubble Micro Pump, 2002 IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, 2002. (Oral presentation)