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[1] Y.-C. King, T.-J. King, and C. Hu, “Charge-trap memory device fabrication by oxidation of Si1-XGeX,” IEEE Trans. Electron Devices, vol. 48, pp. 696-699, Apr.2001 [2] D. Frohman-Bentchkowsky, “Memory behavior in a floating – gate avalanche injection MOS (FAMOS) structure,” Appl. Phys. Lett., vol.18, p.332,1971 [3] J. D. Blauwe,“Nanocrystal Nonvolatile Memory Devices,” IEEE Trans. Nanotechnol, vol.1 (1), p.72, 2002. [4] E. W. H. Kan, W. K. Choi,a) and W. K. Chim, “Origin of charge trapping in germanium nanocrystal embedded SiO2 system: Role of interfacial traps,” Appl. Phys. Lett., vol.95, p.3184,2004 [5] Shaoyun Huang, Souri Banerjee, Raymond T. Tung, and Shunri Oda, “Electron trapping, storing, and emission in nanocrystalline Si dots by capacitance–voltage and conductance–voltage measurements,” Appl. Phys. Lett., vol.93, p.576, 2003. [6] Aaron Thean and Jean-Pierre Leburton, “Flash memory: towards single- electronics,” IEEE Potentials, p.35, 2002. [7] H. I. Hanafi, S. Tiwari, and I. Khan, “Fast and Long Retention-Time Nano-Crystal Memory,” IEEE Trans. Electron Devices, vol.43 (9), p.1553, 1996. [8] S.M.Sze.”Semiconductor device physics and technology”,New York:Wiley,1985. [9] S.M.Sze.”Physics of semiconductor device”,New York:Wiley,1981. [10] Kanaan Kano.“Semiconductor device”, Prentice-Hall,1998. [11] Neamen,D.A.”Semiconductor physics and device basic principles”,Mc Graw Hill,2002. [12] Pankove,J.I.”Optical proesses in semiconductor”,Prentice-Hall,1971. [13] Kittle,C.”Introduction to solid state physics”,New York:Wiley,2005. [14] E.H.Nicollain and J.R.Brews,”MOS physics and technology”New York,1982. [15] J. J. Chang, “Nonvolatile semiconductor memory device,”, IEEE Trans. Electron Devices, vol. 64, no.7, 1976. [16] G. Franzo, A. Irrera, E.C. Moreira, M. Miritello, F. Iacona, D. Sanfilippo, G. Di Stefano, P.G. Fallica, F. Priolo, “Electroluminescence of Silicon nanocrystals in MOS structures,” Appl. Phys. A, vol. 74, pp. 1-5, 2002 [17] 李嗣涔,管傑雄,孫台平。”半導體元件物理”,三民書局,1995 [18] J.Lambe and S.I.McCarthy,”Light Emission from Inelastic electron tunneling”Phys.Rew.Lett,923. [19] C. L. Heng, W. W. Tjiu, and T. G. Finstad, “Charge-storage effects in a metal-insulator-semiconductor structure containing germanium nanocrystals formed by rapid thermal annealing of an electron-beam evaporated germanium layer;” Appl. Phys. A : Material Science & Processing, vol. 78, pp. 1181-1186,2004 [20] J. H. Chen, Y. Q. Wang, W. J. Yoo, Y.-C. Yeo, Ganesh, D. SH Chan, A. Y. Du, and D.-L. Kwong, “Nonvolatile Flash Memory Device Using Ge Nanocrystals Embedded in HfAlO high-k Tunneling and control oxide: Device Fabrication and Electrical performance,” IEEE Trans. Electron Devices, vol. 51, no. 11, pp. 1840-1848, 2004 [21] Y. Shi, K. Saito, H. Ishikuro and T. Hiramoto, “Effects of Interface Traps on Charge Retention Characteristics in Silicon-Quantum-Dot-Based Metal -Oxide-Semiconductor Diodes,” Jpn. J. Appl. Phys., vol. 38, pp. 425-428,1999.
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