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[1] Mehmet Arik, James Petroski and Stanton Weaver, “Thermal Challenges in The Future Generation Solid State Lighting Applications: Light Emitting Diode,” Inter Society Conference on Thermal Phenomena, pp. 113–120, 2002. [2] I.Niki,Y.Narukawa,D.Morita,S.sonobe,T.Mitani,H.Tamaki,Y.Murazaki,M.Yam ata,and T.Mukai,“White LEDs for Solid State Lighting ”Proc.of SPIE,vol.5187,2004. [3] N. Narendran, Y. Gu, J.P. Freyssinier, H. Yu, L. Deng, Journal of Crystal Growth, 268, 499 (2004) [4] Lan Kim, Jong Hwa Choi, Sun Ho Jang, Moo Whan Shin, Thermochimica Acta, 455, 21 (2006) [5] Alan Mills, The advanced semiconductor magazine, 14, 1 (2001) [6] Mike Holt, The advanced semiconductor magazine, 14, 3 (2001) [7] Jong Su Kim, Kwon Taek Lim, Yong Seok Jeong, Pyung Eun Jeon, Jin Chul Choi, Hong Lee Park, Solid State Communications, 135, 21 (2005) [8] Yimin Gu and Nadarajah Narendran, “A Non-Contact Method for Determining Junction Temperature of Phosophor-Converted,” Proc. Of SPIE, Vol. 5187, pp. 64-75, 2004. [9] Mehmet Arik, Charles Becker, Stanton Weaver and James Petroski, “Therma lManagement of LEDs: Package to System,” Proc. Of SPIE, Vol. 5187, pp. 64-75, 2004. [10] G.Murtaza and J.M.Senior,“Method for Extracting Thermally Stable Optical Singals from a CaAlAs LED Source, ”IEEE Photonics Technol.Lett,vol.479,1995. [11] Y.Gu,N.Narendran, and J.P.Freyssinier, “White LED Performance,” Proc.of SPIE,vol.5530,2004. [12] N.Narendran and Y.Gu, “Life of LED-Based White Light Source, ”IEEE/OSA Journal of Display,vol.1,no.1,2005. [13] S.C.Bera, R.V.Singh, V.K.Garg, “Temperature Behavior and Compensation of Light-Emitting Diode, ”IEEE Photonics Technol.Lett,pp.2286-2288,2005. [14] J.Petroski, “Spacing of High-brightness LEDs on Metal Substrate PCBs for Proper Thermal Performance, ”IEEE Inter Society Conference on Thermal Phenomena,pp.507-514,2004. [15] F.Wall, P.S.Martin, and G.Harbers, “High Power LED Package Requirment, ”Proc.of SPIE,vol.5187,2004. [16] J.Petroski, “Thermal Challenges Facing New Generation Light Emitting Diodes(LEDs) for Lighting Applications, ”Proc.of SPIE,vol.4776,2002. [17] M.Shatalove,A.Chitnis,P.Yadav,M.F.Hasan,J.Khan,V.Adivarhan,H.P.Maruska,W.H.Sun,and M.A.Khan, “Thermal Analysis of Filp-Chip Packaged 280 nm Nitride-Based Deep Ultraviolet Light-Emitting Diodes, ”Applied Physics Letters, vol. 86,2005. [18] M.Arik, C.Becker, S.Weaver,and J.petroski, “Thermal Management of LEDs: Package to System, ”Proc.of SPIE, vol.5187,2004. [19] M.Arik and S.Weaver, “Chip Scale Thermal Management of High Brightness LED Package, ”Proc.of SPIE,vol.5530,2004. [20] N. Narendran and Y. Gu, “Life of LED-Based White Light Sources, ”IEEE/ OSA journal of display technology, vol. 1, no. 1, Rseptember, 2005. [21] Y. Gu and N. Narendran,“A non-contact method for determining junction temperature of phosphor converted white LEDs,” Proceedings of SPIE , vol.5187, pp. 107-114, 2004. [22] J.P. You, Y. He and F.G. Shi, “Thermal Management of High Power LEDs: Impact of Die Attach Materials,”. [23] F. Jiang , W. Liu, Y. Li, W. Fang, C. Mo, M. Zhou, and H. Liu,“Research on the junction-temperature characteristic of GaN light-emitting diodes on Si substrate, ”Journal of Luminescence, vol 122-123, pp. 693–695, 2007. [24] Osram product application note “Thermal Management of Golden Dragon LED.” [25] Peter A. Hochstein, Troy, Mich., Feb. 11, 2003, “LED Intergrated Heat Sink”, United States Patent 6,517,218 B2. [26] Lumileds product application brief AB23 “Thermal Design Considerations for Luxeon 5 Watt Power Light Sources.” [27] C. Wood, Engery Convers. Mgmt.24, 371, (1984). [28] Gerald Mahan, Brian Sales, and Jeff Sharp, Physics Today, March 1997, 42(1997). [29] Brian C. Sales in Science Vol. 295.1248(2002). [30] Heinrich Hohl, Art P Ramirez, Claudia Goldmann, Gabriele Ernst,Bernd W¨olfing and E. B. J. Phys.: Condens. Matter 11 1697–1709 (1999). [31] Aharon Kapitulnik, Appl. Phys. Lett., 60, 180 (1992). [32] D. R. Ladner and J. P. Martin, AIP Conf. Proc., 823, 1538 (2006) [33] A. W. Sloman, Rev. Sci. Instrum., 75, 788 (2004) [34] R. Venkatasubramanian, E. Siivola, T. Colpitts, and B. O’Quinn, “Thin-film thermoelectric devices with high room-temperature figures of merit,” Nature, vol. 413, no. 6856, pp. 597–602, 2001. [35] G. Jeffery Snyder, James R. Lim, Chen-Kuo Huang and Jean-Pierre Fleurial, “Thermoelectric microdevice fabricated by a MEMS-like electrochemical process,” nature materials, vol. 2, pp. 528–531, August 2003. [36] Harald Böttner, Joachim Nurnus, Alexander Gavrikov, Gerd Kühner, Martin Jägle, Christa Künzel, Dietmar Eberhard, Gerd Plescher, Axel Schubert, and Karl-Heinz Schlereth, “New Thermoelectric Components Using Microsystem Technologies,” Journal of Microelectromechanical Systems, vol. 13, no. 3, pp. 414–420, June 2004. [37] Pollock D. D. Thermoelectricity: theory, Thermome-try, tool, ASTM Special Technical Publication 852, American Society for Testing and Materials, Philadelphia, PA (1985). [38] H. J. Goldsmid, "Electronic Refrigeration", 1-194 (1986). [39] Seebeck, T. J. Magnetic polarization of metals and minerals, Abhandlungen der Deutschen Akademie Wissenschaften zu Berlin, 265 (1823). [40] Peltier, J. C. Nouvelles experinces sur la caloricite des courans electrique, Ann. Chim. LV1 371 (1834). [41] W. Thomson, On a mechanical theory of thermo- electric currents, Proceeding of the Royal Society of Edinburgh, 91 (1851). [42] A. Mzerd, D. Sayah, J. C. Tedenac and A. Boyer, J. Crystal Groth, Vol.140,pp.365(1994). [43] R. Venkatasubramanian, Naval Research Reviews, Special Issue on Thermoelectric (Office of Navel Research, USA) (1996).
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