[1] A. Dittmar, A. Lymeris, “Smart clothes and associated wearable devices for biomedical ambulatory monitoring,” Transducers’ 05, pp. 221-227, 2005.
[2] F. Axisa, P.M. Schmitt, C. Gehin , G. Delhomme , E. McAdams , A. Dittmar, “Flexible technologies and smart clothing for citizen medicine, home healthcare, and disease prevention,” IEEE Trans Inf Technol Biomed., Vol. 9, pp. 325-336, 2005.
[3] S.J. Morris, J.A. Paradiso, “Shoe-integrated sensor system for wireless gait analysis and real-time feedback,” EMBS/BMES Conference, Vol. 3, pp. 2468-2469, 2002.
[4] E.F. Desseree-Calais, L.R. Legrand, “First Results of a Complete Marker-Free Methodology for Human Gait Analysis,” Engineering in Medicine and Biology 27th Annual Conference, pp. 7455-7458, 2005.
[5] M. Tesconi, E. Pasquale Scilingo, P. Barba, D. De Rossi, “Wearable kinesthetic system for joint knee flexion-extension monitoring in gait analysis,” EMBS '06. 28th Annual International Conference, pp. 1497-1500, 2006.
[6] http://www.tekscan.com
[7] 李豪政, “活塞式鞋墊對減低足部壓力之效益研究,” 陽明大學醫學工程研究所碩士論文, 2000.[8] K.E. Petersen, “Silicon as a mechanical material,” Electron Devices, IEEE Transactions, Vol. 70, pp. 420-457, 1982.
[9] R.T. Howe, R.S. Muller, K.J. Gabriel, and W.S.N. Trimmer, IEEE spectrum, Vol. 27, pp. 29-35, 1990.
[10] 丁志明等, “微機電系統技術與應用,” 國科會精密儀器發展中心, 2003.
[11] S.K. Clark and K.D. Wise, “Pressure sensitivity in anisotropically etched thin-diaphragm pressure sensors,” IEEE Transactions on Electron Devices, Vol. ED-26, pp. 1887-1896, 1979.
[12] W.P. Eaton and J.H. Smith, “Micromachined pressure sensors: review and recent developments,” Smart Master., Struct. 6, pp. 530-539, 1997.
[13] C. Ravariu, F. Ravariu, D. Dobrescu, L. Dobrescu, C. Codreanu, and M. Avram, “A designing roule for a pressure sensor with PZT layer,” Semiconductor Conference, Vol. 2, pp. 379-382, 2001.
[14] C. S. Smith, “Piezoresistance effect in germanium and silicon,” Phys. Rev, Vol. 94, pp. 42-49, 1954.
[15] A. Gieles, “Submmiature silicon pressure transducers,” Solid-State Circuits Conference, Vol. 12, pp. 108-109, 1969.
[16] T. N. Jackson, M.A. Tischler, and K.D. Wise, “An electrochemical P-N junction etch-stop for the formation of silicon microstructures,” Electron Device Letters, Vol. 2, pp. 44-45, 1981.
[17] S. Sugiyama, K. Shimaoka, and O. Tabata, “Surface micromachined micro-diaphragm pressure sensors,” Transducers’ 91, pp. 188-191, 1991.
[18] B. Folkmer,; P. Steiner, and W. Lang, “A pressure sensor based on a nitride membrane using single crystalline piezoresistors,” Transducers '95, Vol. 2, pp. 574-577, 1995.
[19] F. Jiang, Y. C. Tai, K. Walsh, T. Tsao, G. B. Lee, and C. M. Ho, “ A Flexible MEMS Technology and Its First Application to Shear Stress Sensor Skin,” MEMS ’97, pp. 465-470, 1997.
[20] F. Jiang, G. B. Lee, Y. C. Tai, and C. M. Ho, “A Flexible Micromachine-Based Shear-stress Sensor Array and Its Application to Separation-Point Detection,” Sens. Actuators A, Phys., Vol. 79, pp. 194-203, 2000.
[21] D. J. Beebe and D. D. Denton, “A flexible polyimide-based package for silicon sensors,” Sens. Actuators A, Phys., Vol. 44, pp. 57-64, 1994.
[22] S. Tung, S. R. Witherspoon, L. A. Roe, A. Silano, D. P. Maynard, and N. Ferraro, “A MEMS-based Flexible Sensor and Actuator System for Space Inflatable Structures,” Smart Materials and Structures, Vol. 10, pp. 1230-1239, 2001.
[23] G. W. Xiao, P.C.H. Chan, A. Teng, J. Cai, and M.M.F. Yuen, “A pressure sensor using flip-chip on low-cost flexible substrate,” Electronic Components and Technology Conference, pp. 760-754, 2001.
[24] Y. Hasegawa, M. Shikida, H. Sasaki, K. Itoigawa, and K. Sato, “An active tactile sensor for detecting mechanical characteristics of contacted objects,” J. Micromech. Microeng., Vol. 16, pp. 1625-1632, 2006.
[25] H. C. Lim, B. Schulkin, M. J. Pulickal, S. Liu, R. Petrova, G. Thomas, S. Wagner, K. Sidhu, and J. F. Federici, “Flexible membrane pressure sensor,” Sens. Actuators A, Phys., Vol. 119, pp. 332-335, 2005.
[26] E. S. Hwang, Y. J. Kim, B. K. Ju, “Flexible polysilicon sensor array modules using “etch-release” packaging scheme,” Sens. Actuators A, Phys., Vol. 112, pp. 135-141, 2004.
[27] Y. Xu, F. Jiang, Y. C. Tai, A. Huang, C. M. Ho, and S. Newbern, “Flexible shear-Stress sensor skin and its application to unmanned aerial vehicle,” Sens. Actuators A, Phys., Vol. 105, pp. 321-329, 2003.
[28] N. Sato, K. Machida, H. Morimura, S. Shigematsu, K. Kudou, M. Yano, and H. Kyuragi, “MEMS fingerprint sensor immune to various finger surface conditions,” IEEE Trans. Electron Devices, Vol. 50, pp. 1109–1116, 2003.
[29] H. K. Lee, S. I. Chang and E. Yoon, “A Capacitive Proximity Sensor in Dual Implementation with Tactile Imaging Capability on a Single Flexible Platform for Robot Assistant applications,” MEMS ’06, pp. 606-609, 2006.
[30] T. Someya, T. Sekitani, S. Iba, Y. Kato, H. Kawaguchi, and T. Sakurai, “A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications,” PNAS, Vol. 101, pp. 9966-9970.
[31] E. S. Hwang, J. H. Seo and Y. J. Kim, “A Polymer-based Flexible Tactile Sensor for Both Normal and Shear Load Detection ,” MEMS ’06, pp. 714-717, 2006.
[32] J. H. Kim, J. I. Lee, H. J. Lee, Y. K. Park, M. S. Kim, D. I. Kang, ICRA 2005, “Design of Flexible Tactile Sensor Based on Three-Component Force and Its Fabrication,” pp. 2560-2581, 2005.
[33] J. Engel, J. Chen, and C. Liu, “Development of polyimide flexible tactile sensor skin,” J. Micromech. Microeng., Vol. 13, pp.359-366, 2003.
[34] T. Stieglitz, “Flexible Biomedical Microdevices with Double-Sided Electrode Arrangements for Neural Applications,” Sens. Actuators A, Phys., Vol. 90, pp. 203-211, 2001.
[35] Y. H. Wen, G. Y. Yang, V. J. Bailey, G. Lin, W. C. Tang, and J. H. Keyak, “Mechanically robust micro-fabricated strain gauges for use on bones,” Microtechnology in Medicine and Biology, 2005., pp. 302-304, 2005.
[36] S. A. Dayeh, D. P. Butler, and Z. Çelik-Butler, “Micromachined. infrared bolometers on flexible polyimide substrates,” Sensors and actuators. A, Physical, Vol. 118, pp. 49-56, 2005.
[37] S. Han, Z. Y. Tan, K. Sato and M. Shikida, “Thermal Characterization of Micro Heater Arrays on a Polyimide Film Substrate for Fingerprint Sensing Applications,” J. Micromech. Microeng., Vol. 15, pp. 282-289, 2005.
[38] C. Li, F.E. Sauser, R. Azizkhan, C.H. Ahn, and I. Papautsky, “Polymer flip-chip bonding of pressure sensors on flexible Kapton film for neonatal catheters,” J. Micromech. Microeng. , VOl. 15, pp.1729-1735, 2005.
[39] K. Kim, K.R. Lee, Y.K. Kim, D.S. Lee, N.K. Cho, W.H. Kim, K.B. Park, H.D. Park, Y.K. Park, J.H. Kim, and J.J. Pak, “3-Axes Flexible Tactile Sensor Fabricated by Si Micromachining and Packaging Technology,” MEMS ’06, pp. 678-681, 2006.
[40] R. B. Katragadda, Y. Xu, “A Novel Intelligent Textile Technology Based on Silicon Flexible Skins,” MEMS ’07, pp. 301-304, 2007.
[41] H. K. Lee, S. I. Chang, K. H. Kim, S. J. Kim, K. S. Yun, and E. Yoon, “A modular expandable tactile sensor using flexible polymer,” MEMS ’05, pp. 642-645, 2005.
[42] S. L. Chang, H. K. Lee, and E. Yoon, “Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array,” Transducers '05, Vol. 2, pp. 1969-1972, 2005.
[43] J. Engel, J. Chen, Z. Fan, and C. Liu, “Polymer micromachined multimodal tactile sensors,” Sens. Actuators A, Phys., Vol. 117, pp. 50-61, 2005.
[44] S. H. Kim, J. Engel, C. Liu, and D. L. Jones, “Texture Classification. using a polymer based MEMS tacticle sensor,” J. Micromech. Microeng., Vol. 15, pp. 912-920, 2005.
[45] R. Singh, Low Lee Ngo, Ho Soon Seng, and F.N.C. Mok, “A silicon piezoresistive pressure sensor,” Electronic Design, Test and Applications., pp. 181-184,2002.
[46] 黃德昌, “以乾濕複合蝕刻法進行微壓力感測器微小化之研究,” 交通大學工學院精密與自動化工程學程碩士論文, 2005.[47] A. C. Ugural, “Stress in plates and shells,” 2nd ed., 1981.
[48] L. W. Lin, and W. J. Yun, “MEMS pressure for aerospace applications,” Aerospace conference, pp. 429-436, 1998.
[49] 朱嘉儀, “新型SOG微加速度計之設計與機電系統整合探討,” 清華大學動力機械工程研究所碩士論文, 2003.[50] L. Smith, and A. Soderbarg, “Electrochemical etch stop obtained by accumulation of free carries without P-N junction,” J. Electorchem. Soc., Vol. 140, pp. 271-275, 1993.
[51] M. Maghribi, J. Hamilton, D. Polla, K. Rose, T. Wilson, and P. rulevitch, “Stretchable micro-electorde array,” Microtechnologies in Medicine & Biology 2nd Annual International IEEE-EMB Special Topic Conference, pp. 80-83, 2002.
[52] W.T. Li, R.B. Charters, B. Luther-Davies, and L. Mar, “Significant improvement of adhesion between gold thin films and a polymer,” Applied surface science, Vol. 233, pp. 227-233, 2004.
[53] 林炯彣, “應用垂直式導線與陽極接合於SOI-MEMS晶片之晶圓級封裝,” 清華大學微機電系統工程研究所碩士論文, 2004.