臺灣博碩士論文加值系統

近年來由於半導體產業的蓬勃發展,使得IC構裝業逐漸成為國內產業重要的製造業之一.IC 構裝重要目的之一是增加晶片的散熱能力. 雖然目前IC構裝皆有朝輕薄短小的趨勢發展,但晶片的特性也有朝向高速,高功率及多功能發展的趨勢.目前高功能的IC晶片,其功率很容易達到1-2瓦.由於IC產品的電性,熱傳導的特性要求日趨嚴格,IC構裝廠已被要求建立電性,熱性的設計分析能力. 本研究之主要目的為利用差分數值分析法及Fortran軟體發展出一套模擬半導體IC封裝後 的程式.所模擬的對象為以環氧樹脂為包裝材料的IC,其導線架為16,20,28,40腳的銅材及鋁材.經電腦模擬後,證實IC動作時所產生的熱能主要是經由導線架傳導將熱帶出.導線架的熱傳導係數愈大及腳數愈多,其散熱能力愈佳.

The main purpose of this research is to develop a heat transfer program for packaged IC by using the finite differencenumerical analysis method. The simulated IC is epoxy packaged with copper(Cu) and aluminum(Al) lead frame and 16,20,28 and 40 pins. Heat generated by the operation of IC is proved to be bring out by the lead frame. It is found that heat conductivity and pin numbers havepositive contribution to the power dissipation of the lead frame.-1 -aAnalysis of heat transfer for packaged IC