臺灣博碩士論文加值系統

手持式電子產品用之相機模組的生產朝向系統級封裝化(System in Package，SiP)發展，為了因應此種製程的需要，相機模組將隨著其它系統組件進入260 ℃以上的回流爐中進行回焊(Reflow)，但傳統的熱塑性塑膠鏡頭無法承受這樣的高溫，必須採用熱固性的塑膠材料。
本研究針對熱固性塑膠透鏡陣列板的成形製造進行技術開發，以丙烯酸系樹脂做為成品的原料，並探討成形過程中可能會產生的不良成形因素，且嘗試提出解決辦法。研究中使用熱壓成形法，來對此種較新型的硬化性透明塑膠進行成形。實驗過程中利用特殊設計之模具產生溫度由下往上降低的模溫，藉由模溫呈現上下梯度的狀態來控制熱固性塑膠的熟化進程。
研究結果顯示，為了避免材料在熟化進展過程產生破裂，並提升成形品的品質，可採用二段式升溫法。且當材料熟化完成後，應盡可能的減緩其冷卻速率，防止因材料無法承受劇烈的比容變化而破裂。
此外，成形過程中使用越大的熱壓壓力與保壓壓力，皆有助於提升試片上透鏡的尺寸精度，而保壓壓力的影響又較熱壓壓力更大。最後，若使用的成形溫度越高，其試片成品的透鏡體積收縮亦會相應產生些微減少。

The produce of handheld electronic products’ camera module focuses more and more on System in Package (SiP). In order to satisfy the requirement of SiP process, the camera module will enter a reflow oven in the temperature of 260 ℃ or higher along with other components for reflowing. However, conventional thermoplastic lens cannot resist such high temperature, that’s the reason why we need to develop the thermosetting plastic lens.
This study focuses on the development of thermosetting plastic lens array sheet, by using thermosetting acrylic resin as material. This study investigated the foreseeable problems during the molding process and propose solutions to them. In the study, hot embossing experiment was used for molding the new-type thermosetting transparent plastic. A specifically-designed mold develops mold temperature which goes down from bottom to the top, by which creating a vertical gradient to control the process of thermosetting plastic curing.
According to the result, in order to improve the quality and avoid them breaking when curing, we should rise the mold temperature in two stage, slowing down its cooling rate after curing. Consequently, it may prevent the materials from breaking for the dramatic change of specific volume.
It also proved that the effects of using greater embossing pressure and packing pressure is improving the dimensional accuracy of lens. The effects of packing pressure is more than embossing pressure. The experimental results indicated that if the molding temperature is higher, the lens’ volume shrinkage will be lesser.

目錄
摘要 I
Abstract III
致謝 V
目錄 VI
圖目錄 IX
表目錄 XII
第一章 緒論 1
1.1研究背景 1
1.2文獻回顧 2
1.3研究動機與目的 6
1.4研究方法 7
第二章 理論基礎 9
2.1透鏡陣列平板之功能 9
2.2高分子材料基本性質 10
2.2.1高分子材料分類 10
2.2.2高分子材料的熱學特性 11
2.2.3高分子材料的流變特性介紹 12
2.2.4熱固性高分子材料的交聯固化特性 15
2.2.5熱固性丙烯酸系樹脂的材料性質 18
2.3熱固性塑膠的熱壓成形基礎原理 21
第三章 熱固性光學塑膠成形實驗 23
3.1熱壓設備 23
3.2熱壓實驗流程 33
3.3半球透鏡收縮率量測 37
3.3.1透鏡陣列平板尺寸簡介 37
3.3.1半球透鏡收縮率與轉印率量測 38
3.3.2量測儀器介紹 39
第四章 實驗結果分析與討論 41
4.1熱固性光學塑膠的熟化實驗 41
4.1.1模溫對成形的影響 41
4.1.2冷卻對成形的影響 49
4.1.3合適之成形參數值 54
4.2透鏡直徑收縮率量測與討論 57
4.3透鏡高度轉印率量測與討論 64
第五章 結論與未來展望 71
5.1結論 71
5.2未來展望 73
參考文獻 74

參考文獻
[1] C. Hopmann and T. Fischer, "New plasticising process for increased precision and reduced residence times in injection moulding of micro parts," CIRP Journal of Manufacturing Science and Technology, vol. 9, pp. 51-56, 2015.

[2] Serope Kalpakjian and Steven R.Schmid, "Manufacturing engineering and technology, " Prentice Hall, Singapore, 2010.

[3] 謝俊雄, 塑膠工程學, 文京圖書有限公司, 台灣, 1976.

[4] C. Y. Khor, M. Z. Abdullah, Z. M. Ariff, and W. C. Leong, "Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package," International Communications in Heat and Mass Transfer, vol. 39, no. 5, pp. 670-680, 2012.

[5] A. Harkous, G. Colomines, E. Leroy, P. Mousseau, and R. Deterre, "The kinetic behavior of Liquid Silicone Rubber: A comparison between thermal and rheological approaches based on gel point determination," Reactive and Functional Polymers, vol. 101, pp. 20-27, 2016.

[6] L. Meunier, G. Chagnon, D. Favier, L. Orgéas, and P. Vacher, "Mechanical experimental characterisation and numerical modelling of an unfilled silicone rubber," Polymer Testing, vol. 27, no. 6, pp. 765-777, 2008.

[7] C. C. Kuo and Y. R. Chen, "Rapid optical inspection of bubbles in the silicone rubber," Optik - International Journal for Light and Electron Optics, vol. 124, no. 13, pp. 1480-1485, 2013.

[8] N. S. Ong, Y. H. Koh, and Y. Q. Fu, "Microlens array produced using hot embossing process, " Microelectronic Engineering, vol. 60, no. 3, pp.365-379, 2002.

[9] M. Packianather, C. Griffiths, and W. Kadir, "Micro Injection Moulding Process Parameter Tuning," Procedia CIRP, vol. 33, pp. 400-405, 2015.

[10] M. Sahli, C. Millot, C. Roques-Carmes, C. Khan Malek, and J. C. Gelin, "On the use of hot embossing for the reproduction of the surface topography of mould microreliefs," pp. 293-296, 2006.

[11] D. R. Gunasegaram, I. M. Bidhendi, N.J. McCaffrey, "Modelling the casting process of plastic ophthalmic lenses, " International Journal of Machine Tools and Manufacture, 40, 5, pp. 623-639 , 2000.

[12] H. D. Rowland and W. P. King, "Polymer deformation and filling modes during microembossing," Journal of Micromechanics and Microengineering, vol. 14, no. 12, pp. 1625-1632, 2004.
[13] S. J. Hwang, and Y. S. Chang, "P-V-T-C Equation for Epoxy Molding Compound, " IEEE Transactions on Components and Packaging Technologies, 29, pp. 112-117, 2006.

[14] 劉士榮, 高分子流變學, 滄海書局, 台灣, 2010.

[15] J. Tamil, S.H. Ore, K.Y. Gan, Y.Y. Bo, G. Ng, P.T. Wah, et al.,
"Molding flow modeling and experimental study on void control for flip chip package panel molding with molded underfill technology,"
J Microelectron Electron Packaging, 9, pp. 19-30, 2012.

[16] K. M. B. Jansen et al., "Modeling and characterization of molding compound properties during cure," Microelectronics Reliability, vol. 49, no. 8, pp. 872-876, 2009.

[17] S. J. Hwang and Y. S. Chang, "Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state," Journal of Polymer Science Part B: Polymer Physics, vol. 43, no. 17, pp. 2392-2398, 2005.

[18] 林威宇, " 動態壓力控制對微結構熱壓特性的影響暨加工過程中聚丙烯的結晶特性的初步探討, " 碩士論文, 國立交通大學, 台灣, 2003.

[19] 林上評, " 創新型LED全晶圓含透鏡封裝製程及微結構複合透鏡模具製作探討, " 碩士論文, 國立台灣大學, 台灣, 2014.

[20] 洪欣治, " 陣列式鏡頭影像品質提升之探討, " 碩士論文, 國立中山大學, 台灣, 2015.

[21] 盧冠霈, " 熱固性塑膠透鏡平板成型過程數值模擬分析, "碩士論文,國立交通大學, 台灣,2017