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研究生:張祐維
研究生(外文):CHANG,YU-WEI
論文名稱:二維轉換到三維的軟硬體共同設計
論文名稱(外文):Hardware/Software Co-Design of Reconfigurable Architecture for 2D-to-3D Conversion
指導教授:高啟洲高啟洲引用關係
指導教授(外文):Chi-Chou Kao
口試委員:劉茂陽李明錡
口試委員(外文):Liu Maw-YangLee Ming-Chi
口試日期:2019-07-16
學位類別:碩士
校院名稱:國立臺南大學
系所名稱:資訊工程學系碩士班
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2019
畢業學年度:107
語文別:中文
論文頁數:40
中文關鍵詞:二維轉三維軟硬體共同設計
外文關鍵詞:2D-to-3D
相關次數:
  • 被引用被引用:0
  • 點閱點閱:212
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  • 下載下載:11
  • 收藏至我的研究室書目清單書目收藏:0
3D立體影像讓人感到驚艷,但要使用多攝影鏡頭做攝影的成本非常昂貴,因此有2D轉3D的技術出現,軟體在做圖像處理上是較硬體優異的,不過倘若軟體資源不足時而造成轉換排程過多,屆時就須要透過硬體來輔助,在電腦科學設計早期就將軟硬體分離各別設計,在最後階段才將軟硬體整合。市面上已有不少軟硬體共同設計(Hardware/Software Co-Design)的實作,也有不少良好的圖像邊緣檢測及計算深度的方式,為了加速2D轉3D的效率,在此提出一種可重置架構的軟硬體共同設計來研究出更有效率的圖像轉換。並在2D轉換為3D的系統中採用Depth Image Based Rendering(DIBR)利用原始2D的影像以及深度資訊來產生兩個視角或是多個視角的虛擬影像進行3D的影像合成,本文使用Xilinx Spartan 7做為軟硬體共同平台設計的硬體設備。
3D images are amazing, but the cost of using multiple photographic lenses for photography is very expensive. Therefore, there is a 2D-to-3D technology, and the software is superior in image processing, but if the software resources are insufficient due to lots of conversion schedules.At that time, it is necessary to assist with hardware. In the early stage of computer science design, software and hardware are separated, and they are integrated in the final stage.We can see lots of implementations of hardware/software Co-Design is already applied to business, and there are also many good methods for image edge detection and depth calculation. In order to accelerate the efficiency of 2D-to-3D, we proposed a hardware/software co-design of reconfigurable architecture for 2D-to-3D conversion that make more efficient for 2D-to-3D . Depth Image Based Rendering (DIBR) is used in 2D to 3D system to generate 3D image synthesis using original 2D images and depth information to generate 3D or multiple perspective virtual images. In this paper, We uses Xilinx Spartan 7 to do as a hardware device for a platform of hardware/software co-design.
目次
第一章 緒論 1
1.1 研究背景 1
1.2 研究目標 3
1.3 論文架構 4
第二章 相關研究 5
2.1 2D-to-3D 5
2.1.1 基於DIBR的2D-to-3D 6
2.1.2 眼鏡式立體顯示技術的差異介紹 7
2.2 深度估計算法 9
2.2.1 基於邊緣的演算 10
2.2.2 Sobel邊緣檢測 11
2.2.3基於邊緣顏色的演算 12
2.2.4邊緣檢測圖像灰度 14
2.3 DIBR 15
2.3.1 視差、移位和洞孔填充 16
2.3.2視差值(disparity) 17
2.4 軟硬體共同設計(Hardware/Software Co-design) 18
2.4.1軟硬體共同設計流程 20
第三章 研究架構 22
3.1 以軟硬體共同平台設計執行2D轉3D 22
3.2 系統架構 23
3.2.1 DIBR系統硬體架構 24
3.2.2深度估測硬體模組架構 27
3.3 平台設計方法 29
第四章 實驗結果 32
4.1 圖像轉換資料 32
4.2 使用工具 34
4.3 軟硬體轉換耗時 35
第五章 結論與未來展望 38
第六章 相關文獻 39


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