臺灣博碩士論文加值系統

隨著科技日新月異，各類型的通訊設施、電子設備以及電子產品大量的被人們所使用，而這些電子產品則會產生電磁波進而影響電子元件以及人體健康，故需要一種能消除或是減少電磁波的遮蔽材料。本論文主要研究如何製作出具有良好電磁屏蔽能力之導電性接著劑，探討在矽氧樹脂中添加不同形狀及比例的金屬粒子對於其電性及電磁屏蔽的影響。而傳統類型的遮蔽材料多為純金屬，但金屬類材料多為笨重、加工困難、結合性差，因此複合型遮蔽材料從而產生，而導電膠就是良好的複合型遮蔽材料。此研究中，分別以三種不同矽氧樹脂與金屬粉末結合，以不同的膠體添加不同比例的金屬粉末進行研究，其中在矽氧樹脂種添加微米級銀銅粉/銀銅片/銀線/鋁粉，並透過界面活性劑、溶劑、矽烷偶連劑等進行調配，以便尋找最適合的配方。實驗結果顯示了金屬粒子須達到70wt%含量，並在縮和型矽氧樹脂中加入乙醇與乙二醇溶劑，才能使得金屬粒子在膠體內形成良好的導電通路，而最後使用加壓抽氣過濾的方式排出多餘的溶劑製作出具有商用型屏蔽能力的導電膠，其電阻值為24.8Ω，在0.01~20 GHz其EMI屏蔽能力為-70~-90dB之間。

This paper mainly studies how to make self-made conductive adhesive with good electromagnetic shielding ability. With the rapid development of technology, various types of communication facilities, electronic devices, and electronic products are widely used, and these electronic products generate electromagnetic waves that affect electronic components and human health. Therefore, there is a need for a mask that can eliminate or reduce electromagnetic waves. Materials, while the traditional types of masking materials are mostly pure metals, but metal materials are mostly bulky, difficult to process, and poorly bonded, so composite masking materials are produced, and conductive adhesives are good composite masking materials. In this study, three different epoxy resins were combined with metal powders, and different proportions of metal powders were added with different colloids. Among them, sliver micron-sized powder/sheet/wire and aluminum powder was added to the silicone resin. Powder, and blended with surfactants, solvents, decane coupling agents, etc., in order to find the most suitable formula. The experimental results show that the metal particles must reach 70wt% content, and the appropriate solvent is added to make the metal particles form a good conductive path in the gel body. Finally, the excess solvent is discharged by means of pressurized air filtration to produce a commercial type. The conductive adhesive of shielding ability has a resistance value is 24.8 Ω and an EMI shielding capability is -70 to -90 dB within 0.01~20 GHz.

誌謝 I
摘要 II
Abstract III
目錄 IV
圖目錄 VI
表目錄 VIII
第1章 緒論 1
1.1 前言 1
1.2 研究目的與動機 2
第2章 文獻回顧與原理 4
2.1 導電性接著劑 4
2.2 矽氧樹脂 5
2.2.1矽氧樹脂性質 5
2.3 導電性接著劑導電原理 6
2.4 電磁波 7
2.4.1集膚效應 13
2.4.2傳輸線理論 14
2.5 S-參數 19
2.6 何謂電磁干擾與電磁相容性 22
2.6.1 電磁干擾及電磁相容性 22
2.6.2 電磁干擾防治 23
第3章 實驗方法 26
3.1 實驗方法 26
3.2 實驗儀器與材料 26
3.3 實驗步驟 28
3.3.1銀線自備 28
3.3.2導電銀膠製程 29
3.3.3實驗分析與儀器原理 31
第4章 結果與討論 34
4.1 A系列導電性接著劑 36
4.2 B系列導電性接著劑 38
4.3 C系列導電性接著劑 42
4.3.1銀銅顆粒與銀銅片導電性接著劑的透射係數 48
4.3.2銀銅顆粒與微米銀線導電性接著劑的透射係數 49
4.3.3鋁顆粒與銀銅片導電性接著劑的透射係數 49
4.3.4 C1在0.1~40GHz下的透射係數 50
第5章 結論與未來展望 52
5.1結論 52
5.2未來展望 52
第6章 參考文獻 54

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