臺灣博碩士論文加值系統

隨著半導體製程逐漸細小化，封裝測試的難度也隨之提高，針測探針材料的導電性以及硬度的需求不斷增加，近年來鈀合金已逐漸用於測試產業，如何提升鈀合金的硬度已成為重要的議題。本實驗以鈀、銀與銅粉，以重量百分比4：3：3的比例球磨混合，經由真空熱壓燒結，再以750℃、950℃以及1100℃進行固溶熱處理，以及150℃、250℃與350℃時效熱處理，討論不同溫度淬火後再進行時效熱處理後對顯微組織、硬度的影響。結果顯示750℃、950℃固溶熱處理後，試片的顯微組織形貌可觀察到兩個相，包含一個連續相與顆粒狀的不連續相，連續相是富銀相，顆粒狀不連續相是富銅相。1100℃固溶熱處理後，顯微組織形貌呈現單一相。1100℃淬火後再進行350℃時效熱處理可使鈀銀銅合金的硬度值提升至356 Hv。以X-ray繞射分析，1100℃淬火後鈀銀銅合金的晶格常數3.87 Å，最終再敲擊試片進行應變硬化，使厚度壓縮至原始試片90%、80%與70%，可使平均硬度值分別上升至371、394與462 Hv。

Semiconductor process tends to minimize in size, therefore the testing and packaging technology has become even more difficult. The properties of testing probes need to focused on electrical conductivity and hardness. Palladium alloy has been used for electrical tests and connecters recently, In this research, we combine palladium (40 wt.%), silver (30 wt.%), and copper (30 wt.%) to form powder mixture for hot pressing at 880℃. Solution treatment was performed at 750℃, 950℃ and 1100℃ respectively and then quenched to room temperature before carrying out an aging-treatment at 350℃ for 1 hr. The experimental result shows that two phases including a matrix phases and a particle phase are present, after solution treatments at both of 750℃ and 950℃. The matrix phases is Ag-rich and the particle phase is Cu-rich. After 1100℃ solid solution heat treatment, the micro structure morphology transfers to one single phase, and therefore the procedure leads hardness of Pd-Ag-Cu alloy increase to 356 Hv and results an eutectic structure. The XRD analysis indicates that the lattice constant of Pd-Ag-Cu alloy become 3.87 Å. Finally, the specimen of Pd-Ag-Cu alloy was forged for strain hardening, and the thickness was reduced to 90%, 80% and 70% of original specimen size, and the micro-hardness of specimen further increased to 370.6, 394.3 and 462.0 Hv.

摘 要 i
ABSTRACT ii
致謝 iv
目錄 v
表目錄 vii
圖目錄 viii
第一章 緒論 1
1.1前言 1
1.2實驗動機與目的 2
第二章 文獻回顧 4
2.1鈀銀銅合金材料的應用與合成 4
2.1.1鈀銀銅合金的應用 4
2.1.2 鈀銀銅合金材料的合成 5
2.2鈀銀銅合金相圖 9
2.3粉末冶金與熱壓燒結原理 15
2.3.1粉末冶金 15
2.3.2熱壓燒結原理 17
2.4析出硬化 18
2.5應變硬化 20
2.6 X-RAY繞射簡介與原理 20
2.6.1 X-ray的產生 21
2.6.2 X-ray繞射 21
2.6.3 固溶合金的X-ray分析 23
第三章 實驗步驟與原理 29
3.1實驗材料 29
3.1.1粉體 29
3.1.2模具設計 30
3.2實驗規劃與流程 31
3.2.1實驗流程 31
3.2.2原料混合比例與製程參數 32
3.2.3試片加工與後續熱處理流程 32
3.3實驗設備及原理 33
3.3.1行星式球磨機 33
3.3.2真空熱壓爐 33
3.3.3光學顯微鏡 34
3.3.4掃描式電子顯微鏡 35
3.3.5 X-ray繞射分析儀 35
3.3.6維氏硬度量測儀 36
3.3.7密度量測儀 37
第四章 結果與討論 38
4.1粉體觀察 38
4.2熱壓燒結顯微組織 41
4.3固溶化溫度對顯微組織的影響 42
4.3.1固溶化熱處理試片之顯微組織分析 42
4.3.2固溶化溫度對硬度的影響 55
4.4時效熱處理溫度對顯微組織的影響 56
4.4.1 時效熱處理試片之顯微組織分析 56
4.4.2時效熱處理試片之硬度分析 65
4.5鍛造對硬度的影響 66
第五章 結論 67
參考文獻 69

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